# US 10,319,687 B1 · Soluble sensor node and method of manufacture

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- Number: US 10,319,687 B1
- Document ID: US10319687B1
- Status: Granted
- Kind: B1
- Application number: 15/918,383
- Filed: 2018-03-12
- Granted: 2019-06-11
- Earliest claimed: 2018-03-12
- Assignees: Honeywell International Inc.
- Applicants: Honeywell International Inc.
- Inventors: Steven Tin
- Web page: https://patentgrep.com/patent/US10319687B1

## CPC

- H10W 42/00: Arrangements for protection of devices (arrangements for thermal protection H10W40/00)
- G01D 11/245: {Housings for sensors}
- H10F 71/139: {using temporary substrates}
- H10F 77/169: Thin semiconductor films on metallic or insulating substrates
- H10W 20/056: {by filling conductive material into holes, grooves or trenches}
- H10W 20/0698: {Local interconnections}
- H10W 20/081: {by forming openings in the dielectric parts}
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 70/685: comprising multiple insulating layers
- H10W 74/01: Manufacture or treatment
- H10W 74/121: {by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation}
- H10W 74/137: {the encapsulations being directly on the semiconductor body (H10W74/134 takes precedence)}
- H10W 90/00: Package configurations
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- G01D: MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION

## Abstract

A soluble sensor is provided. The soluble sensor includes a soluble handle substrate and a layer of semiconductor material that is disposed on the soluble handle substrate. The layer of semiconductor material includes a plurality of semiconductor devices interconnected to perform a sensing function.

## Claims

### Claim 1

A soluble sensor, comprising:
a soluble handle substrate; and
a layer of semiconductor material disposed on the soluble handle substrate, the layer of semiconductor material including a plurality of semiconductor devices interconnected to perform a sensing function.

### Claim 2 (depends on 1)

The soluble sensor of claim 1, wherein the layer of semiconductor material comprises a layer of semiconductor material with a thickness of less than 10 micrometers.

### Claim 3 (depends on 1)

The soluble sensor of claim 1, wherein the soluble handle substrate comprises a substrate formed of one of polyvinyl acetate, gelatin, or a polysaccharide.

### Claim 4 (depends on 1)

The soluble sensor of claim 1, and further including a water barrier coating over an exterior surface of the sensor.

### Claim 5 (depends on 4)

The soluble sensor of claim 4, wherein the water barrier coating has a thickness that is selected to wear off after a period of time within a selected range.

### Claim 6 (depends on 4)

The soluble sensor of claim 4, and further including circuitry that triggers breaking of the water barrier.

### Claim 7

A sensor node, comprising:
one or more sensors;
at least one interconnection board;
a power source; and
packaging to enclose the one or more sensors, the at least one interconnection board and the at least one power source; and
wherein the one or more sensors, the at least one interconnection board, the power source and the packaging each include one or more soluble materials.

### Claim 8 (depends on 7)

The sensor node of claim 7, wherein the interconnect board comprises metal lines formed on a soluble substrate.

### Claim 9 (depends on 8)

The sensor node of claim 8, wherein the interconnect board comprises a multilayer board having a plurality of layers, wherein each layer includes a soluble material with at least one metal line formed on a surface of the soluble material, and wherein the layers of soluble material are bonded together in a stack.

### Claim 10 (depends on 7)

The sensor node of claim 7, wherein the power source includes a thin film solar cell formed on a soluble handle substrate.

### Claim 11 (depends on 7)

The sensor node of claim 7, wherein the power source includes an energy harvester having a piezoelectric film with a thickness of less than 10 micrometers formed on a soluble substrate.

### Claim 12 (depends on 7)

The sensor node of claim 7, wherein each of the one or more sensors comprises a layer of semiconductor material with a thickness of less than 10 micrometers, and a soluble handle substrate formed of one of polyvinyl acetate, gelatin, or a polysaccharide.

### Claim 13 (depends on 7)

The sensor node of claim 7, and further including a water barrier coating over an exterior surface of the packaging.

### Claim 14 (depends on 13)

The sensor node of claim 13, wherein the water barrier coating has a thickness that is selected to wear off after a period of time within a selected range.

### Claim 15 (depends on 13)

The sensor node of claim 13, and further including circuitry that triggers breaking of the water barrier.