# US 10,319,685 B2 · EMI shielded integrated circuit packages and methods of making the same

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- Number: US 10,319,685 B2
- Document ID: US10319685B2
- Status: Granted
- Kind: B2
- Application number: 15/750,986
- Filed: 2017-02-15
- Published: 2018-08-23
- Granted: 2019-06-11
- Earliest claimed: 2016-02-15
- Assignees: Transsip, Inc.
- Applicants: TransSiP, Inc.; Lexiwave Technology (Hong Kong) Limited
- Inventors: Chih Wei Wong; Henry Lau
- Web page: https://patentgrep.com/patent/US10319685B2

## CPC

- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H05K 1/144: {Stacked arrangements of planar printed circuit boards}
- H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/635: {Through-vias}
- H10W 74/01: Manufacture or treatment
- H10W 90/00: Package configurations
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

An integrated circuit package with a plurality of embedded electromagnetic interference (EMI) shielding and methods of making the same are disclosed. The integrated circuit packages include the use of a pre-assembled circuit module and an interposer. The circuit module has a plurality of spaced electrical component sections separated by a series of contiguous conductive spacers, and a first shielding means comprises the spacers, vias and an embedded conductive plane. In an example, the interposer has a second shielding means comprises conductive cavities, conductive ridges, vias, and a conduction pattern. In another example, the interposer further comprises conductive strips to form the second shielding means. The first shielding means overlaps the second shielding means to form a plurality of EMI shielded enclosures for holding the spaced electrical component sections therein.

## Claims

### Claim 1

An electromagnetic interference shielded integrated circuit package, comprising:
a circuit module having first and second opposing surfaces;
a series of contiguous conductive spacers disposed on at least one of said surfaces;
a conductive plane sandwiched between said surfaces;
a plurality of spaced electrical component sections being separated by said conductive spacers;
first shielding means disposed beneath and adjacent to said respective spaced electrical component sections;
an interposer having a plurality of conductive cavities on a recessed top surface;
a conduction pattern disposed on a bottom opposing surface of said interposer;
a series of contiguous conductive ridges positioned in between each adjacent said cavities;
second shielding means disposed on at least one of the interior surfaces of said conductive cavities and adjacent said respective conductive cavities;
wherein said circuit module is mounted over said interposer,
said spaced electrical component sections are disposed inside a space of said respective conductive cavities,
said conductive plane is electrically coupled to said conductive spacers,
said conductive spacers, from a top-down perspective, overlaps and are electrically coupled to said respective conductive ridges so that said first shielding means is disposed over and electrically coupled to said respective second shielding means and thereby forms a plurality of closed electromagnetic interference shielded enclosures for holding said respective spaced electrical component sections therein, and
wherein said electromagnetic interference shielded enclosures are electrically coupled to said conduction pattern which is electrically coupled to a ground potential of a system;
whereby said circuit module can be assembled and individually tested before being mounted over said interposer, and thereby said electromagnetic interference shielded integrated circuit package further enables simplified manufacturing and assembly process by eliminating multiple bulky shield can installations, as well as simplifies inspection and functional testing so as to enable compact and thinner system in package design for a complex electronics system.

### Claim 2 (depends on 1)

The electromagnetic interference shielded integrated circuit package of claim 1 wherein said circuit module further comprising a plurality of first conduction paths along the outer perimeter of said circuit module, and wherein said interposer further comprising a plurality of second conduction paths along the outer perimeter of said interposer; and said first conduction paths are aligned and electrically connected to said respective second conduction paths.

### Claim 3 (depends on 1)

The electromagnetic interference shielded integrated circuit package of claim 1 wherein said first shielding means comprises said conductive spacers, said conductive plane, and further comprises a plurality of conductive vias; wherein said conductive vias interconnect said conductive spacers and said conductive plane.

### Claim 4 (depends on 3)

The electromagnetic interference shielded integrated circuit package of claim 3 wherein each of said vias are spaced a distance of equal or less than one tenth of a free space wavelength of at least one operating frequency band of said circuit module apart; so that a first vertical electromagnetic interference shielding plane is formed by said vias and being positioned perpendicularly between said respective conductive spacers and said conductive plane.

### Claim 5 (depends on 1)

The electromagnetic interference shielded integrated circuit package of claim 1 wherein said second shielding means comprises a conductive material disposed on at least one interior surface of said conductive cavities or an inlay of conductive material disposed along the bottom surfaces of said conductive cavities; a first series of conductive vias interconnected said conductive interior surface of said conductive cavities or said inlay of conductive material thereof and said conduction pattern; and a second series of conductive vias interconnected said conductive ridges and said conduction pattern.

### Claim 6 (depends on 5)

The electromagnetic interference shielded integrated circuit package of claim 5 wherein each of said second series of conductive vias are spaced a distance of equal or less than one tenth of a free space wavelength apart of at least one operating frequency band of said circuit module apart; so that a second vertical electromagnetic interference shielding plane is formed by said second series of vias and positioned perpendicularly between said conductive ridges and said conduction pattern.

### Claim 7 (depends on 5)

The electromagnetic interference shielded integrated circuit package of claim 5 wherein said second shielding means further comprising a solid slug sandwiched between said conductive cavities and said conduction pattern so as to enable a low impedance thermal pathway thereof, wherein said solid slug electrically connects said conductive cavities and said conduction pattern, and wherein said solid slug is made with a material comprising copper.

### Claim 8 (depends on 5)

The electromagnetic interference shielded integrated circuit package of claim 5 wherein said second shielding means further comprising a series of conductive strips positioned between the outer perimeter of said conductive cavities and the edges of said interposer on said recessed top surface, and a third series of conductive vias electrically coupled said conductive strips to said conductive cavities; wherein said conductive strips are electrically coupled to said respective conductive spacers on said recessed top surface.

### Claim 9 (depends on 1)

The electromagnetic interference shielded integrated circuit package of claim 1 further comprising encapsulation means disposed above said interposer and said circuit module for providing environmental or hermetic sealing thereof.

### Claim 10 (depends on 9)

The electromagnetic interference shielded integrated circuit package of claim 9 wherein said encapsulation means is a cover being disposed over said interposer and said circuit module.

### Claim 11 (depends on 9)

The electromagnetic interference shielded integrated circuit package of claim 9 wherein said encapsulation means comprising a containment ring or standoff perimeter disposed over the edges of said interposer and thereby surrounded said circuit module, and a cover disposed over said containment ring or standoff perimeter.

### Claim 12 (depends on 9)

The electromagnetic interference shielded integrated circuit package of claim 9 wherein said encapsulation means comprising a containment ring or standoff perimeter disposed over the edges of said interposer and thereby surrounded said circuit module, and a coplanar chamber is formed thereto; and wherein, from a top perspective, said circuit module being disposed inside said chamber, and an encapsulant disposed inside said chamber.

### Claim 13 (depends on 12)

The electromagnetic interference shielded integrated circuit package of claim 12 wherein said encapsulation means further comprising a cover disposed over said containment ring or standoff perimeter.

### Claim 14 (depends on 1)

The electromagnetic interference shielded integrated circuit package of claim 1 further comprising a conductive containment ring or conductive standoff perimeter disposed over the outer edges of said interposer and thereby surrounded said circuit module, wherein said conductive containment ring or conductive standoff perimeter electrically coupled to a common potential member selected from the group consisting of said conductive cavities, said conductive spacers, said conductive ridges, said conductive plane, said conduction pattern, said first shielding means and said second shielding means.

### Claim 15

A method of manufacturing an electromagnetic interference shielded integrated circuit package, comprising:
providing a circuit module having first and second opposing surfaces;
providing a series of contiguous conductive spacers being disposed on at least one of said surfaces;
providing a plurality of spaced electrical component sections being separated by said conductive spacers;
providing first shielding means being disposed beneath and adjacent to said respective spaced electrical component sections;
providing an interposer having a plurality of conductive cavities on a recessed top surface;
providing a series of contiguous conductive ridges being positioned in between each adjacent said cavities;
providing second shielding means disposed on at least one of the interior surfaces of said conductive cavities and adjacent said respective conductive cavities;
mounting said circuit module over said interposer, so that said spaced electrical component sections are disposed inside a space of said respective conductive cavities,
forming a plurality of closed electromagnetic interference shielded enclosures for holding said respective spaced electrical component sections therein by overlapping said conductive spacers, from a top-down perspective, to said respective conductive ridges so that said first shielding means is electrically coupled to said second shielding means; and
forming an encapsulation over said interposer and said circuit module;
whereby said circuit module can be assembled and individually tested before being disposed and bonded above said interposer, and said electromagnetic interference shielded integrated circuit package further enables simplified inspection as well as functional testing and eliminates the need of multiple bulky shield cans so as to enable compact and thinner system in package design for a complex electronics system.