# US 10,319,683 B2 · Multi-stacked package-on-package structures

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- Number: US 10,319,683 B2
- Document ID: US10319683B2
- Status: Granted
- Kind: B2
- Application number: 15/640,882
- Filed: 2017-07-03
- Published: 2018-08-09
- Granted: 2019-06-11
- Earliest claimed: 2017-02-08
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Company, Ltd.
- Inventors: Chen-Hua Yu; An-Jhih Su; Chi-Hsi Wu; Der-Chyang Yeh; Ming Shih Yeh; Wei-Cheng Wu
- Web page: https://patentgrep.com/patent/US10319683B2

## CPC

- H10W 70/614: {the multiple chips being integrally enclosed}
- H10P 72/74: {using temporarily an auxiliary support}
- H10P 72/7448: {the bond interface between the auxiliary support and the wafer comprising two or more, e.g. multilayer adhesive or adhesive and release layer}
- H10P 95/062: {involving a dielectric removal step}
- H10W 20/081: {by forming openings in the dielectric parts}
- H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 70/611: {for connecting multiple chips together}
- H10W 74/01: Manufacture or treatment
- H10W 74/014: {using batch processing}
- H10W 74/016: {using moulds}
- H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)}
- H10W 90/00: Package configurations
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H10P 72/7412: {the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support}
- H10P 72/743: {used as a support during manufacture of interconnect decals or build up layers}
- H10P 72/7436: {used to support a device or a wafer when forming electrical connections thereto}
- H10P 72/744: {Details of chemical or physical process used for separating the auxiliary support from a device or a wafer}
- H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers}
- H10W 70/685: comprising multiple insulating layers
- H10W 72/072: {of bump connectors}
- H10W 72/07207: {Temporary substrates, e.g. removable substrates}
- H10W 72/07236: {Soldering or alloying}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07307: {the auxiliary member being a temporary substrate, e.g. a removable substrate}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/29: Bond pads specially adapted therefor
- H10W 72/874: {On different surfaces}
- H10W 72/926: {Multiple bond pads having different sizes}
- H10W 72/9413: {on encapsulations}
- H10W 72/944: {Dispositions of multiple bond pads}
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10W 74/142: {the encapsulations exposing the passive side of the semiconductor body}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/10: Configurations of laterally-adjacent chips
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 90/722: {between stacked chips}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/728: {between a chip and a stacked discrete passive device, e.g. resistors, capacitors or inductors}
- H10W 90/732: {between stacked chips}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A multi-stacked package-on-package structure includes a method. The method includes: adhering a first die and a plurality of second dies to a substrate, the first die having a different function from each of the plurality of second dies; attaching a passive device over the first die; encapsulating the first die, the plurality of second dies, and the passive device; and forming a first redistribution structure over the passive device, the first die, and the plurality of second dies, the passive device connecting the first die to the first redistribution structure.

## Claims

### Claim 1

A method comprising:
adhering a first die and a plurality of second dies to a substrate, the first die having a different function from each of the plurality of second dies;
attaching a passive device over the first die;
encapsulating the first die, the plurality of second dies, and the passive device; and
forming a first redistribution structure over the passive device, the first die, and the plurality of second dies, the passive device electrically connecting the first die to a redistribution line in the first redistribution structure.

### Claim 2 (depends on 1)

The method of claim 1, wherein the attaching the passive device comprises:
forming a second redistribution structure over the first die and the plurality of second dies; and
attaching the passive device to the second redistribution structure with conductive connections.

### Claim 3 (depends on 2)

The method of claim 2, wherein the first redistribution structure is disposed over the passive device and the second redistribution structure.

### Claim 4 (depends on 2)

The method of claim 2, wherein encapsulating the first die, the plurality of second dies, and the passive device comprises:
encapsulating the first die and the plurality of second dies with a first encapsulant; and
encapsulating the passive device with a second encapsulant different from the first encapsulant.

### Claim 5 (depends on 4)

The method of claim 4, further comprising:
forming through vias extending through the second encapsulant, the through vias extending from the second redistribution structure to the first redistribution structure.

### Claim 6 (depends on 4)

The method of claim 4, further comprising:
planarizing the first encapsulant such that top surfaces of the first encapsulant, the first die, and the plurality of second dies are level; and
planarizing the second encapsulant such that top surfaces of the second encapsulant and the passive device are level.

### Claim 7 (depends on 1)

The method of claim 1, wherein the attaching the passive device comprises:
attaching the passive device to die connectors of the first die with conductive connections.

### Claim 8 (depends on 7)

The method of claim 7, wherein the forming the first redistribution structure comprises:
forming the first redistribution structure over the passive device and the plurality of second dies.

### Claim 9 (depends on 7)

The method of claim 7, wherein the encapsulating comprises:
encapsulating the first die, the plurality of second dies, and the passive device with a first encapsulant.

### Claim 10 (depends on 9)

The method of claim 9, further comprising:
planarizing the first encapsulant such that top surfaces of the first encapsulant, the plurality of second dies, and the passive device are level.

### Claim 11 (depends on 1)

The method of claim 1, further comprising:
debonding the first die and the plurality of second dies from the substrate; and
attaching the first redistribution structure to a carrier substrate.

### Claim 12

A method comprising:
adhering a plurality of first dies to a substrate;
encapsulating the plurality of first dies with a first encapsulant;
forming a first redistribution structure over the first encapsulant, the first redistribution structure electrically connected to the plurality of first dies;
forming through vias in electrical connection with the first redistribution structure;
attaching a passive device to the first redistribution structure with conductive connections, the passive device surrounded by the through vias; and
forming a second redistribution structure over the passive device, the second redistribution structure electrically connected to the through vias and the passive device.

### Claim 13 (depends on 12)

The method of claim 12, wherein the passive device is free of active regions.

### Claim 14 (depends on 12)

The method of claim 12, further comprising:
encapsulating the passive device and the through vias with a second encapsulant; and
planarizing the second encapsulant such that top surfaces of the second encapsulant, the through vias, and the passive device are level.

### Claim 15 (depends on 14)

The method of claim 14, wherein encapsulating the passive device comprises:
filling the second encapsulant between the passive device and the first redistribution structure.

### Claim 16 (depends on 12)

The method of claim 12, further comprising:
filling a molding compound between the passive device and the first redistribution structure.

### Claim 17

A method comprising:
adhering a first die and a plurality of second dies to a substrate;
attaching a passive device to die connectors of the first die with conductive connections;
encapsulating the passive device, the first die, and the plurality of second dies with an encapsulant;
planarizing the encapsulant such that top surfaces of the encapsulant, the passive device, and the plurality of second dies are level; and
forming a redistribution structure over the encapsulant, a redistribution line in the redistribution structure being electrically connected to the first die through the passive device.

### Claim 18 (depends on 17)

The method of claim 17, wherein the passive device comprises through vias electrically connecting the first die to the redistribution line.

### Claim 19 (depends on 17)

The method of claim 17, wherein the encapsulating comprises:
filling the encapsulant between the passive device and the first die.

### Claim 20 (depends on 17)

The method of claim 17, further comprising:
filling a molding compound between the passive device and the first die.