# US 10,319,682 B2 · Electronic component device, method of mounting electronic component device on circuit board, and mounting structure of electronic component device on circuit board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,319,682 B2 - Document ID: US10319682B2 - Status: Granted - Kind: B2 - Application number: 15/613,327 - Filed: 2017-06-05 - Published: 2018-01-04 - Granted: 2019-06-11 - Earliest claimed: 2016-06-29 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Kazushi Watanabe - Web page: https://patentgrep.com/patent/US10319682B2 ## CPC - H10W 70/614: {the multiple chips being integrally enclosed} - H05K 1/184: associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes - H05K 3/301: {by means of a mounting structure (H05K3/325 takes precedence)} - H05K 3/3405: {Edge mounted components, e.g. terminals} - H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components} - H05K 3/3447: Lead-in-hole components - H05K 7/1053: {having interior leads} - H10W 20/49: Adaptable interconnections, e.g. fuses or antifuses - H10W 74/111: {the semiconductor body being completely enclosed} - H10W 74/114: {by a substrate and the encapsulations} - H03H 9/059: {consisting of mounting pads or bumps} - H03H 9/1085: {the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the SAW device} - H05K 1/141: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)} - H05K 2201/09827: Tapered, e.g. tapered hole, via or groove - H05K 2201/10378: Interposers - H05K 2201/10734: Ball grid array [BGA]; Bump grid array - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/10: characterised by their shape or disposition - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract An electronic component device includes a mount substrate including an outer electrode on one principal surface and a mount electrode on another principal surface, at least one substrate component including a terminal electrode on one principal surface, and that is mounted on the mount substrate by joining the terminal electrode to the mount electrode, and a sealing resin layer that is provided on the mount substrate on which the at least one substrate component is mounted. The sealing resin layer includes a region with a large thickness, and a top surface including an inclination. ## Claims ### Claim 1 An electronic component device comprising: a mount substrate including an outer electrode on one principal surface and a mount electrode on another principal surface; at least one substrate component including a terminal electrode on one principal surface, and that is mounted on the mount substrate by the terminal electrode being joined to the mount electrode; and a sealing resin layer that is provided on the mount substrate on which the at least one substrate component is mounted; wherein the sealing resin layer includes an increased thickness region, and a top surface including an inclination; and when viewed in a planar direction: the mount substrate includes a region with a reduced formation density of the outer electrode; and the region of the sealing resin layer with the increased thickness and the region of the mount substrate with the reduced formation density of the outer electrode overlap each other. ### Claim 2 An electronic component device comprising: a mount substrate including an outer electrode on one principal surface and a mount electrode on another principal surface; at least one substrate component including a terminal electrode on one principal surface, and that is mounted on the mount substrate by the terminal electrode being joined to the mount electrode; and a sealing resin layer that is provided on the mount substrate on which the at least one substrate component is mounted; wherein the sealing resin layer includes an increased thickness region, and a top surface including an inclination; a plurality of the outer electrodes are provided; the outer electrodes include a signal outer electrode and a ground outer electrode; and when viewed in a planar direction: the mount substrate includes a region with an increased formation density of the ground outer electrode; and the increased thickness region of the sealing resin layer and the region of the mount substrate with the increased formation density of the ground outer electrode overlap each other. ### Claim 3 (depends on 1) The electronic component device according to claim 1, wherein the increased thickness region of the sealing resin layer includes the at least one substrate component provided therein. ### Claim 4 (depends on 1) The electronic component device according to claim 1, wherein the increased thickness region of the sealing resin layer includes one of the at least one substrate component with a thickness that is greater than a thickness of another of the at least one substrate component in the increased thickness region of the sealing resin layer. ### Claim 5 (depends on 1) The electronic component device according to claim 1, wherein the sealing resin layer is defined by a molded resin layer; and the increased thickness region of the sealing resin is defined by a gap between dies with increased thickness. ### Claim 6 (depends on 1) The electronic component device according to claim 1, wherein the inclination of the top surface of the sealing resin layer is defined by a cut in the top surface of the sealing resin layer. ### Claim 7 (depends on 2) The electronic component device according to claim 2, wherein a number of the ground outer electrodes is greater than a number of the signal outer electrodes. ### Claim 8 (depends on 1) The electronic component device according to claim 1, wherein a plurality of the outer electrodes are provided; and one of the plurality of outer electrodes has a larger area than an area of another one of the plurality of outer electrodes. ### Claim 9 (depends on 8) The electronic component device according to claim 8, wherein the area of the one of the plurality of outer electrodes is about twice the area of the another one of the plurality of outer electrodes. ### Claim 10 (depends on 1) The electronic component device according to claim 1, wherein the at least one substrate component includes a large height component and a small height component; and the large height component is located in the increased thickness region and the small height component is located outside of the increased thickness region. ### Claim 11 (depends on 1) The electronic component device according to claim 1, wherein the at least one substrate component includes a plurality of substrate components; and each of the plurality of substrate components is provided in the increased thickness region. ### Claim 12 (depends on 7) The electronic component device according to claim 7, wherein at least one of the signal outer electrodes is provided in the increased thickness region. ### Claim 13 (depends on 9) The electronic component device according to claim 9, wherein the one of the plurality of outer electrodes is provided outside of the increased thickness region. ### Claim 14 (depends on 2) The electronic component device according to claim 2, wherein the increased thickness region of the sealing resin layer includes the at least one substrate component provided therein. ### Claim 15 (depends on 2) The electronic component device according to claim 2, wherein the increased thickness region of the sealing resin layer includes one of the at least one substrate component with a thickness that is greater than a thickness of another of the at least one substrate component in the increased thickness region of the sealing resin layer. ### Claim 16 (depends on 2) The electronic component device according to claim 2, wherein the sealing resin layer is defined by a molded resin layer; and the increased thickness region of the sealing resin is defined by a gap between dies with increased thickness. ### Claim 17 (depends on 2) The electronic component device according to claim 2, wherein the inclination of the top surface of the sealing resin layer is defined by a cut in the top surface of the sealing resin layer. ### Claim 18 (depends on 2) The electronic component device according to claim 2, wherein one of the plurality of outer electrodes has a larger area than an area of another one of the plurality of outer electrodes. ### Claim 19 (depends on 2) The electronic component device according to claim 2, wherein the at least one substrate component includes a large height component and a small height component; and the large height component is located in the increased thickness region and the small height component is located outside of the increased thickness region. ### Claim 20 (depends on 2) The electronic component device according to claim 2, wherein the at least one substrate component includes a plurality of substrate components; and each of the plurality of substrate components is provided in the increased thickness region.