# US 10,319,665 B2 · Cooler and cooler fixing method

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- Number: US 10,319,665 B2
- Document ID: US10319665B2
- Status: Granted
- Kind: B2
- Application number: 15/108,275
- Filed: 2015-04-23
- Published: 2016-10-20
- Granted: 2019-06-11
- Earliest claimed: 2014-06-19
- Assignees: Fuji Electric Co., Ltd.
- Applicants: Fuji Electric Co., Ltd.
- Inventors: Ryo Maruyama
- Web page: https://patentgrep.com/patent/US10319665B2

## CPC

- H10W 40/611: {Bolts or screws}
- H10W 40/037: {Assembling together parts thereof}
- H10W 40/47: by flowing liquids, e.g. forced water cooling
- H10W 90/00: Package configurations
- H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates}
- H10W 40/60: Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A cooler for cooling a semiconductor module to be secured to a base, the cooler including: a cooler body that includes a refrigerant flow path surrounded by a first wall part having a first through-hole, a second wall part that is arranged facing the first wall part and that includes a connection region which is to be connected to the base at a position opposing the first through-hole, and a side wall part for connecting the periphery of the first wall part and the periphery of the second wall part; and a lid for closing off the first through-hole.

## Claims

### Claim 1

A cooler for cooling a semiconductor module, the cooler being securable to a base, and the cooler comprising:
a cooler body that comprises a refrigerant flow path defined by (i) a first wall part having a first through-hole, (ii) a second wall part that is arranged facing the first wall part and that comprises a connection region which is connectable to the base at a position opposing the first through-hole, the connection region of the second wall part having a second through-hole, and a maximum inner diameter of the first through hole being greater than a maximum inner diameter of the second through-hole, and (iii) a side wall part for connecting a periphery of the first wall part and a periphery of the second wall part; and
a lid for closing off the first through-hole.

### Claim 2 (depends on 1)

The cooler according to claim 1, wherein the cooler further comprises a securing member small enough to be capable of passing through the first through-hole, the securing member being inserted through the second through-hole to secure the cooler body to the base.

### Claim 3 (depends on 2)

The cooler according to claim 2, wherein an inner diameter of a refrigerant-flow-path-side of the second through-hole is greater than an inner diameter of a base-side of the second through-hole.

### Claim 4 (depends on 3)

The cooler according to claim 3, wherein:
the securing member comprises a screw having a head part and a screw part; and
the refrigerant-flow-path side of the second through-hole comprises a groove which accommodates the head part of the screw such that the head part does not protrude into the refrigerant flow path.

### Claim 5 (depends on 4)

The cooler according to claim 4, further comprising a seal member between the second through-hole and the securing member.

### Claim 6 (depends on 3)

The cooler according to claim 3, further comprising a seal member between the second through-hole and the securing member.

### Claim 7 (depends on 2)

The cooler according to claim 2, further comprising a seal member between the second through-hole and the securing member.

### Claim 8 (depends on 1)

The cooler according to claim 1, wherein a wall part is provided in the connection region of the second wall part such that a wall thickness of the wall part is less than a wall thickness in other regions of the second wall part.

### Claim 9 (depends on 1)

The cooler according to claim 1, wherein a plurality of fins are connected so as not to block the first through-hole on a refrigerant-flow-path side of the first wall part.

### Claim 10 (depends on 1)

The cooler according to claim 1, wherein the lid is detachable from the first wall part.

### Claim 11 (depends on 1)

The cooler according to claim 1, wherein the lid, when fully received in the first through-hole, does not to protrude from a refrigerant-flow-path side of the first wall part into the refrigerant flow path.

### Claim 12 (depends on 1)

The cooler according to claim 1, wherein:
the semiconductor module is securable to an outer side of the first wall part; and
a thickness of the first wall part is less than a thickness of the second wall part.