# US 10,319,659 B2 · Semiconductor package and related methods > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,319,659 B2 - Document ID: US10319659B2 - Status: Granted - Kind: B2 - Application number: 15/783,533 - Filed: 2017-10-13 - Published: 2019-04-18 - Granted: 2019-06-11 - Earliest claimed: 2017-10-13 - Assignees: Semiconductor Components Industries, LLC - Applicants: Semiconductor Components Industries, LLC - Inventors: Atapol Prajuckamol; C H Chew; Yushuang Yao - Web page: https://patentgrep.com/patent/US10319659B2 ## CPC - H10W 78/00: Detachable holders for supporting packaged chips in operation - H10W 40/611: {Bolts or screws} - H10W 42/00: Arrangements for protection of devices (arrangements for thermal protection H10W40/00) - H10W 70/048: {Mechanical treatments, e.g. punching, cutting, deforming or cold welding} - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - H10W 70/66: Conductive materials thereof - H10W 70/68: Shapes or dispositions thereof - H10W 70/6875: {being on a metallic substrate, e.g. insulated metal substrates [IMS]} - H10W 72/50: Bond wires - H10W 74/01: Manufacture or treatment - H10W 74/016: {using moulds} - H10W 74/131: {the semiconductor body being only partially enclosed} - H10W 76/12: characterised by their shape - H10W 90/00: Package configurations - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates} - H10W 40/60: Securing means for detachable heating or cooling arrangements, e.g. clamps - H10W 70/681: {comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage} - H10W 72/071: {Connecting or disconnecting} - H10W 74/114: {by a substrate and the encapsulations} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Implementations of semiconductor packages may include: a substrate comprising a first side and a second side and a hole in the substrate. The hole extending from the first side to the second side of the substrate and positioned in a center of the substrate. The semiconductor packages may also include a bushing around the hole to the first side of the substrate. The semiconductor packages may also include a plurality of pin holders arranged and coupled on the substrate. The semiconductor package may also include a molding compound at least partially encapsulating the substrate, encapsulating a side surface of the bushing, and encapsulating a plurality of side surfaces of the plurality of pin holders. ## Claims ### Claim 1 A semiconductor package comprising: a substrate comprising a first side and a second side; a hole in the substrate extending from the first side to the second side and positioned in a center of the substrate; a bushing around the hole on the first side of the substrate; a plurality of pin holders arranged and coupled on the substrate; a molding compound at least partially encapsulating the substrate, encapsulating a side surface of the bushing, and encapsulating a plurality of side surfaces of the plurality of pin holders. ### Claim 2 (depends on 1) The semiconductor package of claim 1, wherein the plurality of pin holders have a height that is the same as a height of the bushing. ### Claim 3 (depends on 1) The semiconductor package of claim 1, wherein the bushing comprises one of copper, steel and any combination thereof. ### Claim 4 (depends on 1) The semiconductor package of claim 1, wherein the bushing and the plurality of pin holders are each coupled to the substrate through solder. ### Claim 5 (depends on 1) The semiconductor package of claim 1, wherein the pin holders comprise copper. ### Claim 6 (depends on 1) The semiconductor package of claim 1, furthering comprising one or more die coupled to the first side of the substrate. ### Claim 7 A semiconductor package comprising: a substrate comprising a first surface and a second surface, the second surface opposing the first surface; two or more cutouts positioned in a first edge and in a second edge of the substrate; a bushing positioned around a perimeter of each of the two or more cutouts, the bushing coupled on the first surface of the substrate; a plurality of pin holders coupled on the first surface of the substrate; a plurality of pins slidably coupled into the plurality of pin holders; and a molding compound at least partially encapsulating the substrate, a side surface of the bushing, and a plurality of side surfaces of the plurality of pin holders. ### Claim 8 (depends on 7) The semiconductor package of claim 7, wherein the plurality of pin holders have a height that is the same as a height of the bushing. ### Claim 9 (depends on 7) The semiconductor package of claim 7, wherein the bushing comprises one of copper, steel and any combination thereof. ### Claim 10 (depends on 7) The semiconductor package of claim 7, wherein the bushing positioned around a perimeter of each of the two or more cutouts is sawed to be flush with the first edge and the second edge of the substrate. ### Claim 11 (depends on 7) The semiconductor package of claim 7, wherein the bushing and the plurality of pin holders are each coupled to the substrate through solder. ### Claim 12 (depends on 7) The semiconductor package of claim 7, wherein the pin holders comprise copper. ### Claim 13 (depends on 7) The semiconductor package of claim 7, furthering comprising one or more die coupled to the first side of the substrate. ### Claim 14 A semiconductor package comprising: a substrate comprising a first side and a second side; a hole in the substrate extending from the first side to the second side and positioned in a center of the substrate; a bushing around the hole on the first side of the substrate; a flange around a first end of the bushing, the first end opposite a second end of the bushing, the second end configured to couple with the substrate; a plurality of pin holders arranged and coupled on the substrate; a molding compound at least partially encapsulating the substrate, encapsulating a side surface of the bushing, and encapsulating a plurality of side surfaces of the plurality of pin holders. ### Claim 15 (depends on 14) The semiconductor package of claim 14, wherein the plurality of pin holders have a height that is the same as a height of the bushing. ### Claim 16 (depends on 14) The semiconductor package of claim 14, wherein the bushing comprises one of copper, steel and any combination thereof. ### Claim 17 (depends on 14) The semiconductor package of claim 14, wherein the bushing and the plurality of pin holders are each coupled to the substrate through solder. ### Claim 18 (depends on 14) The semiconductor package of claim 14, wherein the pin holders comprise copper. ### Claim 19 (depends on 14) The semiconductor package of claim 14, furthering comprising one or more die coupled to the first side of the substrate. ### Claim 20 (depends on 14) The semiconductor package of claim 14, wherein the flange extends outwardly away from the hole in the substrate.