# US 10,319,655 B2 · POP structures with dams encircling air gaps and methods for forming the same

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- Number: US 10,319,655 B2
- Document ID: US10319655B2
- Status: Granted
- Kind: B2
- Application number: 15/584,864
- Filed: 2017-05-02
- Published: 2017-08-17
- Granted: 2019-06-11
- Earliest claimed: 2012-11-13
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Company, Ltd.
- Inventors: Chen-Hua Yu; Tsung-Ding Wang; Chen-Shien Chen; Chung-Shi Liu; Jiun Yi Wu
- Web page: https://patentgrep.com/patent/US10319655B2

## CPC

- H10W 76/40: Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70)
- H10W 10/021: {of air gaps}
- H10W 10/20: Air gaps
- H10W 70/635: {Through-vias}
- H10W 70/685: comprising multiple insulating layers
- H10W 74/012: {of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills}
- H10W 74/124: {the encapsulations having cavities other than that occupied by chips}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 74/473: {containing a filler}
- H10W 90/00: Package configurations
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 40/10: Arrangements for heating
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 72/072: {of bump connectors}
- H10W 72/073: {of die-attach connectors}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10W 74/142: {the encapsulations exposing the passive side of the semiconductor body}
- H10W 80/312: {characterised by the direct bonding of electrically conductive pads}
- H10W 90/288: {characterised by arrangements for thermal management of the stacked chips}
- H10W 90/291: {characterised by containers, encapsulations, or other housings for the stacked chips}
- H10W 90/722: {between stacked chips}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A device includes a bottom package component that includes a bottom die, and a dam over a top surface of the bottom die. The dam has a plurality of sides forming a partial ring, with an air gap surrounded by the plurality of side portions. The air gap overlaps the bottom die. A top package component is bonded to the bottom package component, wherein the air gap separates a bottom surface of the top package component from the bottom die.

## Claims

### Claim 1

A package comprising:
a bottom die;
a dam over the bottom die, wherein the dam comprises a plurality of side portions forming a partial ring, and the dam is configured to allow air exchange between an inner space inside the dam and an outer space outside of the dam, and the plurality of side portions comprise:
a first side portion and a second side portion parallel to each other;
a third side portion comprising:
a first lower portion connecting a first end of the first side portion to a first end of the second side portion; and
a first plurality of upper portions separated from each other by first recesses, wherein the first plurality of upper portions and the first recesses overlap the first lower portion.

### Claim 2 (depends on 1)

The package of claim 1, wherein the dam has an opening between a second end of the first side portion and a second end of the second side portion.

### Claim 3 (depends on 2)

The package of claim 2, wherein the dam further comprises a fourth side portion comprising:
a second lower portion connecting the second end of the first side portion to the second end of the second side portion; and
a second plurality of upper portions separated from each other by second recesses, wherein the second plurality of upper portions and the second recesses overlap the second lower portion, and wherein the opening is one of the second recesses.

### Claim 4 (depends on 1)

The package of claim 1 further comprising an encapsulating material encircling the dam, wherein the encapsulating material is in contact with outer sidewalls of the dam.

### Claim 5 (depends on 4)

The package of claim 4, wherein a region between the first side portion and the second side portion is free from the encapsulating material.

### Claim 6 (depends on 5)

The package of claim 5, wherein the region free from the encapsulating material is an air gap.

### Claim 7 (depends on 4)

The package of claim 4, wherein the encapsulating material comprises filler particles, and sizes of the first recesses are smaller than sizes of the filler particles.

### Claim 8 (depends on 1)

The package of claim 1 further comprising a top package component having a bottom surface contacting top surfaces of the first plurality of upper portions of the third side portion of the dam, wherein the first lower portion is spaced apart from the top package component by the first plurality of upper portions.

### Claim 9 (depends on 1)

The package of claim 1, wherein the first side portion and the second side portion are continuous and are free from openings therein.

### Claim 10

A package comprising:
a bottom package comprising:
a bottom package substrate; and
a bottom device die over and bonded to the bottom package substrate;
a top package over and bonded to the bottom package substrate, wherein the top package is spaced apart from the bottom device die by an air gap;
a dam in contact with both the bottom device die and the top package, wherein the dam comprises:
a first side portion and a second side portion parallel to each other, with each of the first side portion and the second side portion having an outer edge substantially aligned to a respective edge of the bottom device die; and
a third side portion extending from the first side portion to the second side portion, wherein a recess is formed to extend from a top surface to an intermediate level of the third side portion, with the intermediate level being between the top surface and a bottom surface of the third side portion; and
an encapsulating material contacting the outer edges of the first side portion and the second side portion and an outer edge of the third side portion, wherein at least a portion of an inner edge of each of the first side portion, the second side portion, and the third side portion is spaced apart from the encapsulating material.

### Claim 11 (depends on 10)

The package of claim 10, wherein the third side portion of the dam has a plurality of recesses extending from the top surface of the third side portion to the intermediate level.

### Claim 12 (depends on 10)

The package of claim 10, wherein the third side portion of the dam comprises a lower portion lower than the recess, wherein the lower portion continuously extends from the first side portion to the second side portion.

### Claim 13 (depends on 10)

The package of claim 10, wherein the encapsulating material comprises filler particles, and the recess has a size smaller than sizes of the filler particles.

### Claim 14 (depends on 10)

The package of claim 10, wherein the first side portion further comprises an additional recess therein.

### Claim 15 (depends on 10)

The package of claim 10, wherein substantially an entirety of a region between the top package and the bottom package and encircled by the dam is an air gap.

### Claim 16 (depends on 10)

The package of claim 10, wherein the top package comprises:
a top package substrate bonded to the bottom package substrate through solder balls; and
a top device die over and bonded to the top package substrate.

### Claim 17

A package comprising:
a package substrate;
a device die over the package substrate, wherein the device die is bonded to the package substrate through flip-chip bonding;
a dam over and in contact with a top surface of the device die, wherein the dam comprises:
three side portions adjacent to respective edges of the device die, wherein the three side portions of the dam are interconnected to form a partial ring;
a recess extending from a top surface of one of the three side portions to an intermediate level of the dam, with the intermediate level being between the top surface and a bottom surface of the one of the three side portions, wherein the recess is configured to allow air exchange between an inner space encircled by the dam and an outer space outside of the dam;
a top package over and in contact with the dam;
an encapsulating material contacting outer sidewalls of the dam, with an inner sidewall of the dam spaced apart from the encapsulating material; and
solder regions bonding the top package to the package substrate.

### Claim 18 (depends on 17)

The package of claim 17, wherein outer edges of the dam are substantially flush with respective outer edges of the device die.

### Claim 19 (depends on 17)

The package of claim 17, wherein the encapsulating material comprises a polymer and a filler in the polymer, and wherein the recess has a size smaller than particle sizes of the filler.

### Claim 20 (depends on 17)

The package of claim 17, wherein the inner sidewall of the dam is exposed to an air gap.