# US 10,319,615 B2 · Semiconductor bonding apparatus and related techniques > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,319,615 B2 - Document ID: US10319615B2 - Status: Granted - Kind: B2 - Application number: 15/843,628 - Filed: 2017-12-15 - Published: 2018-04-19 - Granted: 2019-06-11 - Earliest claimed: 2016-02-24 - Assignees: Suss Microtec Lithography GmbH - Applicants: SUSS MicroTec Lithography GmbH - Inventors: Gregory George; Hale Johnson - Web page: https://patentgrep.com/patent/US10319615B2 ## CPC - H10P 72/0428: {Apparatus for mechanical treatment or grinding or cutting} - H10W 72/0711: {Apparatus therefor} - B65G 47/91: incorporating pneumatic, e.g. suction, grippers - H10P 14/40: of conductive or resistive materials - H10P 72/70: for supporting or gripping - H10P 95/00: Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass - H10W 72/0198: {batch processes} - H10W 72/07141: {Means for applying energy, e.g. ovens or lasers} - H10W 72/07163: {Means for mechanical processing, e.g. for planarising, pressing, stamping or drilling} - H10W 72/07331: {Connecting techniques} - H10W 72/07332: {Compression bonding, e.g. thermocompression bonding} - H10W 72/07336: {Soldering or alloying} - H10W 90/732: {between stacked chips} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - Y10T 156/10: Methods of surface bonding and/or assembly therefor - Y10T 156/1092: All laminae planar and face to face - Y10T 156/1744: Means bringing discrete articles into assembled relationship - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - B65G: TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS (packaging B65B; handling thin or filamentary materials, e.g. paper sheets or thread, B65H; cranes B66C; portable mobile or lifting or hauling appliances, e.g. hoists, B66D; devices for lifting or lowering goods for loading or unloading purposes, e.g. fork-lift trucks, B66F9/00; emptying bottles, jars, casks, barrels or similar containers, not otherwise provided for, B67C9/00; delivering or transferring liquids B67D; filling or discharging vessels for liquefied, solidified or compressed gases F17C; pipe-line systems for fluids F17D) - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A semiconductor structure bonding apparatus is disclosed. The apparatus may include a leveling adjustment system configured to provide leveling adjustment of upper and lower block assemblies of the apparatus. In some cases, the leveling adjustment system may include a plurality of threaded posts, differentially threaded adjustment collars, and leveling sleeves. In some instances, the leveling adjustment system further may include a plurality of preload springs configured to provide a given preload capacity and range of adjustment. In some instances, the leveling adjustment system further may include a load cell through which one of the threaded posts may be inserted. In some embodiments, the upper block assembly further may include a reaction plate configured to reduce deformation of the upper block assembly. In some embodiments, the upper block assembly further may include a thermal isolation plate configured to provide compliance deflection and being of monolithic or polylithic construction, as desired. ## Claims ### Claim 1 A semiconductor structure bonding apparatus comprising: a lower block assembly comprising a first surface configured to receive at least one semiconductor wafer thereon; an upper block assembly comprising: a chuck configured to provide a second surface configured to be brought into contact with the first surface in application of bonding pressure to the at least one semiconductor wafer; and a reaction plate disposed over the chuck and configured to reduce deformation of the upper block assembly, the reaction plate comprising: a monolithic plate member; and a plurality of concentric grooves defined in the monolithic plate member and configured to receive a corresponding plurality of seals; and a plurality of ports configured to deliver pressurized gas to a plurality of regions of the reaction plate. ### Claim 2 (depends on 1) The apparatus of claim 1, wherein: the plurality of concentric grooves of the reaction plate comprises: a first groove; and a second groove concentrically exterior to the first groove; and the plurality of ports is configured to deliver pressurized gas to the plurality of regions of the reaction plate such that in bonding 4-inch diameter semiconductor wafers, pressurized gas is applied to a first region defined between the first groove and the second groove. ### Claim 3 (depends on 2) The apparatus of claim 2, wherein: the plurality of concentric grooves of the reaction plate further comprises a third groove concentrically exterior to the second groove; and the plurality of ports is further configured to deliver pressurized gas to the plurality of regions of the reaction plate such that in bonding 6-inch diameter semiconductor wafers, pressurized gas is applied to the first region and a second region defined between the second groove and the third groove. ### Claim 4 (depends on 3) The apparatus of claim 3, wherein: the plurality of concentric grooves of the reaction plate further comprises a fourth groove concentrically exterior to the third groove; and the plurality of ports is further configured to deliver pressurized gas to the plurality of regions of the reaction plate such that in bonding 8-inch diameter semiconductor wafers, pressurized gas is applied to the first region, the second region, and a third region defined between the third groove and the fourth groove. ### Claim 5 (depends on 1) The apparatus of claim 1, wherein the reaction plate has defined therein a cutaway portion configured to allow flexure of the reaction plate thereat. ### Claim 6 (depends on 5) The apparatus of claim 5, wherein at least one of the plurality of seals is concentrically exterior to the cutaway portion. ### Claim 7 (depends on 1) The apparatus of claim 1, wherein the upper block assembly further comprises a thermal isolation plate disposed between the reaction plate and the chuck. ### Claim 8 (depends on 7) The apparatus of claim 7, wherein the thermal isolation plate comprises a plurality of wedge-shaped pieces that are physically separate from one another and configured to move with respect to one another. ### Claim 9 (depends on 8) The apparatus of claim 8, wherein the plurality of wedge-shaped pieces is configured to be arranged in a circular manner with vertices pointing towards a common center. ### Claim 10 (depends on 8) The apparatus of claim 8, wherein at least one of the wedge-shaped pieces includes a plurality of raised projections extending from a surface thereof, the raised projections spaced apart from one another around the surface. ### Claim 11 (depends on 8) The apparatus of claim 8, wherein at least one of the wedge-shaped pieces constitutes a monolithic element. ### Claim 12 (depends on 8) The apparatus of claim 8, wherein at least one of the wedge-shaped pieces constitutes a polylithic element comprising: a lower plate portion; and an upper plate portion configured to be disposed over and operatively coupled with the lower plate portion such that vacuum can be maintained in a void defined between the lower plate portion and the upper plate portion. ### Claim 13 (depends on 12) The apparatus of claim 12, wherein the lower plate portion includes a plurality of raised projections disposed on an interior surface thereof and extending toward the upper plate portion within the void defined between the lower plate portion and the upper plate portion, the raised projections spaced apart from one another around the interior surface of the lower plate portion. ### Claim 14 (depends on 7) The apparatus of claim 7, wherein the thermal isolation plate comprises: a lower plate portion; and an upper plate portion configured to be disposed over and operatively coupled with the lower plate portion such that vacuum can be maintained in a void defined between the lower plate portion and the upper plate portion. ### Claim 15 (depends on 14) The apparatus of claim 14, wherein the lower plate portion includes a plurality of raised projections disposed on an interior surface thereof and extending toward the upper plate portion within the void defined between the lower plate portion and the upper plate portion, the raised projections spaced apart from one another around the interior surface of the lower plate portion. ### Claim 16 (depends on 14) The apparatus of claim 14, wherein at least one of the lower plate portion and the upper plate portion constitutes a monolithic element. ### Claim 17 (depends on 7) The apparatus of claim 7, wherein the thermal isolation plate is configured to provide compliance deflection of about 50 μm or less. ### Claim 18 (depends on 1) The apparatus of claim 1, wherein at least one of the plurality of concentric grooves is configured to receive at least one of the corresponding plurality of seals having a 3-mm diameter. ### Claim 19 (depends on 1) The apparatus of claim 1, wherein the plurality of concentric grooves is configured to receive the corresponding plurality of seals such that sealing is maintained at pressures up to about 37 bar. ### Claim 20 (depends on 1) The apparatus of claim 1, further comprising a water-cooled flange disposed between the chuck and the reaction plate.