# US 10,319,614 B2 · Wafer leveling device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,319,614 B2 - Document ID: US10319614B2 - Status: Granted - Kind: B2 - Application number: 15/051,829 - Filed: 2016-02-24 - Published: 2017-03-02 - Granted: 2019-06-11 - Earliest claimed: 2015-09-02 - Assignees: E&R Engineering Corporation - Applicants: E&R Engineering Corp. - Inventors: Wen Ren Wu; Cho Chun Chung - Web page: https://patentgrep.com/patent/US10319614B2 ## CPC - H10P 72/0428: {Apparatus for mechanical treatment or grinding or cutting} - H10P 72/0616: {Monitoring of warpages, curvatures, damages, defects or the like} - H10P 72/7611: {characterised by edge profile or support profile} - H10P 72/7624: {characterised by the mechanical construction of the susceptor, stage or support} - H10P 72/78: using vacuum or suction, e.g. Bernoulli chucks - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract The present disclosure relates to a wafer leveling device which comprises a carrier module, a fixture module and a dynamic module. A wafer, which is conveyed to and stays above a claw component of the carrier module by a robotic arm, is further carried by the lifted claw component for a continuous ascent until the wafer is contacted by a ring component of the fixture module; the clamp component of the fixture module releases the ring component; the claw component, the ring component and the wafer, all of which keep stabilized mutual positions, are lowered so that several protrudent structures on a base component of the carrier module contact the wafer; the claw component, the ring component and the wafer which completes a manufacturing process are lifted; the carrier module and the wafer are lowered with the clamp components stabilizing the ring component. ## Claims ### Claim 1 A wafer leveling device, comprising: a carrier module (10) with a claw component (11) having a plurality of claw structures (111) vertically stacked on top of a ring-shaped base component (12) for positioning and load bearing of the claw component (11); a fixture module (20) comprising a ring component (21) having a ring shape which is vertically stacked on the claw component (11), and a clamp component (22) vertically stacked on top of the ring component (21); the clamp component (22) releasably attached to the ring component (21), a dynamic module (30) which lifts the claw component (11) to reach an up position and lowers the claw component (11) to reach a down position, wherein the dynamic module (30) comprises at least one driving motor component (35), a curved stabilizing component (31) below the claw component (11), at least one right-angle mounting component (32) extending perpendicular to at least one vertical movement component (33) and at least one vertical track component (34), the claw component (11) and the curved stabilizing component (31) having at least one aligned slot aligned with and receiving the at least one right-angle mounting component (32), wherein: edges of the claw structures (111) contact a bottom surface of the wafer (40) when the claw component (11) is lifted to the up position by the dynamic module (30) after the wafer (40) has been conveyed to and held above the claw component (11) by a robotic arm, the ring component (21) contacts a rim of an upper surface of the wafer (40) after the claw component (11) is lifted to the up position by the dynamic module (30) and the clamp components (22) release the ring component (21), the claw component (11), the ring component (21) and the wafer (40), all of which keep stabilized mutual positions, are lowered to the down position in which several protrudent structures (121) on the base component (12) contact a rim of the bottom surface of the wafer (40), after which the wafer (40) undergoes a manufacturing process, the claw component (11) , the ring component (21) and the wafer (40) are lifted to the up position after the wafer (40) completes the manufacturing process, and the carrier module (10) and the wafer (40) are then lowered while the clamp components (22) hold the ring component (21) in the up position to enable removal of the wafer (40) by the robotic arm. ### Claim 2 (depends on 1) A wafer leveling device as claimed in claim 1 wherein the claw component (11) has an opening (112). ### Claim 3 (depends on 1) A wafer leveling device as claimed in claim 1 wherein the claw structure (111) comprises at least an auxiliary feed-in unit (1111). ### Claim 4 (depends on 1) A wafer leveling device as claimed in claim 1 wherein the ring component (21) comprises at least a first positioning magnetic unit (211) which magnetically attracts at least a second positioning magnetic unit (122) at the base component (12). ### Claim 5 (depends on 1) A wafer leveling device as claimed in claim 1 wherein the claw structure (111) and at least a base positioning structure (123) at the base component (12) stabilize each other for immobilization. ### Claim 6 (depends on 1) A wafer leveling device as claimed in claim 1 wherein the curved stabilizing component (31) is coupled with the claw component (11) and the at least one right-angle mounting component (32) by means of fastening, absorption or latching, and the at least one right-angle mounting component (32) and the at least one vertical movement component (33) are driven by a driving motor components (35) so that the at least one right-angle mounting component (32) fixed on the at least one vertical movement component (33) is lifted or lowered by an adjacent said at least one vertical track component (34) and the curved stabilizing component (31). ### Claim 7 (depends on 6) A wafer leveling device as claimed in claim 6 wherein the right-angle mounting component (32) comprises a check unit (321) which coordinates a sensor unit (351) on the driving motor component (35) to check and verify homing of the driving motor component (35). ### Claim 8 (depends on 6) A wafer leveling device as claimed in claim 6 wherein the right-angle mounting component (32) comprises a proximity check unit (322) which coordinates a sensor block (352) on the driving motor component (35) to check a distance in between. ### Claim 9 (depends on 1) A wafer leveling device as claimed in claim 1 wherein the fixture module (20) comprises a vacuum component (23). ### Claim 10 A wafer leveling device, comprising: a carrier module (10) with a claw component (11) having a plurality of claw structures (111) vertically stacked on top of a ring-shaped base component (12); a fixture module (20) comprising a ring component (21) having a ring shape which is vertically stacked on the claw component (11), and a clamp component (22) vertically stacked on top of the ring component (21); the clamp component (22) releasably attached to the ring component (21), a dynamic module (30) which lifts the claw component (11) to reach an up position and lowers the claw component (11) to reach a down position, wherein the dynamic module (30) comprises at least one driving motor component (35), a curved stabilizing component (31) below the claw component (11), at least one right-angle mounting component (32) extending perpendicular to at least one vertical movement component (33) and at least one vertical track component (34), the claw component (11) and the curved stabilizing component (31) having at least one aligned slot aligned with and receiving the at least one right-angle mounting component (32), wherein: edges of the claw structures (111) contact a bottom surface of the wafer (40) when the claw component (11) is lifted to the up position by the dynamic module (30) after the wafer (40) has been conveyed to and held above the claw component (11) by a robotic arm, the ring component (21) contacts a rim of an upper surface of the wafer (40) after the claw component (11) is lifted to the up position by the dynamic module (30) and the clamp components (22) release the ring component (21), the claw component (11), the ring component (21) and the wafer (40), all of which keep stabilized mutual positions, are lowered to the down position in which several protrudent structures (121) on the base component (12) contact a rim of the bottom surface of the wafer (40), after which the wafer (40) undergoes a manufacturing process, the claw component (11) , the ring component (21) and the wafer (40) are lifted to the up position after the wafer (40) completes the manufacturing process, and the carrier module (10) and the wafer (40) are then lowered while the clamp components (22) hold the ring component (21) in the up position to enable removal of the wafer (40) by the robotic arm, wherein the fixture module (20) comprises a vacuum component (23).