# US 10,319,609 B2 · Adhesive-bonded thermal interface structures > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,319,609 B2 - Document ID: US10319609B2 - Status: Granted - Kind: B2 - Application number: 15/629,171 - Filed: 2017-06-21 - Published: 2018-12-27 - Granted: 2019-06-11 - Earliest claimed: 2017-06-21 - Assignees: International Business Machines Corporation - Applicants: International Business Machines Corporation - Inventors: Karl Stathakis; Phillip V. Mann; Mark K. Hoffmeyer - Web page: https://patentgrep.com/patent/US10319609B2 ## CPC - H10W 74/01: Manufacture or treatment - H10W 10/00: Isolation regions in semiconductor bodies between components of integrated devices - H10W 10/01: {Manufacture or treatment} - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H10W 40/25: characterised by their materials - H10W 40/70: Fillings or auxiliary members in containers or in encapsulations for thermal protection or control - H10W 76/47: Solid or gel fillings - H10W 40/258: {Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A heat sink can be attached to a heat-producing electronic device by aligning an adhesive material to a surface of the heat sink, applying the adhesive material to the surface to form an outer perimeter and applying, within the outer perimeter, a thermally conductive material to the surface. The surface of the heat sink and a surface of the heat-producing electronic device can then be aligned, and the heat sink can be assembled to the heat-producing electronic device by bringing the heat-producing electronic device surface into contact with the adhesive material. The heat sink can then be affixed to the heat-producing electronic device by applying a compressive force to the assembly to activate the adhesive material. ## Claims ### Claim 1 An apparatus for cooling a heat-producing electronic device, the apparatus comprising: a heat sink having a first surface, the first surface including a protrusion of the heat sink extending away from the first surface, the protrusion including four contiguous sides that define an inner perimeter on the first surface; an adhesive material affixed to the first surface and to a second surface of the heat-producing electronic device, wherein the adhesive material comprises a pressure-sensitive adhesive (PSA), the adhesive material configured to provide a force to hold the first surface of the heat sink in an adjacent, parallel planar orientation to the second surface of the heat-producing electronic device, the adhesive material defining an outer perimeter on the first and second surfaces and forming an outer cavity bounded by the outer perimeter, the first surface and the second surface; and a thermally conductive material contained in an inner cavity enclosed within the outer cavity, the inner cavity fully enclosed by the inner perimeter, the first surface and the second surface, the thermally conductive material configured to cool the heat-producing electronic device by providing a thermally conductive path between the first surface and the second surface. ### Claim 2 (depends on 1) The apparatus of claim 1, wherein a first height of the protrusion, extending away from the first surface, is in a range between 40% and 90% of a second height of the adhesive material. ### Claim 3 (depends on 1) The apparatus of claim 1, wherein a first height of the protrusion, extending away from the first surface, is less than a distance, in an assembled configuration, between the first surface and the second surface. ### Claim 4 (depends on 1) The apparatus of claim 1, wherein the adhesive material is thermally conductive and configured to transfer heat between the second surface and the first surface. ### Claim 5 (depends on 1) The apparatus of claim 1, wherein the adhesive material is chemically inert with respect to the thermally conductive material. ### Claim 6 (depends on 1) The apparatus of claim 1, wherein an outline of the adhesive material defines a vent formed between the inner perimeter and an exterior perimeter of the adhesive material. ### Claim 7 An apparatus for cooling a heat-producing electronic device, the apparatus comprising: a heat sink having a first surface; an adhesive material affixed to the first surface and to a second surface of the heat-producing electronic device, wherein the adhesive material comprises a pressure-sensitive adhesive (PSA), the adhesive material configured to provide a force to hold the first surface in an adjacent, parallel planar orientation to the second surface, the adhesive material, in an unassembled configuration, defining a perimeter on the first and second surfaces, the perimeter having four contiguous sides, the adhesive material further forming a cavity bounded by the perimeter, the first surface and the second surface; and a pre-formed thermal interface material (TIM) pad located within the cavity, the TIM pad configured to cool the heat-producing electronic device by providing a thermally conductive path between the heat-producing electronic device and the heat sink, the thermally conductive path including at least a portion of a third surface of the TIM pad in thermally conductive contact with a corresponding portion of the first surface of the heat sink and at least a portion of a fourth surface of the TIM pad in thermally conductive contact with a corresponding portion of the second surface of the heat-producing electronic device. ### Claim 8 (depends on 7) The apparatus of claim 7, further comprising a thermally conductive material positioned, in the unassembled configuration, at a perimeter of the TIM pad, the thermally conductive material positioned, in an assembled configuration, between the TIM pad and at least one of a portion of the first surface and a portion of the second surface. ### Claim 9 (depends on 7) The apparatus of claim 7, wherein the adhesive material is thermally conductive and positioned, in an assembled configuration, between the TIM pad and at least one of a portion of the first surface and a portion of the second surface. ### Claim 10 (depends on 1) The apparatus of claim 1, wherein the thermally conductive material is selected from the group consisting of: a thermal grease, a thermal paste, a thermal gel, and a phase-change material. ### Claim 11 (depends on 1) The apparatus of claim 1, wherein the PSA includes a pressure-sensitive adhesive material selected from the group consisting of: double-sided adhesive tapes, adhesive material sheets, adhesive liquids, adhesive gels, curable adhesive gels, and adhesives in aerosol formulations. ### Claim 12 (depends on 1) The apparatus of claim 1, wherein the PSA includes an aluminum mesh. ### Claim 13 (depends on 7) The apparatus of claim 7, wherein the TIM pad is fabricated from at least one thermally conductive material selected from the group consisting of: silver, copper, indium, and carbon fibers. ### Claim 14 (depends on 7) The apparatus of claim 7, wherein the PSA includes a pressure-sensitive adhesive material selected from the group consisting of: double-sided adhesive tapes, adhesive material sheets, adhesive liquids, adhesive gels, curable adhesive gels, and adhesives in aerosol formulations. ### Claim 15 (depends on 7) The apparatus of claim 7, wherein the PSA includes an aluminum mesh.