# US 10,319,527 B2 · Multilayer capacitor > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,319,527 B2 - Document ID: US10319527B2 - Status: Granted - Kind: B2 - Application number: 15/661,146 - Filed: 2017-07-27 - Published: 2018-10-04 - Granted: 2019-06-11 - Earliest claimed: 2017-04-04 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Jung Min Kim; Bon Seok Koo; Chang Hak Choi; Hae Sol Kang; Ji Hye Han; Byung Woo Kang - Web page: https://patentgrep.com/patent/US10319527B2 ## CPC - H01G 4/33: Thin- or thick-film capacitors {(thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)} - H01G 4/008: Selection of materials - H01G 4/012: Form of non-self-supporting electrodes - H01G 4/12: Ceramic dielectrics {(H01G4/085 takes precedence)} - H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor - H01G 4/2325: {characterised by the material of the terminals} - H01G 4/248: the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence) - H01G 4/30: Stacked capacitors (H01G4/33 takes precedence) - H01G 4/0085: {Fried electrodes} - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) ## Abstract A multilayer capacitor may have a decreased equivalent series resistance (ESR) and improved warpage strength and reliability with conductive resin layers of external electrodes on surfaces where internal electrodes are exposed from a body, intermetallic compounds are in contact with conductive connecting portions of the conductive resin layers and the internal electrodes, and conductive connecting portions are in contact with a plurality of metal particles and second electrode layers. ## Claims ### Claim 1 A multilayer capacitor comprising: a body, including a plurality of first and second internal electrodes alternately stacked with dielectric layers interposed therebetween, having first and second surfaces opposing each other, third and fourth surfaces opposing each other and connected to the first and second surfaces, and fifth and sixth surfaces opposing each other, connected to the first and second surfaces, and connected to the third and fourth surfaces, and including a plurality of first and second groove portions in the third and fourth surfaces between dielectric layers, wherein the dielectric layers are perpendicular to the third and fourth surfaces, and end portions of the first and second internal electrodes are exposed from the body through the first and second groove portions, respectively; intermetallic compounds in the first and second groove portions and connected to the end portions of the first and second internal electrodes, respectively; moisture permeation prevention layers on the first and second surfaces of the body, respectively; and first and second external electrodes on the third and fourth surfaces of the body, respectively, wherein the first and second external electrodes include: conductive resin layers disposed on the third and fourth surfaces of the body, respectively, and including a plurality of metal particles, conductive connecting portions surrounding the plurality of metal particles and in contact with the intermetallic compounds, and base resin; and first electrode layers on the respective conductive resin layers and in contact with the conductive connecting portions, and wherein the moisture permeation prevention layers are each between the body and the conductive resin layers of the first and second external electrodes. ### Claim 2 (depends on 1) The multilayer capacitor of claim 1, wherein the conductive connecting portions include a material having a melting point lower than a hardening temperature of the base resin. ### Claim 3 (depends on 2) The multilayer capacitor of claim 2, wherein a melting point of the material of the conductive connecting portions is 300° C. or less. ### Claim 4 (depends on 1) The multilayer capacitor of claim 1, wherein the conductive connecting portions include two or more materials from a group consisting of tin, lead, indium, copper, silver, and bismuth. ### Claim 5 (depends on 1) The multilayer capacitor of claim 1, wherein the metal particles of the conductive resin layer include at least one material from a group consisting of copper, nickel, silver, copper coated with silver, and copper coated with tin. ### Claim 6 (depends on 1) The multilayer capacitor of claim 1, wherein the internal electrode includes nickel, and the intermetallic compound includes nickel-tin (Ni—Sn). ### Claim 7 (depends on 1) The multilayer capacitor of claim 1, wherein the internal electrode includes one material from a group consisting of nickel, copper, and palladium, or alloys thereof. ### Claim 8 (depends on 1) The multilayer capacitor of claim 1, wherein the metal particles of the conductive resin layer have spherical shapes, flake shapes, or a mixture of spherical shapes and flake shapes. ### Claim 9 (depends on 1) The multilayer capacitor of claim 1, further comprising moisture permeation prevention layers formed on the first and second surfaces of the body, respectively. ### Claim 10 (depends on 1) The multilayer capacitor of claim 1, wherein the first and second external electrodes respectively include connection portions on the third and fourth surfaces of the body, and each include band portions extending from the connection portions to the first, second, fifth, and sixth surfaces of the body. ### Claim 11 (depends on 1) The multilayer capacitor of claim 1, wherein the first electrode layer includes one material from a group consisting of copper, tin, nickel, palladium, and gold or alloys thereof. ### Claim 12 (depends on 1) The multilayer capacitor of claim 1, wherein the first and second external electrodes further include second electrode layers respectively on the first electrode layers. ### Claim 13 (depends on 12) The multilayer capacitor of claim 12, wherein the second electrode layers each include a nickel plating layer and a tin plating layer stacked sequentially on the first electrode layer. ### Claim 14 (depends on 1) The multilayer capacitor of claim 1, wherein the body further comprises upper and lower covers above and below the plurality of first and second internal electrodes, respectively, that include a material that is the same as that of the dielectric layers. ### Claim 15 A multilayer capacitor comprising: a body, including a plurality of first and second internal electrodes alternately stacked with dielectric layers interposed therebetween, and having first and second surfaces opposing each other, third and fourth surfaces opposing each other and connected to the first and second surfaces, and fifth and sixth surfaces opposing each other, connected to the first and second surfaces, and connected to the third and fourth surfaces, wherein end portions of the first and second internal electrodes are exposed from the body at the third and fourth surfaces, respectively; intermetallic compounds connected to the end portions of the first and second internal electrodes, respectively; moisture permeation prevention layers on the first and second surfaces of the body, respectively; and first and second external electrodes on the third and fourth surfaces of the body, respectively, wherein the first and second external electrodes include: conductive resin layers on the third and fourth surfaces of the body, respectively, and including a plurality of metal particles, conductive connecting portions surrounding the plurality of metal particles and in contact with the intermetallic compounds, and base resin; and first electrode layers on the respective conductive resin layers and in contact with the conductive connecting portions, and wherein the moisture permeation prevention layers are each between the body and the conductive resin layers of the first and second external electrodes. ### Claim 16 (depends on 15) The multilayer capacitor of claim 15, wherein the conductive connecting portions include a material having a melting point lower than a hardening temperature of the base resin. ### Claim 17 (depends on 16) The multilayer capacitor of claim 16, wherein a melting point of the material of the conductive connecting portions is 300° C. or less. ### Claim 18 (depends on 15) The multilayer capacitor of claim 15, wherein the conductive connecting portions include two or more materials from a group consisting of tin, lead, indium, copper, silver, and bismuth. ### Claim 19 (depends on 15) The multilayer capacitor of claim 15, wherein the metal particles of the conductive resin layer include at least one material from a group consisting of copper, nickel, silver, copper coated with silver, and copper coated with tin. ### Claim 20 (depends on 15) The multilayer capacitor of claim 15, wherein the internal electrode includes nickel, and the intermetallic compound includes nickel-tin (Ni—Sn). ### Claim 21 (depends on 15) The multilayer capacitor of claim 15, wherein the internal electrode includes one material selected from a group consisting of nickel, copper, and palladium, or alloys thereof. ### Claim 22 (depends on 15) The multilayer capacitor of claim 15, wherein the metal particles of the conductive resin layer have spherical shapes, flake shapes, or a mixture of spherical shapes and flake shapes. ### Claim 23 (depends on 15) The multilayer capacitor of claim 15, wherein the first and second external electrodes respectively include connection portions on the third and fourth surfaces of the body, and each include band portions extending from the connection portions to the first, second, fifth, and sixth surfaces of the body. ### Claim 24 (depends on 15) The multilayer capacitor of claim 15, wherein the first electrode layer includes one material from a group consisting of copper, tin, nickel, palladium, and gold or alloys thereof. ### Claim 25 (depends on 15) The multilayer capacitor of claim 15, wherein the first and second external electrodes further include second electrode layers respectively on the first electrode layers. ### Claim 26 (depends on 25) The multilayer capacitor of claim 25, wherein the second electrode layers each include a nickel plating layer and a tin plating layer stacked sequentially on the first electrode layer. ### Claim 27 (depends on 15) The multilayer capacitor of claim 15, wherein the body further comprises upper and lower covers above and below the plurality of first and second internal electrodes, respectively, that include a material that is the same as that of the dielectric layers. ### Claim 28 (depends on 15) The multilayer capacitor of claim 15, wherein the first electrode layers are copper plating layers. ### Claim 29 (depends on 28) The multilayer capacitor of claim 28, wherein the conductive connecting portions include a material having a melting point lower than a hardening temperature of the base resin. ### Claim 30 (depends on 29) The multilayer capacitor of claim 29, wherein a melting point of the material of the conductive connecting portions is 300° C. or less. ### Claim 31 (depends on 28) The multilayer capacitor of claim 28, wherein the conductive connecting portions include two or more materials from a group consisting of tin, lead, indium, copper, silver, and bismuth. ### Claim 32 (depends on 28) The multilayer capacitor of claim 28, wherein the metal particles of the conductive resin layer include at least one material from a group consisting of copper, nickel, silver, copper coated with silver, and copper coated with tin. ### Claim 33 (depends on 28) The multilayer capacitor of claim 28, wherein the internal electrode includes nickel, and the intermetallic compound includes nickel-tin (Ni—Sn). ### Claim 34 (depends on 28) The multilayer capacitor of claim 28, wherein the internal electrode includes one material from a group consisting of nickel, copper, and palladium, or alloys thereof. ### Claim 35 (depends on 28) The multilayer capacitor of claim 28, wherein the metal particles of the conductive resin layer have spherical shapes, flake shapes, or a mixture of spherical shapes and flake shapes. ### Claim 36 (depends on 28) The multilayer capacitor of claim 28, further comprising moisture permeation prevention layers on the first and second surfaces of the body, respectively. ### Claim 37 (depends on 28) The multilayer capacitor of claim 28, wherein the first and second external electrodes respectively include connection portions on the third and fourth surfaces of the body, and each include band portions extending from the connection portions to the first, second, fifth, and sixth surfaces of the body. ### Claim 38 (depends on 28) The multilayer capacitor of claim 28, wherein the first and second external electrodes further include second electrode layers respectively on the first electrode layers. ### Claim 39 (depends on 38) The multilayer capacitor of claim 38, wherein the second electrode layers each include a nickel plating layer and a tin plating layer stacked sequentially on the first electrode layer. ### Claim 40 (depends on 28) The multilayer capacitor of claim 28, wherein the body further comprises upper and lower covers above and below the plurality of the first and second internal electrodes, respectively, that include a material that is the same as that of the dielectric layers. ### Claim 41 A multilayer capacitor, comprising: a body including a plurality of internal electrodes, wherein the plurality of internal electrodes are exposed from the body via a plurality of groove portions in a first surface of the body; an external electrode electrically connected to the plurality of internal electrodes and including a conductive resin layer on the first surface of the body and a first electrode layer on the conductive resin layer; and a moisture permeation prevention layer between the body and the conductive resin layer of the external electrode, wherein the body includes intermetallic compounds in the plurality of groove portions and in contact with the respective plurality of internal electrodes, and wherein the conductive resin layer includes a base resin and conductive connecting portions electrically connecting the first electrode layer to the intermetallic compounds in the plurality of groove portions. ### Claim 42 (depends on 41) The multilayer capacitor of claim 41, wherein the conductive resin layer of the external electrode further includes a plurality of metal particles, and wherein the conductive connecting portions surround the plurality of metal particles. ### Claim 43 (depends on 41) The multilayer capacitor of claim 41, wherein the conductive connecting portions include a material with a melting point lower than a hardening temperature of the base resin. ### Claim 44 (depends on 41) The multilayer capacitor of claim 41, further comprising a moisture permeation prevention layers respectively on second and third opposing surfaces of the body both connected to the first surface of the body. ### Claim 45 A method of manufacturing a multilayer capacitor, comprising the steps of: forming a body by stacking and sintering a plurality of ceramic green sheets on which internal electrodes are printed; applying a conductive resin composite on opposing surfaces of the body to form a conductive resin layer, the conductive resin composite including first metal particles covered by oxide films, second metal particles comprising low melting point metal and covered by oxide films, and a base resin; removing the oxide films to allow the low melting point metal to flow within the conductive resin layer; forming a first electrode layer on the conductive resin layer. ### Claim 46 (depends on 25) The method of manufacturing a multilayer capacitor of claim 25, wherein a plurality of groove portions are formed in a first surface of the body and the low melting point metal flows into the plurality of groove portions. ### Claim 47 (depends on 25) The method of manufacturing a multilayer capacitor of claim 25, wherein sizes of the second metal particles are within a range from 0.2 μm to 20 μm. ### Claim 48 (depends on 25) The method of manufacturing a multilayer capacitor of claim 25, a melting point of the low melting point metal is 300° C. or less, and a hardening temperature of the base resin is higher than the melting point of the low melting point metal.