# US 10,319,501 B2 · Chip resistor

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- Number: US 10,319,501 B2
- Document ID: US10319501B2
- Status: Granted
- Kind: B2
- Application number: 15/107,079
- Filed: 2015-02-02
- Published: 2016-11-24
- Granted: 2019-06-11
- Earliest claimed: 2014-02-27
- Assignees: Panasonic Intellectual Property Management Co., Ltd.
- Applicants: Panasonic Intellectual Property Management Co., Ltd.
- Inventors: Masaaki Itou
- Web page: https://patentgrep.com/patent/US10319501B2

## CPC

- H01C 1/084: using self-cooling, e.g. fins, heat sinks
- G01R 1/203: {Resistors used for electric measuring, e.g. decade resistors standards, resistors for comparators, series resistors, shunts (resistors in general H01C; microwave or radiowave terminations H01P1/26; coupling devices H01R)}
- H01C 1/028: the resistive element being embedded in insulation with outer enclosing sheath
- H01C 7/003: {Thick film resistors}
- H01C 7/06: including means to minimise changes in resistance with changes in temperature
- H01C 1/14: Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
- H01C: RESISTORS
- G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12)

## Abstract

A chip resistor includes a resistive element, a pair of electrodes, and heat radiator plates. The resistive element is made of a plate-shaped metal. The pair of electrodes is formed on both ends of a first surface of the resistive element. The heat radiator plates are fastened to a second surface of the resistive element and are disposed spaced apart from each other via a gap therebetween.

## Claims

### Claim 1

A chip resistor comprising:
a resistive element of a plate-shaped metal;
first and second electrodes formed at both ends of a first surface of the resistive element; and
a plurality of heat radiator plates fastened to a second surface of the resistive element,
wherein the plurality of heat radiator plates includes a first heat radiator plate closest to the first electrode and a second heat radiator plate closest to the second electrode and are disposed spaced apart from each other via a gap therebetween, and
the second heat radiator plate has a heat conductivity different from a heat conductivity of the first heat radiator plate.

### Claim 2 (depends on 1)

The chip resistor according to claim 1, further comprising an upper-layer heat radiator plate laminated on the first heat radiator plate and the second heat radiator plate.

### Claim 3 (depends on 1)

The chip resistor according to claim 1, further comprising:
a first upper-layer heat radiator plate laminated on the first heat radiator plate; and
a second upper-layer heat radiator plate laminated on the second heat radiator plate and thermally coupled with the first upper-layer heat radiator plate.

### Claim 4 (depends on 1)

The chip resistor according to claim 1,
wherein the first electrode is thermally coupled with the first heat radiator plate, and
wherein the second electrode is thermally coupled with the second heat radiator plate.

### Claim 5 (depends on 1)

The chip resistor according to claim 1, wherein a gap between the first heat radiator plate and the second heat radiator plate is away from a center line of the resistive element.

### Claim 6 (depends on 1)

The chip resistor according to claim 1, wherein each of the plurality of heat radiator plates has a roughened surface.

### Claim 7 (depends on 1)

The chip resistor according to claim 1, wherein each of the plurality of heat radiator plates includes a ceramic plate having a first surface stuck onto the second surface of the resistive element and a second surface opposite to the first surface; and a metal layer provided on the second surface of the ceramic plate.

### Claim 8

A chip resistor comprising:
a resistive element of a plate-shaped metal and provided with a trimming groove;
a pair of electrodes formed at both ends of a first surface of the resistive element; and
a heat radiator plate fastened to a second surface of the resistive element and covering at least a part provided with the trimming groove, the heat radiator plate including a first heat radiator plate and a second heat radiator plate,
wherein an end of the heat radiator plate agrees with an outer perimeter of the part provided with the trimming groove in a planar view,
an adhesive layer is disposed between each of the first and second heat radiator plates and the resistive element in sectional view,
the adhesive layer comes in direct contact with the first heat radiator plate and the second heat radiator plate and the resistive element, and
the second heat radiator plate has a heat conductivity different from a heat conductivity of the first heat radiator plate.