# US 10,319,500 B2 · Superconducting wire material having laminated structure and manufacturing method therefor

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- Number: US 10,319,500 B2
- Document ID: US10319500B2
- Status: Granted
- Kind: B2
- Application number: 14/900,103
- Filed: 2013-12-10
- Published: 2016-06-02
- Granted: 2019-06-11
- Earliest claimed: 2013-06-28
- Assignees: Korea Electrotechnology Research Institute
- Applicants: Korea Electrotechnology Research Institute
- Inventors: Rock Kil Ko; Seog Whan Kim; Young Sik Jo; Dong Woo Ha
- Web page: https://patentgrep.com/patent/US10319500B2

## CPC

- H01B 13/0036: {Details}
- B23K 1/0016: {Soldering of electronic components}
- B23K 1/19: taking account of the properties of the materials to be soldered
- B23K 1/20: Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K 26/362: Laser etching
- B23K 26/364: for making a groove or trench, e.g. for scribing a break initiation groove
- B23K 26/402: involving non-metallic material, e.g. isolators
- H01B 12/06: Films or wires on bases or cores
- H10N 60/0632: {Intermediate layers, e.g. for growth control}
- B23K 2101/32: Wires
- B23K 2101/38: Conductors
- B23K 2103/12: Copper or alloys thereof
- B23K 2103/26: {Alloys of Nickel and Cobalt and Chromium}
- B23K 2103/50: {Inorganic materials other than metals or composite materials}
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR

## Abstract

Disclosed is a method for manufacturing a superconducting wire material having a laminated structure. The present invention provides a method for manufacturing a laminated superconducting wire material, comprising the steps of: providing a deposition substrate having a predetermined width; sequentially forming, on the deposition substrate, a laminated structure including a buffer layer, a superconducting layer and a stabilization layer, thereby forming, on both sides of the deposition substrate, regions in which a metal substrate is exposed in the width direction; providing a lamination substrate, having a width corresponding to the deposition substrate, to the laminated structure; and providing solder to the regions, in which the metal substrate is exposed, to thereby bond the deposition substrate and the lamination substrate.

## Claims

### Claim 1

A superconducting wire material comprising:
a deposition substrate having a first width;
a laminated structure comprising a buffer layer, a superconducting layer and a stabilization layer sequentially disposed on the deposition substrate, the buffer layer being disposed directly on the deposition substrate, the laminated structure having a second width which is smaller than the first width and recessed spaces at both ends in a width direction;
a lamination substrate having a third width that is substantially the same as the first width of the deposition substrate; and
a solder filling the recessed spaces thereby soldering the deposition substrate with the lamination substrate,
wherein the stabilization layer includes first and second layers, the first layer including any one of gold, silver, platinum, palladium, and a combination thereof, the second layer including any one of copper, aluminum, and a combination thereof.

### Claim 2 (depends on 1)

The superconducting wire material of claim 1, wherein the lamination substrate comprises one material selected from the group consisting of stainless steel, a copper alloy and a nickel alloy.

### Claim 3 (depends on 1)

The superconducting wire material of claim 1, wherein the solder comprises at least one metal selected from the group consisting of silver, lead, tin, bismuth, aluminum, zinc and indium, or an alloy thereof.