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AssigneeSiemens Aktiengesellschaft
InventorsDominikus Joachim Müller, Florian Poprawa, Abdellatif Zanati
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The invention relates to a sensor (300) for determining a dielectric property of a medium (205). The sensor (300) has a substrate (301, 302), which has at least one via (203, 204), and a waveguide (12), which is arranged so as to be planar in relation to an upper surface of the substrate (301). The waveguide (12) can be connected to an analysis device (20) by means of the at least one via (203, 204). Furthermore, the waveguide (12) is designed to receive an input signal from the analysis device (20) and to output an output signal to the analysis device (20). When of the waveguide (12) is in contact with a medium (205), properties of the input signal and of the output signal are indicative of the dielectric property of the medium (205). The arrangement of the waveguide (12) so as to be planar in relation to the substrate (301) enables larger measurement ranges and improved measurement accuracies. Furthermore, a compact construction is achieved by the planar structure. The invention further relates to a sensor arrangement and a method for determining a dielectric property of a medium by means of a sensor.
A sensor for determining a dielectric property of a medium, the sensor comprising:
A sensor arrangement for determining a dielectric property of a medium, the sensor arrangement comprising:
A method for determining a dielectric property of a medium by a sensor, wherein the sensor comprises a substrate having at least one plated-through hole, an upper substrate layer, a lower substrate layer, and a ground layer, wherein each substrate layer of the upper substrate layer and lower substrate layer comprises a same dielectric material, and wherein the ground layer is arranged between the upper substrate layer and the lower substrate layer, and a waveguide arranged in a planar manner in relation to an upper surface of the substrate, wherein the waveguide is connectable to an analysis device via the at least one plated-through hole, the method comprising:
Dependencies are inferred from the claim text.