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US 10,316,187 B2Granted
Resin composition, prepreg, metal-clad laminated plate, and wiring board
AssigneeKYOCERA Corporation
InventorChie Chikara
Life of this patent
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Abstract
A resin composition of the present disclosure contains an ingredient (A) that is a polyphenylene ether whose hydroxyl group bonded to a terminal of a main chain is modified with an ethylenically unsaturated compound, an ingredient (B) that is an olefin resin containing a hydroxyl group or carboxyl group, an ingredient (C) that is at least one kind selected from among triallyl isocyanurate and triallyl cyanurate, and an ingredient (D) that is an organic peroxide.
Claims7
A resin composition comprising:
- an ingredient (A) that is a polyphenylene ether whose hydroxyl group bonded to a terminal of a main chain is modified with an ethylenically unsaturated compound;
- an ingredient (B) that is an olefin resin having a hydroxyl group or a carboxyl group;
- an ingredient (C) that is at least one kind of triallyl isocyanurate and triallyl cyanurate;
- and
- an ingredient (D) that is an organic peroxide, and
- wherein the ingredient (B) is contained in an amount of 2.0-10.0% by mass when a total amount of the ingredient (A), the ingredient (B), the ingredient (C), and the ingredient (D) ((A)+(B)+(C)+(D)) is 100% by mass.
3 more elements
Dependencies are inferred from the claim text.