Methods and system for controlling a surface profile of a wafer

A method for controlling a surface profile of a wafer during a cutting operation of an ingot, the method comprising:

• initiating the cutting operation on the ingot using a wire saw to produce the wafer;
• measuring, in real-time during the cutting operation, an amount of displacement of a sidewall of a frame of the wire saw, the sidewall connected to a bearing of a wire guide supporting a wire web in the wire saw;
• determining, in real-time during the cutting operation, an amount of pressure for adjusting a position of the sidewall based on the measured amount of displacement of the sidewall;
• and
• applying, in real-time during the cutting operation, the determined amount of pressure to the sidewall with a mechanical actuator, wherein the application of the determined amount of pressure facilitates counteracting the measured amount of displacement of the sidewall.

A system for controlling a surface profile of a wafer sliced from an ingot with a wire saw, the system comprising:

• a sensor for measuring an amount of displacement of a sidewall of a frame of the wire saw, the sidewall connected to a bearing of a wire guide supporting a wire web in the wire saw;
• a mechanical actuator connected to the sidewall;
• and
• a computing device connected in communication to the sensor and the mechanical actuator, the computing device comprising a memory and a processor, the processor configured to:
• store, in the memory, the measured amount of displacement of the sidewall as displacement data;
• determine a pressure profile for adjusting a position of the sidewall based on the stored displacement data of the sidewall;
• and
• transmit a control signal to the mechanical actuator to apply pressure to the sidewall with the mechanical actuator according to the determined pressure profile to control the position of the sidewall.