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US 10,314,215 B2Granted
Electrical shielding material composed of metallized stainless steel monofilament yarn
AssigneeMicrometal Technologies, Inc.
InventorsThomas F. Burke, James E. Haller
Life of this patent
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Abstract
A yarn or multi-fiber formed of a plurality of micron diameter stainless steel monofilaments which have been rendered more conductive by one or more coatings of electrolytically-deposited metal or metal alloy materials. The metallized yarn provided by the invention has a very low electrical resistance, with consequent benefit in electrical performance, and is particularly useful as an RFI/EMI shielding material.
Claims34
An RFI/EMI shield material composed of a conductive multi-fiber comprising:
- a plurality of metallized monofilaments having a low twist,
- each monofilament including:
- a stainless steel micron diameter monofilament;
- a. an electroplated layer of copper deposited from a cyanide-copper or pyrophosphate copper solution, and completely and substantially uniformly electroplated on the stainless steel filament;
- b. an electroplated layer of a copper deposited from an acid copper solution and completely and substantially uniformly electroplated on the electroplated layer of copper specified in clause a;
- c. an electroplated layer of metal or metal alloy completely and substantially uniformly electroplated on the electroplated layer of copper specified in clause b and which is resistant to oxidation and corrosion or to which solder can bond;
- d. wherein the complete and substantially uniform electroplating of the layers specified in clauses a, b and c are produced by low tension transport of said multi-fiber through electroplating process stations;
- and
- e. wherein the twist in no more than 1 turn/inch.
6 more elements
An RFI/EMI shield material composed of a conductive multi-fiber comprising:
- a plurality of metallized monofilaments having a low twist, each monofilament including:
- a stainless steel micron diameter monofilament;
- a. an electroplated layer of copper deposited from a cyanide-copper or pyrophosphate copper solution, and completely and substantially uniformly electroplated on the stainless steel filament;
- b. an electroplated layer of a copper deposited from an acid copper solution and completely and substantially uniformly electroplated on the electroplated layer of copper specified in clause a;
- c. an electroplated layer of metal or metal alloy completely and substantially uniformly electroplated on the electroplated layer of copper specified in clause b and which is resistant to oxidation and corrosion or to which solder can bond;
- d. wherein the complete and substantially uniform electroplating of the layers specified in clauses a, b and c are produced by low tension transport of said multi-fiber through electroplating process stations;
- and
- e. wherein the plurality of metallized monofilaments are untwisted.
5 more elements
An RFI/EMI shield material composed of a conductive multi-fiber comprising:
- a plurality of metallized monofilaments having a low twist, each monofilament including:
- a. an electroplated layer of copper deposited from a cyanide copper or pyrophosphate-copper solution, and completely and substantially uniformly electroplated on the stainless steel monofilament;
- b. an electroplated layer of metal or metal alloy completely and substantially uniformly electroplated on the electroplated layer of copper specified in clause a and which is resistant to oxidation and corrosion or to which solder can bond;
- c. wherein the complete and substantially uniform electroplating of the layers specified in clauses a and b are produced by low tension transport of said multi-fiber through electroplating process stations;
- and
- d. wherein the twist is no more than 1 turn/inch.
3 more elements
An RFI/EMI shield material composed of a conductive multi-fiber comprising:
- a plurality of metallized monofilaments having a low twist, each monofilament including:
- a. an electroplated layer of copper deposited from a cyanide copper or pyrophosphate-copper solution, and completely and substantially uniformly electroplated on the stainless steel monofilament;
- b. an electroplated layer of metal or metal alloy completely and substantially uniformly electroplated on the electroplated layer of copper specified in clause a and which is resistant to oxidation and corrosion or to which solder can bond;
- c. wherein the complete and substantially uniform electroplating of the layers specified in clauses a and b are produced by low tension transport of said multi-fiber through electroplating process stations;
- and
- d. wherein the plurality of metallized monofilaments are untwisted.
3 more elements
Dependencies are inferred from the claim text.