Vapor chamber with electromagnetic shielding function
AssigneeGetac Technology Corporation
InventorPing-Wei Lee
Life of this patent
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Abstract
A vapor chamber with electromagnetic shielding function is for dissipating the heat generated by an electronic component. The vapor chamber includes a capillary structure, a support structure, and a working fluid. The vapor chamber includes an extension portion and a frame, and the extension portion extends from the main body of the vapor chamber and has a first coupling structure. The frame has side walls to surround the electronic component in a plane, and a second coupling structure is disposed on each of the side walls. The first coupling structure is engaged with the second coupling structure, so that the vapor chamber detachably covers the electronic component to perform the electromagnetic shielding function.
Claims17
A cover of a vapor chamber with an electromagnetic shielding function, the vapor chamber including a shielding frame having a second coupling structure, the cover adapted to demountably engage with the shielding frame and to dissipate heat from an electronic component surrounded by the shielding frame, the cover comprising:
- a covering plate disposed over the shielding frame and having an extending portion, wherein the extending portion surrounds the shielding frame, the extending portion comprises a first coupling structure disposed on an inner surface thereof, and the second coupling structure demountably engages with the first coupling structure;
- and
- a co-constructed plate disposed between the covering plate and the shielding frame, wherein the co-constructed plate and the covering plate jointly define a room containing a capillary structure, a supporting structure, and a working fluid, and wherein the co-constructed plate is nested within a space defined by the covering plate.
A cover of a vapor chamber with an electromagnetic shielding function, the vapor chamber including a shielding frame having a second coupling structure, the cover adapted to demountably engage with the shielding frame and to dissipate heat from an electronic component surrounded by the shielding frame, the cover comprising:
- a covering plate disposed over the shielding frame;
- and
- a co-constructed plate disposed between the covering plate and the shielding frame, wherein the co-constructed plate has a first extending portion, the first extending portion surrounds the shielding frame, the first extending portion comprises a first coupling structure disposed on an inner surface thereof, and the second coupling structure demountably engages with the first coupling structure, and wherein the co-constructed plate is nested within a space defined by the covering plate.
Dependencies are inferred from the claim text.