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US 10,314,208 B2Granted
Cooling device, method for producing a cooling device and power circuit
AssigneeContinental Automotive GmbH
InventorsArnoud Smit, Thomas Schmid, Lars Keller, Soeren Rittstieg
Life of this patent
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Abstract
The present disclosure relates to cooling devices. The teachings thereof may be embodied in methods for producing cooling devices and power circuits equipped with a cooling device. Embodiments may include cooling device having an aluminum cooling element; and at least one nickel metal sheet connected to the aluminum cooling element by a solder layer; wherein the cooling device includes a mounting surface formed by a side of the at least one nickel metal sheet facing away from the aluminum cooling element.
Claims9
A cooling device comprising:
- an aluminum cooling element;
- a nickel metal sheet soldered directly to the aluminum cooling element, wherein the nickel metal sheet contains at least 95% by mass of nickel and the nickel metal sheet has a thickness of at least 200 μm;
- and
- a mounting surface defined by a side of the nickel metal sheet facing away from the aluminum cooling element.
1 more element
A power circuit comprising:
- an aluminum cooling element;
- a nickel metal sheet directly soldered to the aluminum cooling element, wherein the nickel metal sheet contains at least 95% by mass nickel and the nickel metal sheet has a thickness of at least 200 μm;
- wherein the power circuit includes a mounting surface defined by a side of the nickel metal sheet facing away from the cooling element;
- a printed circuit board with a conductive layer applied on both sides, the printed circuit board connected to the nickel metal sheet by a solder layer;
- and
- at least one semiconductor mounted on the printed circuit board on a side of the printed circuit board facing away from the nickel metal sheet.
3 more elements
Dependencies are inferred from the claim text.