Back to results
US 10,314,203 B1Granted
Apparatuses, systems, and methods for cooling electronic components
AssigneeJuniper Networks, Inc.
InventorAlexander I. Yatskov
Life of this patent
Estimating the term…
Abstract
The disclosed apparatus may include a fluid-cooled plate that may be thermally coupled to a first electronic component for cooling the first electronic component by way of a cooling fluid, and a gas-cooled plate physically coupled to the fluid-cooled plate. The gas-cooled plate may be thermally coupled to a second electronic component for cooling the second electronic component by way of a gas. The gas-cooled plate may be separated from the fluid-cooled plate by a gap. Various other apparatuses, systems, and methods are also disclosed.
Claims20
An apparatus comprising:
- a fluid-cooled plate that is thermally coupled to a first electronic component for cooling the first electronic component by way of a cooling fluid;
- and
- a gas-cooled plate physically coupled to the fluid-cooled plate, wherein the gas-cooled plate:
- is thermally coupled to a second electronic component for cooling the second electronic component by way of a gas;
- and
- is separated from the fluid-cooled plate by a gap.
3 more elements
A system comprising:
- a fluid-cooling system comprising:
- a fluid-cooled plate for cooling at least a first electronic component;
- a conduit for directing a fluid through the fluid-cooled plate;
- and
- a condenser for condensing a gaseous portion of the fluid within the conduit;
- a gas-cooling system comprising:
- a gas-cooled plate for cooling at least a second electronic component, wherein the gas-cooled plate is coupled to the fluid-cooled plate and separated from the fluid-cooled plate by a gap;
- and
- at least one bank of fins extending laterally outward from the gas-cooled plate;
- and
- a gas-flow generator positioned and oriented to direct gas across the bank of fins and the condenser.
8 more elements
A method comprising:
- physically coupling a fluid-cooled plate and a gas-cooled plate to one another while maintaining a certain gap between the fluid-cooled plate and the gas-cooled plate;
- thermally coupling the fluid-cooled plate to a first electronic component to enable the fluid-cooled plate to cool the first electronic component by way of a fluid;
- and
- thermally coupling the gas-cooled plate to a second electronic component adjacent to the first electronic component to enable the gas-cooled plate to cool the second electronic component by way of a gas.
1 more element
Dependencies are inferred from the claim text.