Air-cooling heat dissipation device and system

An air-cooling heat dissipation system for removing heat from an electronic component, the air-cooling heat dissipation system comprising plural air-cooling heat dissipation devices which are located near the electronic component, wherein each of the plural air-cooling heat dissipation devices comprises:

• a base comprising:
• a top surface;
• a bottom surface opposing to the top surface;
• two lateral walls connected between the top surface and the bottom surface;
• an introduction opening formed in the top surface;
• a guiding chamber running through the bottom surface and in communication with the introduction opening;
• and plural discharge grooves formed in one of the lateral walls and in communication with the guiding chamber and oriented toward the electronic component;
• an air pump disposed on the top surface of the base and sealing the edge of the introduction opening;
• and
• a supporting substrate, wherein a portion of the supporting substrate is connected to the bottom surface of the base to close a bottom side of the guiding chamber, and the electronic component is supported on the supporting substrate,
• wherein when the air pump is enabled, an ambient air is introduced into the guiding chamber through the introduction opening and is discharged through the plural discharge grooves such that a lateral air flow is generated and passes over passes over the electronic component to remove heat therefrom.