Package module

A package module, comprising:

• a circuit board;
• an electronic component disposed on the circuit board;
• a frame disposed next to at least one side of the electronic component, wherein a gap is formed between the frame and the electronic component;
• and
• an encapsulant comprising a first portion covering at least a part of the circuit board and a second portion filling into at least a part of the gap, the first portion being connected to the second portion, the first portion having a first height relative to the circuit board, the second portion having a second height relative to the circuit board,
• wherein the first height and the second height are from highest positions of the first portion and the second portion to the circuit board respectively, a distance between a bottom end of the frame and the circuit board is greater than the first height, and the second height is greater than the first height;
• and
• a housing;
• wherein the electronic component, the frame, and the encapsulant are in the housing;
• and
• wherein the housing comprises an encapsulant injection port;
• wherein a vertical projection of the encapsulant injection port onto the circuit board is overlapped with the electronic component.