Component mounting method
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsShingo Yamada, Takafumi Tsujisawa
Life of this patent
Estimating the term…
Loading patent…
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsShingo Yamada, Takafumi Tsujisawa
Estimating the term…
A component mounting apparatus is configured to mount a component on a substrate. The substrate includes a lower side substrate member, an upper side substrate member provided on an upper surface of the lower side substrate member, a lower side mark provided on the lower side substrate member, and an upper side mark provided on an upper surface of the upper side substrate member. The apparatus includes an upward facing camera configured to image the lower side mark from below the lower side substrate member, a data storage configured to store relative positional relationship data indicating a predetermined relative positional relationship between the lower side mark and the upper side mark, and a component mounting unit configured to mount the component on the upper surface of the upper side substrate member based on the data and information obtained through imaging the lower side mark imaged by the upward facing camera.
A component mounting method comprising:
Dependencies are inferred from the claim text.