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US 10,314,175 B2Granted
Electric connection structure and electric connection member
AssigneeJapan Aviation Electronics Industry, Limited
InventorsJunya Sato, Ryosuke Mitsui
Life of this patent
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Abstract
There is provided an electric connection member having a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect, wherein the electric connection member is provided with a recess that opens at a side of the insulating adhesive layer, the conductive interconnect is disposed in the recess, a metal nano-ink is disposed on the conductive interconnect, and all of the metal nano-ink is contained inside the recess.
Claims16
An electric connection member comprising a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect,
- wherein the electric connection member is provided with a recess that opens at a side of the insulating adhesive layer,
- the conductive interconnect is disposed in the recess,
- a metal nano-ink is disposed on the conductive interconnect, and
- all of the metal nano-ink is contained inside the recess, and
- wherein the metal nano-ink is an encapsulated metal nano-ink that has a plurality of metal nanoparticles covered by a protective agent in a capsule and that forms a conductive thin film upon breaking of the capsule by means of external stimulus.
2 more elements
Dependencies are inferred from the claim text.