Method for manufacturing circuit board
AssigneeWinbond Electronics Corp.
InventorYu-Hsuan Ho
Life of this patent
Estimating the term…
Abstract
A method for manufacturing a circuit board is provided, including providing a substrate. A first inkjet printing step is performed to apply a plurality of ink droplets to the substrate to form a plurality of microstructures arranged along a first direction. The microstructures therebetween form a plurality of recesses extended along a second direction that is different from the first direction. Also, a second inkjet printing step is performed to apply a plurality of conductive ink droplets to the microstructures, wherein the recesses between the microstructures are filled with the conductive ink droplets.
Claims16
A method for manufacturing a circuit board, comprising:
- providing a substrate;
- performing a first inkjet printing step to apply a plurality of ink droplets to the substrate to form a plurality of microstructures arranged along a first direction, wherein the microstructures therebetween form a plurality of recesses extended along a second direction that is different from the first direction;
- and
- performing a second inkjet printing step to apply a plurality of conductive ink droplets to the microstructures, wherein the recesses between the microstructures are filled with the conductive ink droplets;
- wherein the microstructures each have a length in the first direction that is smaller than a diameter of each conductive ink droplet having a spherical structure, wherein the microstructures each have a width in the second direction that is perpendicular to the first direction, and the width is equal to or greater than the diameter of each conductive ink droplet, wherein the length of each of the microstructures is about one-half to three-quarters of the diameter of each of the conductive ink droplets, and the width of each of the microstructures is about one to two times the diameter of each of the conductive ink droplets.
A method for manufacturing a circuit board, comprising:
- providing a substrate;
- performing a first inkjet printing step to apply a plurality of ink droplets to the substrate to form a plurality of microstructures arranged along a first direction, wherein the microstructures therebetween form a plurality of recesses extended along a second direction that is different from the first direction;
- and
- performing a second inkjet printing step to apply a plurality of conductive ink droplets to the microstructures, wherein the recesses between the microstructures are filled with the conductive ink droplets;
- wherein the microstructures each have a length in the first direction that is smaller than a diameter of each conductive ink droplet having a spherical structure, wherein the microstructures each have a width in the second direction that is perpendicular to the first direction, and the width is smaller than the diameter of each conductive ink droplet.
A method for manufacturing a circuit board, comprising:
- providing a substrate;
- performing a first inkjet printing step to apply a plurality of ink droplets to the substrate to form a plurality of first microstructures arranged in a first line along a first direction and a plurality of second microstructures arranged in a second line along the first direction, wherein the first microstructures therebetween form a plurality of first recesses extended along a second direction that is different from the first direction, and the second microstructures therebetween form a plurality of second recesses extended along the second direction, wherein the first microstructures in the first line and the second microstructures in the second line have a spacing therebetween in the second direction and are arranged in a staggered manner;
- and
- performing a second inkjet printing step to apply a plurality of conductive ink droplets to the first and second microstructures, wherein the first recesses between the first microstructures and the second recesses between the second microstructures are filled with the conductive ink droplets.
Dependencies are inferred from the claim text.