Package assembly with hermetic cavity
AssigneeIntel Corporation
InventorsAleksandar Aleksov, Feras Eid, Johanna M. Swan
Life of this patent
Estimating the term…
Abstract
Apparatuses, systems and methods associated with hermetic encapsulation for package assemblies are disclosed herein. In embodiments, a package assembly may include a package substrate that includes a guard ring, wherein the guard ring extends from a surface of the package substrate and around a circumference of a cavity. The package assembly may further include a component coupled to the guard ring by a solder joint along an entirety of the guard ring, wherein the cavity is located between the package substrate and the component and the cavity is hermetically-sealed via the guard ring and the solder joint. Other embodiments may be described and/or claimed.
Claims20
A package assembly, comprising:
- a package substrate that includes a guard ring, wherein the guard ring extends from a surface of the package substrate and around a circumference of a cavity;
- a first component coupled to the guard ring by a solder joint along an entirety of the guard ring, wherein the cavity is located between the package substrate and the first component and the cavity is hermetically-sealed via the guard ring and the solder joint, and wherein the first component comprises at least a portion of a radio frequency (RF) component;
- and
- a second component coupled to the first component and extending from the first component into the cavity, wherein the second component includes a per QS microelectromechanical system (MEMS).
A method of producing a hermetic cavity within a package assembly, comprising:
- forming a guard ring on a surface of a package substrate, wherein the guard ring is to extend around a circumference of the hermetic cavity;
- forming a stability pillar or a stability beam on the surface of the package substrate, wherein the stability pillar or the stability beam is located within the guard ring;
- positioning a component on the guard ring;
- and
- forming a solder joint coupling the guard ring and the component, wherein the solder joint hermetically seals the hermetic cavity.
A computer device, comprising:
- a printed circuit board (PCB);
- and
- a package assembly mounted on the PCB, wherein the package assembly includes:
- a package substrate that includes:
- a guard ring that extends from a surface of the package substrate and around a circumference of a cavity;
- and
- a stability pillar or a stability beam located within the guard ring, wherein the stability pillar or the stability beam extends from the surface of the package substrate
- a component coupled to the guard ring by a solder joint along an entirety of the guard ring, wherein the cavity is located between the package substrate and the component, and the cavity is hermetically-sealed via the guard ring and the solder joint.
Dependencies are inferred from the claim text.