Low crosstalk vertical connection interface
AssigneeXilinx, Inc.
InventorsHong Shi, Siow Chek Tan
Life of this patent
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Abstract
An integrated circuit device having a vertical connection interfaces for coupling stacked components are provided that improve communication between the stacked components. The techniques described herein allow for increased signal connection density while reducing potential for crosstalk. For example, a ground to signal ratio of connections between components in a vertical interface configured to carry ground signals relative to connections configured to carry data signals within a bank of connections has an edge to center gradient which reduces the amount of ground connections needed to meet crosstalk thresholds, while increasing the amount of signal connections available for communication between components across the vertical interface.
Claims20
An integrated circuit device comprising:
- a second integrated circuit component having a surface configured to be stacked below a first integrated circuit component, the second integrated circuit component comprising escape routing terminating at a plurality of first exposed conductors exposed on the surface of the second integrated circuit component, the first exposed conductors arranged in a plurality of rows comprising at least a first row, a second row and a third row all extending through a first bank defined among a portion of the plurality of first exposed conductors, the first row disposed parallel and adjacent to a first edge of the second integrated circuit component, the third row spaced away from the first edge, and the second row disposed between the first row and the third row, wherein a ground to signal ratio of the first exposed conductors configured to carry ground signals relative to the first exposed conductors configured to carry data signals within the first bank is greater in the third row relative to the first row.
An integrated circuit device comprising:
- an integrated circuit component comprising escape routing terminating at a plurality of first exposed conductors exposed on a first surface of the integrated circuit component, the first exposed conductors exposed on the first surface arranged in a plurality of rows extending through a first bank defined among a portion of the plurality of first exposed conductors, wherein a ground to signal ratio of the first exposed conductors configured to carry ground signals relative to the first exposed conductors configured to carry data signals within the first bank has an edge to center gradient.
A method for determining an escape routing, the method comprising:
- inputting a threshold crosstalk tolerance;
- determining a first ground to data signal (GDS) ratio for connections coupled through first vias having a first depth in response to the threshold crosstalk tolerance;
- determining a second GDS ratio for connections coupled through second vias having a second depth in response to the threshold crosstalk tolerance, the first depth greater than the second depth, and the first GDS greater than the second GDS;
- and
- determining a third GDS ratio for connections coupled through third vias having a third depth in response to the threshold crosstalk tolerance, the second depth greater than the third depth, and the second GDS greater than the third GDS.
Dependencies are inferred from the claim text.