Circuit board and on-board structure of semiconductor integrated circuit
AssigneeMitsubishi Electric Corporation
InventorShinji Matsunaga
Life of this patent
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Abstract
A circuit board, on which a packaged semiconductor integrated circuit is to be mounted, includes a substrate, a heat-dissipating connection pad, and a first open area. The substrate includes a substrate body having a main surface, a metal layer located on the main surface, and an insulating layer located on the metal layer. In the heat-dissipating connection pad, the metal layer is exposed from an opening in the insulating layer. The heat-dissipating connection pad is connectable to a heat-dissipating unit of the semiconductor integrated circuit via a bond. In the first open area, the metal layer is exposed from an opening in the insulating layer located outboard with respect to a periphery of the heat-dissipating connection pad.
Claims10
A circuit board on which a packaged semiconductor integrated circuit is to be mounted, said circuit board comprising:
- a substrate including a substrate body having a main surface, a metal layer located on said main surface, and an insulating layer located on said metal layer;
- wherein
- said metal layer includes a heat-dissipating connection pad in which said metal layer is exposed from an opening in said insulating layer, said heat-dissipating connection pad being connectable to a heat-dissipating unit of said semiconductor integrated circuit via a bond;
- said metal layer includes a first open area in which said metal layer is exposed in said insulating layer located outboard at multiple locations with respect to a surrounding periphery of said heat-dissipating connection pad;
- and
- an exposed portion of said insulating layer exists between said opening and said first open area.
A circuit board on which a packaged semiconductor integrated circuit is to be mounted, said circuit board comprising:
- a substrate including a substrate body having a main surface, a metal layer located on said main surface, and an insulating layer located on said metal layer;
- wherein
- said metal layer includes a heat-dissipating connection pad in which said metal layer is exposed from an opening in said insulating layer, said heat-dissipating connection pad being connectable to a heat-dissipating unit of said semiconductor integrated circuit via a bond;
- said metal layer includes a first open area in which said metal layer is exposed in said insulating layer located outboard at multiple locations with respect to a surrounding periphery of said heat-dissipating connection pad;
- said metal layer further includes a second open area in which said metal layer is exposed in said insulating layer located between said heat-dissipating connection pad and said first open area;
- and
- said second open area connects said heat-dissipating connection pad to said first open area.
A circuit board on which a packaged semiconductor integrated circuit is to be mounted, said circuit board comprising:
- a substrate including a substrate body having a main surface, a metal layer located on said main surface, and an insulating layer located on said metal layer;
- wherein
- said metal layer includes a heat-dissipating connection pad in which said metal layer is exposed from an opening in said insulating layer, said heat-dissipating connection pad being connectable to a heat-dissipating unit of said semiconductor integrated circuit via a bond;
- said metal layer includes a first open area in which said metal layer is exposed in said insulating layer located outboard at multiple locations with respect to a surrounding periphery of said heat-dissipating connection pad;
- and
- said metal layer further includes a plurality of second open areas in which said metal layer is exposed in said insulating layer located between said heat-dissipating connection pad and said first open area, such that said second open areas connect said heat-dissipating connection pad to said first open area at different locations with respect to said surrounding periphery of said heat-dissipating connection pad.
A circuit board on which a packaged semiconductor integrated circuit is to be mounted, said circuit board comprising:
- a substrate including a substrate body having a main surface, a metal layer located on said main surface, and an insulating layer located on said metal layer;
- wherein
- said metal layer includes a heat-dissipating connection pad in which said metal layer is exposed from an opening in said insulating layer, said heat-dissipating connection pad being connectable to a heat-dissipating unit of said semiconductor integrated circuit via a bond;
- said metal layer includes a first open area in which said metal layer is exposed in said insulating layer located outboard at multiple locations with respect to a surrounding periphery of said heat-dissipating connection pad;
- said first open area is configured as a plurality of first open area portions in which said metal layer is exposed in said insulating layer at different locations with respect to said surrounding periphery of said heat-dissipating connection pad;
- and
- said metal layer further includes a plurality of second open areas in which said metal layer is exposed in said insulating layer located between said heat-dissipating connection pad and said plurality of first open area portions, such that each of said second open areas connects said heat-dissipating connection pad to a respective one of said first open area portions.
Dependencies are inferred from the claim text.