Printed circuit board heat dissipation system using highly conductive heat dissipation pad
AssigneeLG Chem, Ltd.
InventorsSeung Kyu Yoon, Jun Young Bang
Life of this patent
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Abstract
The present invention presents a printed circuit board heat dissipation system using a highly conductive heat dissipation pad, the heat dissipation system comprising: one or more electronic components mounted on a printed circuit board; the printed circuit board having formed thereon a conductive pattern providing current paths between the mounted one or more electronic components; and a highly conductive heat dissipation pad discharging heat generated due to the current flowing in the conductive pattern of the printed circuit board.
Claims7
A printed circuit board having a heat dissipating system, comprising:
- a printed circuit board having a conductive pattern thereon;
- an electronic component mounted on the printed circuit board, wherein the conductive pattern provides a current path through which a current flows to the electronic component;
- and
- the heat dissipating system comprising a high-conductance heat-dissipating part and a lead part, wherein the lead part electrically contacts a predetermined section of the conductive pattern, the lead part formed of a material having a greater electrical conductivity than the conductive pattern,
- wherein the lead part provides an alternative current path such that the current flows through the lead part and not the predetermined section of the conductive pattern, and
- wherein the high-conductance heat-dissipating part dissipates heat generated due to current flowing through the conductive pattern and the lead part.
A battery charging/discharging circuit having a heat dissipating system, comprising:
- a battery charging/discharging circuit comprising a printed circuit board and a charging/discharging FET mounted on the printed circuit board, wherein the printed circuit board comprising a conductive pattern for providing a path through which a charging/discharging current flows;
- and
- the heat dissipating system comprising a high-conductance heat dissipating part and a lead part, the lead part electrically contacting a predetermined section of the conductive pattern,
- wherein the lead part is formed of a material having an electrical conductivity greater than that of the conductive pattern, wherein the lead part provides an alternative current path such that the charging/discharging current flows through the lead part and not the predetermined section of the conductive pattern, and
- wherein the high-conductance heat-dissipating part dissipates heat generated due to the charging/discharging current flowing through the conductive pattern and the lead part.
Dependencies are inferred from the claim text.