# US 10,313,798 B2 · Electronic device including directional MEMS microphone assembly

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- Number: US 10,313,798 B2
- Document ID: US10313798B2
- Status: Granted
- Kind: B2
- Application number: 15/606,424
- Filed: 2017-05-26
- Published: 2018-09-27
- Granted: 2019-06-04
- Earliest claimed: 2017-03-21
- Assignees: Microsoft Technology Licensing, LLC
- Applicants: Microsoft Technology Licensing, LLC
- Inventors: Kevin Juho Venalainen; Brian W. Aznoe; Dana William Bourke
- Web page: https://patentgrep.com/patent/US10313798B2

## CPC

- H04R 19/04: Microphones (H04R19/01 takes precedence)
- B81B 7/0061: {suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound}
- B81C 1/00309: {suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound}
- H04R 1/04: Structural association of microphone with electric circuitry therefor (in electric hearing aids H04R25/00)
- H04R 1/38: in which sound waves act upon both sides of a diaphragm and incorporating acoustic phase-shifting means, e.g. pressure-gradient microphone
- H04R 19/005: {using semiconductor materials}
- B81B 2201/0257: Microphones or microspeakers
- B81B 2201/058: Microfluidics not provided for in B81B2201/051 - B81B2201/054
- B81B 2203/0315: Cavities
- H04R 1/02: Casings; Cabinets {; Supports therefor;} Mountings therein (H04R1/28 takes precedence {; attachments for microphones H04R1/08; mounting of transducers in earpieces H04R1/1075})
- H04R 1/326: {for microphones (H04R1/34 and H04R1/40 take precedence)}
- H04R 2201/003: Mems transducers or their use
- H04R 2499/15: Transducers incorporated in visual displaying devices, e.g. televisions, computer displays, laptops
- H04R: LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS (producing sounds with frequency not determined by supply frequency G10K)
- B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00)
- B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01)

## Abstract

An electronic device with directional MEMS microphone assembly is provided, including a MEMS microphone capsule with a PCB affixed thereto, and a housing affixed to the PCB. The microphone assembly includes a first internal port and a second internal port through the PCB, wherein the first and second internal ports fluidically communicate with the MEMS microphone capsule. The microphone assembly further includes first and second external ports through the housing, wherein the first external port is offset from the first internal port in an offset direction perpendicular to a thickness direction of the microphone assembly. The microphone assembly further includes first and second cavities located between the PCB and the housing, wherein the first cavity fluidically communicates with the first internal port and the first external port, and the second cavity fluidically communicates with the second internal port and the second external port.

## Claims

### Claim 1

An electronic device, comprising:
a directional micro-electro-mechanical systems (MEMS) microphone assembly including:
a MEMS microphone capsule;
a printed circuit board (PCB) affixed to the MEMS microphone capsule;
a housing affixed to the PCB on a side of the PCB opposite the MEMS microphone capsule;
a first internal port and a second internal port through the PCB, wherein the first internal port and second internal port fluidically communicate with the MEMS microphone capsule;
a first external port and a second external port through the housing, wherein the first external port is offset from the first internal port in an offset direction perpendicular to a thickness direction of the directional MEMS microphone; and
a first cavity and a second cavity located between the PCB and the housing, wherein the first cavity fluidically communicates with the first internal port and the first external port, and the second cavity fluidically communicates with the second internal port and the second external port, wherein:
the first and second internal ports are aligned along an internal port axis; and
the first and second external ports are aligned along an external port axis, wherein the external port axis is rotationally offset from the internal port axis.

### Claim 2 (depends on 1)

The electronic device of claim 1, wherein the offset direction is a first offset direction, and wherein the second external port is offset from the second internal port in a second offset direction that is perpendicular to the thickness direction.

### Claim 3 (depends on 1)

The electronic device of claim 1, further comprising an adhesive gasket layer between the PCB and the housing.

### Claim 4 (depends on 1)

The electronic device of claim 1, further comprising an acoustic mesh located along at least a portion of an acoustic wave path from outside the electronic device to the directional MEMS microphone.

### Claim 5 (depends on 4)

The electronic device of claim 4, wherein the acoustic mesh is positioned in a location selected from the group consisting of the first external port, the second external port, the first cavity, the second cavity, the first internal port, and the second internal port.

### Claim 6 (depends on 1)

The electronic device of claim 1, wherein the first and second external ports are separated by a distance of 10 to 12 millimeters.

### Claim 7 (depends on 1)

The electronic device of claim 1, wherein:
each of the first cavity and the second cavity is L-shaped;
the first and second external ports are offset from the first and second internal ports along the housing in respective opposite directions perpendicular to the thickness direction.

### Claim 8 (depends on 1)

The electronic device of claim 1, wherein the PCB and housing have a combined thickness between 1.8 and 2.4 millimeters, and a distance from an external surface of the housing to an interior surface of the MEMS microphone capsule is between 2.9 and 3.8 millimeters.

### Claim 9 (depends on 1)

The electronic device of claim 1, wherein the first cavity and the second cavity are indentations in the housing.

### Claim 10

A method for manufacturing an electronic device including a directional micro-electro-mechanical systems (MEMS) microphone assembly, the method comprising:
forming a first external port and a second external port in a housing;
forming a first cavity and a second cavity in the housing, wherein the first cavity fluidically communicates with the first external port and the second cavity fluidically communicates with the second external port;
forming a first internal port and a second internal port in a printed circuit board (PCB);
affixing a MEMS microphone capsule to the PCB such that the first internal port and second internal port fluidically communicate with the MEMS microphone capsule; and
affixing the housing to the PCB such that:
the first internal port fluidically communicates with the first cavity;
the second internal port fluidically communicates with the second cavity;
the first external port is offset from the first internal port in an offset direction perpendicular to a thickness direction of the directional MEMS microphone;
the first and second internal ports are aligned along an internal port axis;
the first and second external ports are aligned along an external port axis; and
the external port axis is rotationally offset from the internal port axis.

### Claim 11 (depends on 10)

The method of claim 10, wherein the offset direction is a first offset direction, and wherein the second external port is offset from the second internal port in a second offset direction perpendicular to the thickness direction of the directional MEMS microphone assembly.

### Claim 12 (depends on 10)

The method of claim 10, wherein the first external port, second external port, first cavity, and second cavity are formed by routing.

### Claim 13 (depends on 10)

The method of claim 10, further comprising applying an adhesive gasket layer to the housing and/or PCB, to thereby join the housing to the PCB.

### Claim 14 (depends on 10)

The method of claim 10, further comprising inserting an acoustic mesh into at least a portion of an acoustic wave path between the first and/or second external port and the MEMS microphone capsule.

### Claim 15 (depends on 10)

The method of claim 10, wherein the first and second external ports are separated by a distance of 10 to 12 millimeters.

### Claim 16 (depends on 10)

The method of claim 10, wherein the PCB and housing have a combined thickness between 1.8 and 2.4 millimeters.

### Claim 17 (depends on 10)

The method of claim 10, wherein a distance from an external surface of the housing to an interior surface of the MEMS microphone capsule is between 2.9 and 3.8millimeters.

### Claim 18

An electronic device, comprising:
a directional micro-electro-mechanical systems (MEMS) microphone assembly including:
a MEMS microphone capsule including a first internal port and a second internal port;
a printed circuit board (PCB) affixed to the MEMS microphone capsule;
a housing affixed to the PCB on a side of the PCB adjacent to the MEMS microphone capsule;
a first external port and a second external port through the housing;
a first cavity and a second cavity, wherein a first acoustical path is formed from the first external port, through the first cavity, to the first internal port, and a second acoustical path is formed form the second external port, through the second cavity, to the second internal port; and
a third cavity in the housing sized to accommodate at least a portion of the MEMS microphone capsule that protrudes toward the housing from the PCB, wherein the PCB is affixed to the housing at a location at least partially surrounding a rim or lip of the third cavity, wherein:
the first and second internal ports are aligned along an internal port axis; and
the first and second external ports are aligned along an external port axis, wherein the external port axis is rotationally offset from the internal port axis.