# US 10,313,573 B2 · Portable electronic device and image-capturing module thereof, and carrier assembly thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,313,573 B2 - Document ID: US10313573B2 - Status: Granted - Kind: B2 - Application number: 15/673,874 - Filed: 2017-08-10 - Published: 2018-11-15 - Granted: 2019-06-04 - Earliest claimed: 2017-05-12 - Assignees: Azurewave Technologies, Inc. - Applicants: Azurewave Technologies, Inc. - Inventors: Tseng-Chieh Lee; Kung-An Lin - Web page: https://patentgrep.com/patent/US10313573B2 ## CPC - H04N 23/57: Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices - H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils - H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof - H04N 25/76: Addressed sensors, e.g. MOS or CMOS sensors - H05K 1/181: associated with surface mounted components - H05K 2201/09072: Hole or recess under component or special relationship between hole and component - H05K 2201/10121: Optical component, e.g. opto-electronic component - H05K 2201/10151: Sensor - H05K 2201/10424: Frame holders - H05K 2201/2009: Reinforced areas, e.g. for a specific part of a flexible printed circuit - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract The present invention provides a portable electronic device, and an image-capturing module thereof and a carrier assembly thereof. The image-capturing module includes a circuit substrate, an image-sensing chip, at least one electronic component, a package structure, and a lens assembly. The circuit substrate has a top surface and a bottom surface. The image-sensing chip is electrically connected to the circuit substrate, and the image-sensing chip has an image-sensing area. The at least one electronic component is disposed on the top surface of the circuit substrate and electrically connected to the circuit substrate. The package structure is disposed on the top surface of the circuit substrate to cover the at least one electronic component. The lens assembly includes a holder structure disposed on the package structure and a lens structure held by the holder structure and corresponding to the image-sensing area. ## Claims ### Claim 1 An image-capturing module, comprising: a circuit substrate having a top surface and a bottom surface; an image-sensing chip electrically connected to the circuit substrate, wherein the image-sensing chip has an image-sensing area; at least one electronic component disposed on the top surface of the circuit substrate and electrically connected to the circuit substrate; a package structure disposed on the top surface of the circuit substrate and in contact with the at least one electronic component; a lens assembly including a holder structure disposed on the package structure and a lens structure held by the holder structure and corresponding to the image-sensing area; and a reinforcing structure disposed on the bottom surface of the circuit substrate to surround the image-sensing chip, a thickness of the reinforcing structure being greater than a thickness of the image-sensing chip, wherein the reinforcing structure includes a reinforcing board surrounding the image-sensing chip and a receiving space passing through the reinforcing structure, and the whole image-sensing chip is received inside the receiving space of the reinforcing structure. ### Claim 2 (depends on 1) The image-capturing module of claim 1, further comprising a filter element disposed on one of the circuit substrate, the image-sensing chip and the package structure, and the filter element being disposed between the image-sensing chip and the lens structure, wherein the circuit substrate has a through opening connected between the top surface and the bottom surface of the circuit substrate, the image-sensing chip is disposed on the bottom surface of the circuit substrate, and the image-sensing area of the image-sensing chip faces the through opening of the circuit substrate. ### Claim 3 (depends on 2) The image-capturing module of claim 2, wherein the package structure has a flattening surface, and the holder structure is disposed on the flattening surface of the package structure without contacting the circuit substrate, and wherein the package structure has a single package body and a light-transmitting window passing through the single package body and being communicated with the through opening, and the single package body has a surrounding light-guiding surface disposed inside the light-transmitting window. ### Claim 4 (depends on 2) The image-capturing module of claim 2, wherein the package structure has a dustproof coating disposed on an outer surface thereof, and the holder structure is disposed on the dustproof coating of the package structure without contacting the circuit substrate, and wherein the package structure has a single package body and a light-transmitting window passing through the single package body and being communicated with the through opening, and the single package body has a surrounding light-guiding surface disposed inside the light-transmitting window. ### Claim 5 A carrier assembly, comprising: a circuit substrate for carrying at least one electronic component, wherein the at least one electronic component is electrically connected to the circuit substrate; a package structure disposed on the circuit substrate and in contact with the at least one electronic component; a holder structure disposed on the package structure; and a reinforcing structure disposed on the circuit substrate, the package structure and the reinforcing structure being disposed on two opposite surfaces of the circuit substrate, wherein the package structure has a dustproof coating disposed on an outer surface thereof, and the holder structure is disposed on the dustproof coating of the package structure without contacting the circuit substrate, and wherein the package structure has a single package body and a light-transmitting window passing through the single package body, and the single package body has a surrounding light-guiding surface disposed inside the light-transmitting window. ### Claim 6 A portable electronic device using an image-capturing module, characterized in that the image-capturing module comprises: a circuit substrate having a top surface and a bottom surface; an image-sensing chip electrically connected to the circuit substrate, wherein the image-sensing chip has an image-sensing area; at least one electronic component disposed on the top surface of the circuit substrate and electrically connected to the circuit substrate; a package structure disposed on the top surface of the circuit substrate and in contact with the at least one electronic component; a lens assembly including a holder structure disposed on the package structure and a lens structure being held by the holder structure and corresponding to the image-sensing area; and a reinforcing structure disposed on the bottom surface of the circuit substrate to surround the image-sensing chip, and a thickness of the reinforcing structure is greater than a thickness of the image-sensing chip, wherein the reinforcing structure includes a reinforcing board surrounding the image-sensing chip and a receiving space passing through the reinforcing structure, and the whole image-sensing chip is received inside the receiving space of the reinforcing structure. ### Claim 7 (depends on 6) The portable electronic device of claim 6, wherein the image-capturing module further comprises a filter element disposed on one of the circuit substrate, the image-sensing chip and the package structure, and the filter element is disposed between the image-sensing chip and the lens structure, and wherein the circuit substrate has a through opening connected between the top surface and the bottom surface of the circuit substrate, the image-sensing chip is disposed on the bottom surface of the circuit substrate, and the image-sensing area of the image-sensing chip faces the through opening of the circuit substrate.