# US 10,313,567 B2 · Camera module and electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,313,567 B2 - Document ID: US10313567B2 - Status: Granted - Kind: B2 - Application number: 15/664,687 - Filed: 2017-07-31 - Published: 2017-12-14 - Granted: 2019-06-04 - Earliest claimed: 2012-06-29 - Assignees: Sony Corporation - Applicants: Sony Corporation - Inventors: Toshihide Ueno; Tomomi Kume; Masahiko Shimizu - Web page: https://patentgrep.com/patent/US10313567B2 ## CPC - H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils - H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof - H04N 23/57: Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices - H10F 39/804: {Containers or encapsulations} - H10F 39/806: {Optical elements or arrangements associated with the image sensors} - H10W 72/075: {of bond wires} - H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements} - H10W 72/932: {Plan-view shape, i.e. in top view} - H10W 72/951: {Materials of bond pads} - H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract The present invention relates to a camera module in which a thin camera module can be realized at a low cost and an electronic device. The camera module includes a lens unit that stores a lens that condenses light on a light receiving surface of an image sensor; a rigid substrate on which the image sensor is disposed; and a flexible substrate electrically connected with the rigid substrate, wherein in the case where the light receiving surface of the image sensor locates at the top, the lens unit, the flexible substrate, and the rigid substrate are disposed in this order from the top. ## Claims ### Claim 1 A camera module, comprising: a lens unit that includes a lens, wherein the lens is configured to condense light on a light receiving surface of an image sensor; a rigid substrate, wherein the image sensor is on the rigid substrate; a flexible substrate electrically connected to the rigid substrate; a first electrode pad of the image sensor; and an embedded electrode embedded in the flexible substrate, wherein the embedded electrode is connected to the first electrode pad, wherein the light receiving surface of the image sensor faces the lens unit, wherein the lens unit, the flexible substrate, and the rigid substrate are arranged in this order from a side of the lens unit; and wherein, in the rigid substrate of a square shape, a solder resist is absent in a band-shaped region that has a specified distance from an end of one side of the rigid substrate. ### Claim 2 (depends on 1) The camera module according to claim 1, wherein the rigid substrate overlaps a portion of the flexible substrate in an overlap of a band shape that has the specified distance from the end of the one side of the rigid substrate, and the rigid substrate is attached to the flexible substrate. ### Claim 3 (depends on 2) The camera module according to claim 2, wherein a region of the overlap corresponds to the band-shaped region that has a width of one of 2.4 mm or less. ### Claim 4 (depends on 2) The camera module according to claim 2, wherein the flexible substrate includes a region of the overlap, and a reinforced region in which the flexible substrate overlaps the rigid substrate. ### Claim 5 (depends on 4) The camera module according to claim 4, wherein the reinforced region extends in a parallel direction along two sides of the image sensor, and wherein the image sensor has a square shape. ### Claim 6 (depends on 4) The camera module according to claim 4, wherein the reinforced region extends in a parallel direction along one side of the image sensor, and wherein the image sensor has a square shape. ### Claim 7 (depends on 1) The camera module according to claim 1, wherein the lens unit further includes a groove, and the groove accommodates an end portion of the flexible substrate. ### Claim 8 (depends on 1) The camera module according to claim 1, further comprising a frame between the lens unit and the flexible substrate. ### Claim 9 (depends on 8) The camera module according to claim 8, wherein the frame includes a groove, and the groove accommodates an end portion of the flexible substrate. ### Claim 10 (depends on 1) The camera module according to claim 1, wherein the flexible substrate comprises a multilayer structure, and the embedded electrode comprises a metal embedded in an opening in each of a plurality of layers of the multilayer structure of the flexible substrate. ### Claim 11 (depends on 1) The camera module according to claim 1, wherein the flexible substrate includes a second electrode pad, the flexible substrate comprises a multilayer structure, the second electrode pad comprises a metal embedded in an opening in an uppermost layer of a plurality of layers of the multilayer structure of the flexible substrate, and the first electrode pad of the image sensor is connected to the second electrode pad of the flexible substrate by a wire bonding process. ### Claim 12 (depends on 1) The camera module according to claim 1, wherein the first electrode pad of the image sensor and a stud bump that protrudes on the rigid substrate are connected by a wire bonding process. ### Claim 13 (depends on 12) The camera module according to claim 12, wherein the flexible substrate, that comprises a multilayer structure, includes an opening in each of a plurality of layers of the multilayer structure of the flexible substrate, and the stud bump is on a third electrode pad of the rigid substrate, at a position that corresponds to the opening. ### Claim 14 (depends on 1) The camera module according to claim 1, wherein the flexible substrate, that comprises a multilayer structure, includes a first opening in each of a plurality of layers of the multilayer structure of the flexible substrate and a second opening in an uppermost layer of the plurality of layers of the multilayer structure of the flexible substrate in a region connected with the first electrode pad of the image sensor by a wire bonding process. ### Claim 15 (depends on 1) The camera module according to claim 1, wherein the first electrode pad of the image sensor is connected to a third electrode pad of a plurality of third electrode pads of the rigid substrate by a wire bonding process, and the third electrode pad of the rigid substrate is common to a first connection terminal of a plurality of connection terminals on the rigid substrate to electrically connect the flexible substrate. ### Claim 16 (depends on 15) The camera module according to claim 15, wherein, among the plurality of third electrode pads and the plurality of connection terminals of the rigid substrate on a plurality of sides of the rigid substrate, one of the plurality of third electrode pads or a second connection terminal of a plurality of connection terminals on the one side of the rigid substrate are common. ### Claim 17 (depends on 16) The camera module according to claim 16, wherein, among the plurality of connection terminals of the rigid substrate present on the one side, a third connection terminal of a plurality of connection terminals in a center portion of the one side is common to a corresponding third electrode pad of the plurality of third electrode pads. ### Claim 18 (depends on 15) The camera module according to claim 15, wherein the first connection terminal, which is common to the third electrode pad, is connected to wiring inside the rigid substrate through a via. ### Claim 19 A method for manufacturing a camera module, the method comprising: connecting a flexible substrate with a rigid substrate; and placing a lens unit on the rigid substrate, wherein the lens unit includes a lens configured to condense light on a light receiving surface of an image sensor, wherein in an overlap region of a band shape having a specified distance from an end of one side of the rigid substrate, the rigid substrate overlaps a portion of the flexible substrate and the rigid substrate is attached to the flexible substrate, wherein, in the rigid substrate of a square shape, a solder resist is absent in the overlap region of the band shape, and wherein an electrode pad of the image sensor is connected to an embedded electrode embedded in the flexible substrate. ### Claim 20 An electronic device, comprising: a camera module including: a lens unit that includes a lens, wherein the lens is configured to condense light on a light receiving surface of an image sensor; a rigid substrate, wherein the image sensor is on the rigid substrate; a flexible substrate electrically connected to the rigid substrate; an electrode pad of the image sensor; and an embedded electrode embedded in the flexible substrate, wherein the embedded electrode is connected to the electrode pad, wherein the light receiving surface of the image sensor faces the lens unit, wherein the lens unit, the flexible substrate, and the rigid substrate are arranged in this order from a side of the lens unit; and wherein, in the rigid substrate of a square shape, a solder resist is absent in a band-shaped region that has a specified distance from an end of one side of the rigid substrate.