# US 10,312,884 B2 · Oscillation module, electronic apparatus, and moving object

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- Number: US 10,312,884 B2
- Document ID: US10312884B2
- Status: Granted
- Kind: B2
- Application number: 15/388,364
- Filed: 2016-12-22
- Published: 2017-07-13
- Granted: 2019-06-04
- Earliest claimed: 2016-01-08
- Assignees: Seiko Epson Corporation
- Applicants: Seiko Epson Corporation
- Inventors: Masataka Nomura; Shigeki Sasayama; Akira Nakada
- Web page: https://patentgrep.com/patent/US10312884B2

## CPC

- H03H 9/19: consisting of quartz
- H01F 5/00: Coils (superconducting coils H01F6/06; fixed inductances of the signal type H01F17/00)
- H01F 5/04: Arrangements of electric connections to coils, e.g. leads
- H03B 5/30: with frequency-determining element being electromechanical resonator
- H03B 5/326: {the resonator being an acoustic wave device, e.g. SAW or BAW device}
- H10W 20/20: Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
- H10W 72/00: Interconnections or connectors in packages
- H03H 7/06: including resistors (H03H7/075, H03H7/09, H03H7/12, H03H7/13 take precedence)
- H03H 9/0547: {consisting of a vertical arrangement (H03H9/0566 takes precedence)}
- H03H 9/6436: {having one acoustic track only}
- H10W 72/932: {Plan-view shape, i.e. in top view}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P)
- H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H03B: GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS (generators adapted for electrophonic musical instruments G10H; masers or lasers H01S; generation of oscillations in plasma H05H)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An oscillation module includes a loop interconnection, a high-frequency output interconnection, a differential amplifier, and an output terminal, the differential amplifier is connected to the output terminal with the high-frequency output interconnection, the high-frequency output interconnection crosses the loop interconnection in a grade-separated manner, and the loop interconnection is different in thickness between a crossing part and a non-crossing part with the high-frequency interconnection.

## Claims

### Claim 1

An oscillation module comprising:
a loop interconnection;
a first interconnection;
a first circuit; and
a first terminal,
wherein the first circuit is connected to the first terminal with the first interconnection,
the first interconnection crosses the loop interconnection in a grade-separated manner, and
the loop interconnection at least partially encircles one or more circuits of an integrated circuit including the first circuit to define a loop around a perimeter of the integrated circuit, the first interconnection crosses the loop defined by the loop interconnection to connect the first terminal outside of the defined loop to the first circuit within the defined loop, and the loop interconnection is different in thickness between a crossing part and a non-crossing part with the first interconnection.

### Claim 2 (depends on 1)

The oscillation module according to claim 1, wherein
the crossing part of the loop interconnection includes a multilayer interconnection part disposed in a plurality of wiring layers stacked on one another.

### Claim 3 (depends on 1)

The oscillation module according to claim 1, wherein
the first interconnection is different in thickness from the crossing part of the loop interconnection.

### Claim 4 (depends on 2)

The oscillation module according to claim 2, wherein
the first interconnection is different in thickness from the crossing part of the loop interconnection.

### Claim 5 (depends on 1)

The oscillation module according to claim 1, wherein
the loop interconnection and the first interconnection are disposed in a plurality of wiring layers stacked on one another, and
the first interconnection is disposed in the wiring layer, which is the same as the wiring layer of the non-crossing part of the loop interconnection.

### Claim 6 (depends on 2)

The oscillation module according to claim 2, wherein
the loop interconnection and the first interconnection are disposed in a plurality of wiring layers stacked on one another, and
the first interconnection is disposed in the wiring layer, which is the same as the wiring layer of the non-crossing part of the loop interconnection.

### Claim 7 (depends on 1)

The oscillation module according to claim 1, wherein
defining the thickness of the crossing part of the loop interconnection as A, and the thickness of the non-crossing part as B,
A<B is fulfilled.

### Claim 8 (depends on 1)

The oscillation module according to claim 1, wherein
the loop interconnection is disposed so as to straddle a plurality of wiring layers stacked on one another, and the non-crossing part is disposed in the wiring layer, which is an upper layer of the wiring layer where the crossing part is disposed.

### Claim 9 (depends on 1)

The oscillation module according to claim 1, wherein
the loop interconnection is a power supply line.

### Claim 10 (depends on 1)

The oscillation module according to claim 1, wherein
the first interconnection is a high-frequency signal line.

### Claim 11

An oscillation module comprising:
a loop interconnection corresponding to a first interconnection;
a first circuit block; and
a second interconnection and a third interconnection adapted to electrically connect the loop interconnection and the first circuit block to each other,
wherein the second interconnection is disposed along a first direction of the first circuit block in a planar view,
the third interconnection is disposed along a second direction different from the first direction of the first circuit block in the planar view, and
the loop interconnection at least partially encircles one or more circuits of an integrated circuit including the first circuit block to define a loop around a perimeter of the integrated circuit, and the second and third interconnections cross the loop defined by the loop interconnection to connect respective terminals outside of the defined loop to the first circuit block within the defined loop.

### Claim 12 (depends on 11)

The oscillation module according to claim 11, further comprising:
a second circuit block,
wherein at least one of the second interconnection and the third interconnection electrically connects the loop interconnection and the first circuit block to each other via the second circuit block.

### Claim 13 (depends on 11)

The oscillation module according to claim 11, further comprising:
at least one of a fourth interconnection and a fifth interconnection adapted to electrically connect the loop interconnection and the first circuit block to each other,
wherein the fourth interconnection is disposed along a third direction different from the first direction and the second direction of the first circuit block in the planar view, and
the fifth interconnection is disposed along a fourth direction different from the first direction, the second direction, the third direction, and the third direction of the first circuit block in the planar view.

### Claim 14 (depends on 12)

The oscillation module according to claim 12, further comprising:
at least one of a fourth interconnection and a fifth interconnection adapted to electrically connect the loop interconnection and the first circuit block to each other,
wherein the fourth interconnection is disposed along a third direction different from the first direction and the second direction of the first circuit block in the planar view, and
the fifth interconnection is disposed along a fourth direction different from the first direction, the second direction, the third direction, and the third direction of the first circuit block in the planar view.

### Claim 15 (depends on 11)

The oscillation module according to claim 11, wherein
the loop interconnection has a predetermined electrical potential.

### Claim 16 (depends on 12)

The oscillation module according to claim 12, wherein
the loop interconnection has a predetermined electrical potential.

### Claim 17 (depends on 1)

An electronic apparatus comprising:
the oscillation module according to claim 1.

### Claim 18 (depends on 11)

An electronic apparatus comprising:
the oscillation module according to claim 11.

### Claim 19 (depends on 1)

A moving object comprising:
the oscillation module according to claim 1.

### Claim 20 (depends on 11)

A moving object comprising:
the oscillation module according to claim 11.