# US 10,312,880 B2 · Method for manufacturing electronic component module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,312,880 B2 - Document ID: US10312880B2 - Status: Granted - Kind: B2 - Application number: 15/410,932 - Filed: 2017-01-20 - Published: 2017-05-11 - Granted: 2019-06-04 - Earliest claimed: 2011-03-22 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Masaaki Kanae - Web page: https://patentgrep.com/patent/US10312880B2 ## CPC - H03H 3/08: for the manufacture of resonators or networks using surface acoustic waves - H03H 3/007: for the manufacture of electromechanical resonators or networks - H03H 3/02: for the manufacture of piezoelectric or electrostrictive resonators or networks (H03H3/08 takes precedence) - H03H 9/05: Holders or supports - H03H 9/0542: {consisting of a lateral arrangement (H03H9/0566 takes precedence)} - H03H 9/1014: {the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device} - H03H 9/1057: {for microelectro-mechanical devices} - H03H 9/1071: {the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device} - Y10T 29/42: Piezoelectric device making - Y10T 29/49128: Assembling formed circuit to base - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A method for producing an electronic component module prevents a space from collapsing. The method includes a step of preparing an electronic component including an element substrate, a drive device formed on a principal surface of the element substrate, and a protection device covering the drive device so as to form a space around the drive device; a step of fixing the electronic component on a common substrate such that a principal surface of the common substrate and another principal surface of the element substrate face each other; a step of fixing a reinforcing plate on the protection device of the electronic component; and a step of forming a resin layer on the principal surface of the common substrate such that the electronic component is contained therein. ## Claims ### Claim 1 A method for manufacturing an electronic component module, the method comprising: a step of preparing an electronic component including an element substrate, a drive device formed on a principal surface of the element substrate, and a protection device arranged so as to form a space around the drive device and cover the drive device; a step of preparing a common substrate, and mounting and fixing the electronic component on the common substrate by using a mounter such that a principal surface of the common substrate and another principal surface of the element substrate face each other; a step of mounting and fixing a reinforcing plate on the protection device of the electronic component by using a mounter; and a step of forming a resin layer on the principal surface of the common substrate such that the electronic component is contained therein. ### Claim 2 (depends on 1) The method for manufacturing the electronic component module according to claim 1, wherein, in the step of fixing the reinforcing plate, an adhesive layer is previously formed on a surface of the reinforcing plate, and the reinforcing plate is fixed such that the adhesive layer is located between the protection device and the reinforcing plate. ### Claim 3 (depends on 1) The method for manufacturing the electronic component module according to claim 1, wherein the reinforcing plate is made of Si. ### Claim 4 (depends on 2) The method for manufacturing the electronic component module according to claim 2, wherein the reinforcing plate is made of Si. ### Claim 5 (depends on 1) The method for manufacturing the electronic component module according to claim 1, wherein the element substrate is a piezoelectric substrate and the drive device includes an interdigital transducer electrode. ### Claim 6 (depends on 2) The method for manufacturing the electronic component module according to claim 2, wherein the element substrate is a piezoelectric substrate and the drive device includes an interdigital transducer electrode. ### Claim 7 (depends on 3) The method for manufacturing the electronic component module according to claim 3, wherein the element substrate is a piezoelectric substrate and the drive device includes an interdigital transducer electrode. ### Claim 8 (depends on 4) The method for manufacturing the electronic component module according to claim 4, wherein the element substrate is a piezoelectric substrate and the drive device includes an interdigital transducer electrode. ### Claim 9 (depends on 1) The method for manufacturing the electronic component module according to claim 1, wherein the element substrate is an insulating substrate and the drive device includes a piezoelectric thin film and electrodes formed on both surfaces of the piezoelectric thin film. ### Claim 10 (depends on 2) The method for manufacturing the electronic component module according to claim 2, wherein the element substrate is an insulating substrate and the drive device includes a piezoelectric thin film and electrodes formed on both surfaces of the piezoelectric thin film. ### Claim 11 (depends on 3) The method for manufacturing the electronic component module according to claim 3, wherein the element substrate is an insulating substrate and the drive device includes a piezoelectric thin film and electrodes formed on both surfaces of the piezoelectric thin film. ### Claim 12 (depends on 4) The method for manufacturing the electronic component module according to claim 4, wherein the element substrate is an insulating substrate and the drive device includes a piezoelectric thin film and electrodes formed on both surfaces of the piezoelectric thin film. ### Claim 13 (depends on 1) The method for manufacturing the electronic component module according to claim 1, wherein the element substrate is an insulating substrate and the drive device includes a vibrating element made of Si. ### Claim 14 (depends on 2) The method for manufacturing the electronic component module according to claim 2, wherein the element substrate is an insulating substrate and the drive device includes a vibrating element made of Si. ### Claim 15 (depends on 3) The method for manufacturing the electronic component module according to claim 3, wherein the element substrate is an insulating substrate and the drive device includes a vibrating element made of Si. ### Claim 16 (depends on 4) The method for manufacturing the electronic component module according to claim 4, wherein the element substrate is an insulating substrate and the drive device includes a vibrating element made of Si.