# US 10,312,801 B2 · High power density inverter (II)

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- Number: US 10,312,801 B2
- Document ID: US10312801B2
- Status: Granted
- Kind: B2
- Application number: 15/743,054
- Filed: 2016-06-23
- Published: 2018-07-19
- Granted: 2019-06-04
- Earliest claimed: 2015-07-09
- Assignees: Ce+T Power Luxembourg SA
- Applicants: CE+T Power Luxembourg S.A.
- Inventors: Paul Bleus; Thierry Joannes; François Milstein; Pierre Stassain; Fabrice Frebel
- Web page: https://patentgrep.com/patent/US10312801B2

## CPC

- H02M 1/44: Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
- H02M 1/126: {using passive filters}
- H02M 1/143: {using compensating arrangements (for reducing noise from the supply in transmission systems H04B15/005)}
- H02M 1/15: using active elements
- H02M 7/5387: in a bridge configuration
- H03K 17/133: {in field-effect transistor switches}
- H05K 3/0061: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)}
- H05K 7/209: {Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence)}
- H05K 7/20909: {Forced ventilation, e.g. on heat dissipaters coupled to components}
- H02M 1/0058: {by employing soft switching techniques, i.e. commutation of transistors when applied voltage is zero or when current flow is zero (using an auxiliary actively switched resonant commutation circuit connected to an intermediate DC voltage or between two push-pull branches of an inverter bridge H02M7/4811; in resonant inverters H02M7/4815; in inverters operating from a resonant DC source H02M7/4826)}
- H02M 1/123: {Suppression of common mode voltage or current}
- H02M 7/4811: {having auxiliary actively switched resonant commutation circuits connected to intermediate DC voltage or between two push-pull branches}
- Y02B 70/10: Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes
- H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P)
- H03K: PULSE TECHNIQUE (measuring pulse characteristics G01R; modulating sinusoidal oscillations with pulses H03C; transmission of digital information H04L; discriminator circuits detecting phase difference between two signals by counting or integrating cycles of oscillation H03D3/04; automatic control, starting, synchronisation or stabilisation of generators of electronic oscillations or pulses where the type of generator is irrelevant or unspecified H03L; coding, decoding or code conversion, in general H03M)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y02B: CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS

## Abstract

The present invention relates to a single phase, non-insulated, miniaturized DC/AC power inverter having an output power density higher than 3000 W/dm3, wherein said power inverter is packaged in a casing made of an external electrically conductive enclosure containing a fan blowing in an axial direction to a side face of the casing and, in a stacked elevation arrangement, successively from a bottom side to a top side, a layer of active filter capacitors, a heatsink, a layer of wideband semiconductors switches connected to a PCB with thermal vias and a layer of active filtering inductors, the fan and the component stacked arrangement being designed so as, in operation, the external temperature of the casing does not overcome 60° C. in any point, for an ambient temperature of maximum 30° C. under a maximum load of 2 kVA.

## Claims

### Claim 1

A single phase, non-insulated, miniaturized DC/AC power inverter (1) having an output power density higher than 3000 W/dm3 and comprising:
a DC input;
an AC output;
at least a H full-bridge topology switching circuit (201, 202) having an input connected to the DC input and an output connected to the AC output, and comprising switches made of wide-band semiconductors and preferably of gallium nitride or GaN semiconductors;
at least one common mode noise Electromagnetic Interference (EMI) filter (100) connected between the DC input and the input of the H full-bridge switching circuit, between the output of the H full-bridge switching circuit and the AC output respectively, said common mode noise filters (100) being referenced to an earth shielding or directly to earth (204), said common noise filters (100) comprising filtering inductors and so-called Y capacitors;
at least one differential mode noise Electromagnetic Interference (EMI) filter (101) connected, in series with a corresponding common mode noise filter (100), between the DC input and the input of the H full-bridge switching circuit, between the output of the H full-bridge switching circuit and the AC output respectively, said differential mode noise filters (101) comprising so-called X filtering capacitors and optionally inductors;
a ripple-compensating active filter comprising a switching half-bridge topology (203) provided in parallel with the H full-bridge switching circuit and connected to a LC filter, made of at least one inductor (L6) and at least one storage capacitor (C5);
wherein said power inverter (1) is packaged in a casing made of an external electrically conductive enclosure (501) containing a fan blowing in an axial direction to a side face of the casing and, in a stacked elevation arrangement, successively from a bottom side to a top side, a layer of active filter capacitors (514), a heatsink (512), a layer of wideband semiconductors switches (509) connected to a Printed Circuit Board (PCB) with thermal vias (510) and a layer of active filtering inductors (504), the fan and the component stacked arrangement being designed so as, in operation, an external temperature of the casing does not overcome 60° C. in any point, for an ambient temperature of maximum 30° C. under a maximum load of 2 kVA.

### Claim 2 (depends on 1)

The DC/AC power inverter of claim 1, wherein the layer of active filter capacitors (514) is composed of Printed Circuit Board (PCB) mounted (513) rows of regularly spaced multilayer ceramic capacitors (MLCC), said capacitors being separated by a gap, said gap being preferably of about 1 mm and oriented in the blowing direction of the fan.

### Claim 3 (depends on 1)

The DC/AC power inverter of claim 1, wherein the heatsink (512) is a one-piece machined metallic heatsink selected from the group consisting of a multiple blades, honeycomb, interlaced-fins and metal foam heatsink, said heatsink (512) being adjacent to the layer of active filter capacitors (514).

### Claim 4 (depends on 1)

The DC/AC power inverter of claim 1, wherein the casing external conductive enclosure (501) surrounds a conductive shielding (503) separated thereof by a thermally conductive interface made of a gap pad (502).

### Claim 5 (depends on 1)

The DC/AC power inverter of claim 1, wherein the active filtering inductors (504) are composed of ferrite cores on which Litz wire is directly wound without a coil former, each inductor (504) being made of two coils separated by a ceramic foil (505) placed between the ferrites cores in order to create an air gap as well as thermal drain.

### Claim 6 (depends on 1)

The DC/AC power inverter of claim 1, wherein the layer of wideband semiconductors switches (509) connected to a PCB with thermal vias (510) is adjacent the heatsink thanks to a ceramic insulation (511) and microspring contacts (507), silicone foam (508) being provided in gaps in order to uniformly spread switch contact pressure on the heatsink (512).

### Claim 7 (depends on 4)

The DC/AC power inverter of claim 4, wherein the casing enclosure (501), the conductive shielding (503) and the heatsink (512) are made of copper.

### Claim 8 (depends on 1)

The DC/AC power inverter of claim 1, wherein the common mode and differential mode Electromagnetic Interference (EMI) filters, are separated from the rest in the casing.

### Claim 9 (depends on 1)

The DC/AC power inverter of claim 1, wherein part of the active filtering inductors (504) are thermally fastened to a conductive shield (503).