# US 10,312,662 B2 · Optical module and optical transmission equipment

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- Number: US 10,312,662 B2
- Document ID: US10312662B2
- Status: Granted
- Kind: B2
- Application number: 16/003,367
- Filed: 2018-06-08
- Published: 2018-12-27
- Granted: 2019-06-04
- Earliest claimed: 2017-06-23
- Assignees: Oclaro Japan, Inc.
- Applicants: Oclaro Japan, Inc.
- Inventors: Takuya Sato; Keiichi Murakami; Koki Sato
- Web page: https://patentgrep.com/patent/US10312662B2

## CPC

- H01S 5/02476: {Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements}
- G02B 6/4272: {with mounting substrates of high thermal conductivity}
- H01S 5/02: Structural details or components not essential to laser action
- H01S 5/023: Mount members, e.g. sub-mount members
- H01S 5/0233: Mounting configuration of laser chips
- H01S 5/0235: Method for mounting laser chips
- H01S 5/024: Arrangements for thermal management
- H01S 5/02446: {Cooling being separate from the laser chip cooling}
- H01S 5/02453: {Heating, e.g. the laser is heated for stabilisation against temperature fluctuations of the environment (H01S5/0612 takes precedence, for monolithically integrated heaters see also H01S5/0261)}
- H01S 5/02469: {Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC}
- H01S 5/02208: characterised by the shape of the housings
- H01S 5/02212: Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
- H01S 5/0222: Gas-filled housings
- H01S 5/02251: using optical fibres
- H01S 5/02407: {Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling}
- H01S 5/02415: {by using a thermo-electric cooler [TEC], e.g. Peltier element}
- H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS

## Abstract

To provide an optical module whose power consumption in an ambient temperature range is reduced, and an optical transmission equipment. The optical module includes: a housing; a box type optical subassembly including a bottom portion serving as a heat dissipation face; and a heat conductive member disposed between the bottom portion of the optical subassembly and a bottom portion of the housing. The optical subassembly includes one or a plurality of optical semiconductor devices, and a temperature controller on which the one or plurality of optical semiconductor devices are mounted and which is placed on an inner bottom portion of the optical subassembly. The heat conductive member is disposed only at a portion of the bottom portion of the optical subassembly.

## Claims

### Claim 1

An optical module comprising:
a housing;
a box type optical subassembly including a bottom portion serving as a heat dissipation face; and
a heat conductive member disposed between the bottom portion of the optical subassembly and a bottom portion of the housing,
wherein the optical subassembly includes
one or a plurality of optical semiconductor devices, and
a temperature controller on which the one or plurality of optical semiconductor devices are mounted and which is placed on an inner bottom portion of the optical subassembly, and
the heat conductive member is disposed only at a portion of the bottom portion of the optical subassembly.

### Claim 2 (depends on 1)

The optical module according to claim 1, wherein an area where the heat conductive member is disposed with respect to the entire bottom portion of the optical subassembly is 15% or more and 55% or less.

### Claim 3 (depends on 1)

The optical module according to claim 1, wherein the heat conductive member is disposed such that power consumption of the optical module at a lower limit of an ambient temperature range with respect to power consumption of the optical module at an upper limit falls within a range of ±10%.

### Claim 4 (depends on 1)

The optical module according to claim 1, wherein
the heat conductive member is any one selected from the group of a heat dissipation grease, a gel for heat dissipation, and a sheet for heat dissipation.

### Claim 5 (depends on 1)

An optical transmission equipment comprising the optical module according to claim 1 mounted therein.
