# US 10,312,604 B2 · Crimping terminal and electric wire with crimping terminal

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- Number: US 10,312,604 B2
- Document ID: US10312604B2
- Status: Granted
- Kind: B2
- Application number: 15/616,513
- Filed: 2017-06-07
- Published: 2018-12-13
- Granted: 2019-06-04
- Earliest claimed: 2017-06-07
- Assignees: Hitachi Metals, Ltd.
- Applicants: Hitachi Metals, Ltd.
- Inventors: Kazufumi Suenaga; Setsuo Ando; Hisashi Tate; Yuju Endo
- Web page: https://patentgrep.com/patent/US10312604B2

## CPC

- H01R 4/18: by crimping {(H01R4/01, H01R4/2495 take precedence; for coaxial cables H01R9/0518)}
- H01R 4/185: {combined with a U-shaped insulation-receiving portion}
- H01R 4/20: using a crimping sleeve {(H01R4/01 takes precedence)}
- H01R 4/58: characterised by the form or material of the contacting members (H01R4/01 takes precedence)
- H01R 9/03: Connectors arranged to contact a plurality of the conductors of a multiconductor cable {, e.g. tapping connections}
- H01R 43/05: with wire-insulation stripping
- B82Y 30/00: Nanotechnology for materials or surface science, e.g. nanocomposites
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- B82Y: SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES

## Abstract

A crimping terminal includes a crimping part that is compressed to a conductive part of an electric wire, and a buffer layer formed on a surface where the crimping part contacts the conductive part. The buffer layer includes a resin, a plating or a grease and a conductive microscopic particle that is mixed and dispersed therein. The microscopic particle includes a fractal structure including a fine protrusion on a surface of the microscopic particle.

## Claims

### Claim 1

A crimping terminal, comprising:
a crimping part that is compressed to a conductive part of an electric wire; and
a buffer layer formed on a surface where the crimping part contacts the conductive part,
wherein the buffer layer comprises a resin, a plating or a grease and a conductive microscopic particle that is mixed and dispersed therein,
wherein the microscopic particle comprises a fractal structure comprising a fine protrusion on a surface of the microscopic particle,
wherein the crimping part comprises a flat surface,
wherein a tip curvature diameter of the fine protrusion arranged on a surface of the microscopic particle is not less than 0.0006% of a radius of the microscopic particle and not more than 10% of the radius of the microscopic particle,
wherein a height of the fine protrusion arranged on the surface of the microscopic particle is less than 0.5% of a diameter of the microscopic particle, and
wherein the microscopic particle comprises Ni including P.

### Claim 2 (depends on 1)

The crimping terminal according to claim 1, wherein the microscopic particle further comprises a coating layer coating a core,
wherein the core comprises Ni, and
wherein the coating layer comprises an Ni—P layer.

### Claim 3

An electric wire with a crimping terminal, comprising:
an electric wire comprising a conductive part; and
a crimping terminal comprising a crimping part that is compressed to the conductive part of the electric wire,
wherein a buffer layer comprising a resin, a plating or a grease that is interposed in a contact interface between the conductive part and the crimping part,
wherein a conductive microscopic particle that comprises a fractal structure comprising a fine protrusion on a surface of the microscopic particle is mixed and dispersed in the buffer layer,
wherein the microscopic particle in the buffer layer pierces an insulating coat on a surface of the conductive part and contacts the conductive part,
wherein the crimping part comprises a flat surface,
wherein a tip curvature diameter of the fine protrusion arranged on the surface of the microscopic particle is not less than 0.0006% of a radius of the microscopic particle and not more than 10% of the radius of the microscopic particle,
wherein a height of the fine protrusion arranged on the surface of the microscopic particle is less than 0.5% of a diameter of the microscopic particle, and
wherein the microscopic particle comprises Ni including P.

### Claim 4 (depends on 1)

The crimping terminal according to claim 1, wherein the conductive part comprises a flat surface that opposes and is substantially parallel to the flat surface of the crimping part.

### Claim 5 (depends on 3)

The crimping terminal according to claim 3, wherein the conductive part comprises a flat surface that opposes and is substantially parallel to the flat surface of the crimping part.

### Claim 6 (depends on 4)

The crimping terminal according to claim 4, further comprising a plurality of microscopic particles of uniform size that form electrically conductive paths when the fine protrusions thereon intrude into the flat surfaces of the conductive part and crimping part.

### Claim 7 (depends on 5)

The crimping terminal according to claim 5, further comprising a plurality of microscopic particles of uniform size that form electrically conductive paths when the fine protrusions thereon intrude into the flat surfaces of the conductive part and crimping part.

### Claim 8 (depends on 2)

The crimping terminal according to claim 2, wherein a component ratio between Ni and P in the Ni—P layer is inclined in a thickness direction of the coating layer.

### Claim 9 (depends on 2)

The crimping terminal according to claim 2, wherein the microscopic particle has a cylindrical structure.