# US 10,312,462 B2 · Mechanically flexible and durable substrates and method of making

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 10,312,462 B2
- Document ID: US10312462B2
- Status: Granted
- Kind: B2
- Application number: 15/840,888
- Filed: 2017-12-13
- Published: 2018-04-12
- Granted: 2019-06-04
- Earliest claimed: 2007-05-21
- Assignees: Corning Incorporated
- Applicants: Corning Incorporated
- Inventors: Sean Matthew Garner; Gregory Scott Glaesemann; James Joseph Price
- Web page: https://patentgrep.com/patent/US10312462B2

## CPC

- H10K 77/111: {Flexible substrates}
- C03C 4/00: Compositions for glass with special properties
- C03C 17/34: with at least two coatings having different compositions (C03C17/44 takes precedence)
- H10F 77/1698: {the metallic or insulating substrates being flexible}
- H10K 2102/311: {Flexible OLED}
- Y02E 10/549: Organic PV cells
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES
- C03C: CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION

## Abstract

A flexible substrate are disclosed comprising an amorphous inorganic composition, wherein the substrate has a thickness of less than about 250 μm and has at least one of: a) a brittleness ratio less than about 9.5 (μm)−1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2. Electronic devices comprising such flexible devices are also disclosed. Also disclosed is a method for making a flexible substrate comprising selecting an amorphous inorganic material capable of forming a substrate having a thickness of less than about 250 μm and having at least one of: a) a brittleness ratio of less than about 9.5 (μm)−1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2; and then forming a substrate from the selected inorganic material.

## Claims

### Claim 1

A substrate comprising an alkali-free glass composition, wherein the substrate has a thickness of from 1 μm to less than 250 μm and at least one of:
a) a brittleness ratio of less than 9.5 (μm)−1/2 ,or
b) a fracture toughness of at least 0.75 MPa·(m)1/2, or
c) an abraded strength of from 35 to 65 MPa,
and wherein the substrate has a bend radius of less than 30 cm.

### Claim 2 (depends on 1)

The substrate of claim 1, wherein the substrate has at least one of:
a) a brittleness ratio of from 0.1 (μm)−1/2 to less than 9.5 (μm)−1/2, or
b) a fracture toughness of from 0.75 MPa·(m)1/2 to 10 MPa·(m)1/2, or
c) an abraded strength of from 40 to 60 MPa.

### Claim 3 (depends on 1)

The substrate of claim 1, wherein the substrate has a modulus a, and wherein the product of the substrate modulus and the substrate thickness is less than 2.0 GPa·cm.

### Claim 4 (depends on 3)

The substrate of claim 3, wherein the product of the substrate modulus and the substrate thickness is less than 1.0 GPa·cm.

### Claim 5 (depends on 1)

The substrate of claim 1, wherein the substrate has both a brittleness ratio of less than 9.5 (μm)−1/2 and a fracture toughness of at least 0.75 MPa·(m)1/2.

### Claim 6 (depends on 1)

The substrate of claim 1, wherein the substrate has both a brittleness ratio of less than 9.5 (μm)−1/2 and a fracture toughness of at least 0.75 MPa·(m)1/2; wherein the substrate has a modulus, and wherein the product of the substrate modulus and the substrate thickness is less than 2 GPa·cm.

### Claim 7 (depends on 1)

The substrate of claim 1, wherein the substrate has both a brittleness ratio of less than 8.0 (μm)−1/2 and a fracture toughness of at least 0.9 MPa·(m)1/2; wherein the substrate has a modulus, and wherein the product of the substrate modulus and the substrate thickness is less than 2 GPa·cm.

### Claim 8 (depends on 1)

The substrate of claim 1, wherein the substrate has a brittleness ratio of less than 8.0 (μm)−1/2, a fracture toughness of at least 0.9 MPa·(m)1/2, and an abraded strength from 35 to 65 MPa.

### Claim 9 (depends on 1)

The substrate of claim 1, wherein the substrate has a fatigue value, n, greater than 29.

### Claim 10

An electronic device comprising a flexible substrate comprising a glass composition, wherein the substrate has a thickness of from 1 μm to less than 250 μm and at least one of:
a) a brittleness ratio of less than 9.5 (μm)−1/2, or
b) a fracture toughness of at least 0.75 MPa·(m)1/2, or
c) an abraded strength of from 35 to 65 MPa,
and wherein the substrate has a bend radius of less than 30 cm.