# US 10,312,430 B2 · Method of manufacturing piezoelectric element and piezoelectric substrate

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- Number: US 10,312,430 B2
- Document ID: US10312430B2
- Status: Granted
- Kind: B2
- Application number: 15/059,318
- Filed: 2016-03-03
- Published: 2017-05-11
- Granted: 2019-06-04
- Earliest claimed: 2015-11-09
- Assignees: Interface Optoelectronics (Shenzhen) Co., Ltd.; General Interface Solution Limited
- Applicants: Interface Optoelectronics (ShenZhen) Co., Ltd.; General Interface Solution Limited
- Inventors: Chen-Chu Hsu; Ying-Hung Tsai; Wei-Chung Chuang; Somnath Mondal
- Web page: https://patentgrep.com/patent/US10312430B2

## CPC

- H10N 30/03: Assembling devices that include piezoelectric or electrostrictive parts
- H10N 30/074: by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N 30/076: by vapour phase deposition
- H10N 30/077: by liquid phase deposition
- H10N 30/079: using intermediate layers, e.g. for growth control
- H10N 30/081: by coating or depositing using masks, e.g. lift-off
- H10N 30/704: {based on piezoelectric or electrostrictive films or coatings}
- H10N 30/708: {Intermediate layers, e.g. barrier, adhesion or growth control buffer layers}
- H10N 30/88: Mounts; Supports; Enclosures; Casings
- H03H 9/132: {characterized by a particular shape}
- H05K 3/1225: {Screens or stencils; Holders therefor}
- H10N 30/857: Macromolecular compositions
- Y10T 29/42: Piezoelectric device making
- H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A method of manufacturing a piezoelectric element includes: forming a patterned mask layer over a substrate, in which the patterned mask layer has an opening exposing a portion of the substrate; forming a piezoelectric element in the opening; and removing the patterned mask layer to obtain the piezoelectric element, in which the piezoelectric element has a central portion and a peripheral portion adjacent to the central portion, and the peripheral portion has a maximum height greater than a height of the central portion.

## Claims

### Claim 1

A method of manufacturing a piezoelectric element, comprising:
providing a substrate;
forming a patterned mask layer through a cut or punch process, wherein the patterned mask layer has an opening;
adhering the patterned mask layer to the substrate, wherein the opening exposes a portion of the substrate;
forming a piezoelectric element on the portion of the substrate; and
removing the patterned mask layer to obtain the piezoelectric element, wherein the piezoelectric element has a central portion and a peripheral portion adjacent to the central portion, and the peripheral portion has a maximum height greater than a height of the central portion, and an included angle between a sidewall of the peripheral portion and a surface of the substrate is in a range of 40° to 100°.

### Claim 2 (depends on 1)

The method of claim 1, wherein forming the piezoelectric element on the portion of the substrate comprises:
filling a piezoelectric material solution in the opening; and
solidifying the piezoelectric material solution to form the piezoelectric element.

### Claim 3 (depends on 2)

The method of claim 2, wherein the piezoelectric material solution has a height less than a depth of the opening.

### Claim 4 (depends on 1)

The method of claim 1, wherein the patterned mask layer comprises a plastic material layer and an adhesive layer between the plastic material layer and the substrate.

### Claim 5 (depends on 1)

The method of claim 1, wherein the patterned mask layer comprises polyethylene terephthalate, polyimide, polycarbonate (PC), polyethylene (PE), polymethyl methacrylate (PMMA), metal, alloy, or silicon.