# US 10,312,425 B2 · Semiconductor light-emitting device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,312,425 B2 - Document ID: US10312425B2 - Status: Granted - Kind: B2 - Application number: 15/997,184 - Filed: 2018-06-04 - Published: 2018-10-04 - Granted: 2019-06-04 - Earliest claimed: 2007-03-30 - Assignees: Rohm Co., Ltd. - Applicants: Rohm Co., Ltd. - Inventors: Masahiko Kobayakawa - Web page: https://patentgrep.com/patent/US10312425B2 ## CPC - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 20/8506: {Containers} - H10H 20/852: Encapsulations - H10H 20/853: characterised by their shape - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H10H 20/856: Reflecting means - H10W 70/421: {Shapes or dispositions} - H10H 20/8582: {characterised by their shape} - H10H 20/8585: {being an interconnection} - H10W 72/536: {the connected ends being ball-shaped} - H10W 72/5363: {the connected ends being wedge-shaped} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a thin extension extending from the bonding region and having a top surface which is flush with the top surface of the bonding region. The thin extension has a bottom surface which is offset from the bottom surface of the bonding region toward the top surface of the bonding region. ## Claims ### Claim 1 A semiconductor light-emitting device, comprising: a first lead frame having a die bonding portion and a first rest portion other than the die bonding portion, the first rest portion being not greater in thickness than the die bonding portion; a second lead frame spaced apart from the first lead frame in a first direction and including a thick portion and a second rest portion other than the thick portion, the thick portion being equal in thickness to the die bonding portion, the second rest portion being not greater in thickness than the thick portion; a semiconductor light-emitting element bonded to the die bonding portion and electrically connected to the second lead frame; and a case covering a part of each of the first lead frame and the second lead frame, thereby supporting the first lead frame and the second lead frame, the case including a peripheral edge in top plan view along the first direction and a second direction perpendicular to the first direction; wherein the first lead frame includes an extension extending in the second direction and a side surface facing in the second direction, the side surface having a nonlinear configuration in top plan view provided at least by the extension, the extension includes a first extension that is extended from the die-bonding portion, the case includes a first holding portion that covers a lower surface of the first extension while exposing a continuous bottom surface of the die bonding portion and a bottom surface of the thick portion, and the continuous bottom surface of the die bonding portion is larger than the bottom surface of the thick portion within the peripheral edge of the case in plan view. ### Claim 2 (depends on 1) The semiconductor light-emitting device according to claim 1, wherein the non-linear configuration is provided by the extension and another portion adjacent to the extension. ### Claim 3 (depends on 2) The semiconductor light-emitting device according to claim 2, wherein the non-linear configuration includes at least one protrusion provided by the extension and two other portions flanking the extension. ### Claim 4 (depends on 3) The semiconductor light-emitting device according to claim 3, wherein the non-linear configuration includes a plurality of protrusions. ### Claim 5 (depends on 2) The semiconductor light-emitting device according to claim 2, wherein the extension includes a thick extension equal in thickness to the die bonding portion. ### Claim 6 (depends on 1) The semiconductor light-emitting device according to claim 1, wherein the first extension is located at least at a central region of the die bonding portion in the first direction. ### Claim 7 (depends on 1) The semiconductor light-emitting device according to claim 1, wherein the first extension is located at least at an end region of the die bonding portion that is close to the second lead frame in the first direction. ### Claim 8 (depends on 1) The semiconductor light-emitting device according to claim 1, wherein the first extension is located at least at an end region of the die bonding portion that is opposite to the second lead frame in the first direction. ### Claim 9 (depends on 1) The semiconductor light-emitting device according to claim 1, wherein the first extension includes a small-width thin extension that is smaller in size than the die bonding portion in the first direction. ### Claim 10 (depends on 9) The semiconductor light-emitting device according to claim 9, wherein the small-width thin extension is smaller in size than the semiconductor light-emitting element in the first direction. ### Claim 11 (depends on 1) The semiconductor light-emitting device according to claim 1, wherein the continuous bottom surface of the die bonding portion is flush with a bottom surface of the case. ### Claim 12 (depends on 1) The semiconductor light-emitting device according to claim 1, wherein a top surface of the first extension is flush with a top surface of the die bonding portion. ### Claim 13 (depends on 1) The semiconductor light-emitting device according to claim 1, wherein the case includes a frame portion that surrounds the semiconductor light-emitting element for reflecting light of the semiconductor light-emitting element in a light-emitting direction, and wherein the frame portion defines an opening through which the semiconductor light-emitting element, a part of the first lead frame and a part of the second lead frame are exposed from the case. ### Claim 14 (depends on 13) The semiconductor light-emitting device according to claim 13, wherein the first extension extends in the second direction from the die bonding portion up to a point where said the first extension overlaps with the frame portion in top plan view. ### Claim 15 (depends on 13) The semiconductor light-emitting device according to claim 13, further comprising a wire for connecting the second lead frame and the semiconductor light-emitting element to each other, wherein the second lead frame includes a wire bonding portion for bonding the wire and a second thin extension formed integral with the wire bonding portion, the second thin extension including a lower surface located offset from a bottom surface of the thick portion in the light-emitting direction, and the case covers a top surface of the second thin extension with the frame portion, and includes a second holding portion covering the lower surface of the second thin extension while exposing a bottom surface of the second lead frame. ### Claim 16 (depends on 15) The semiconductor light-emitting device according to claim 15, wherein the bottom surface of the second lead frame is flush with a bottom surface of the case. ### Claim 17 (depends on 15) The semiconductor light-emitting device according to claim 15, wherein the top surface of the second thin extension is flush with the wire bonding portion. ### Claim 18 (depends on 15) The semiconductor light-emitting device according to claim 15, wherein the second thin extension extends in the second direction from the wire bonding portion up to a point where the second thin extension overlaps with the frame portion in plan view. ### Claim 19 (depends on 15) The semiconductor light-emitting device according to claim 15, wherein the second lead frame includes a third thin extension formed integral with the wire bonding portion and including a lower surface located offset from the bottom surface of the thick portion in the light-emitting direction, the third thin extension being disposed at an end of the second lead frame that is close to the first lead frame, the third thin extension extending in the first direction, and wherein the case exposes a top surface of the third thin extension and includes a third holding portion covering the lower surface of the third thin extension while exposing the bottom surface of the second lead frame. ### Claim 20 (depends on 19) The semiconductor light-emitting device according to claim 19, wherein the upper surface of the third thin extension is flush with the wire bonding portion. ### Claim 21 (depends on 19) The semiconductor light-emitting device according to claim 19, wherein the third thin extension is formed continuous with the second thin extension, and the third holding portion is formed continuous with the second holding portion. ### Claim 22 (depends on 13) The semiconductor light-emitting device according to claim 13, wherein the opening of the frame portion is rectangular in top plan view. ### Claim 23 (depends on 13) The semiconductor light-emitting device according to claim 13, further comprising a translucent resin member filled in the opening and covering the semiconductor light-emitting element, the resin member allowing light of the semiconductor light-emitting element to pass therethrough. ### Claim 24 (depends on 1) The semiconductor light-emitting device according to claim 1, wherein the first lead frame and the second lead frame are made up of an unbent lead frame. ### Claim 25 (depends on 1) The semiconductor light-emitting device according to claim 1, wherein the first extension includes an end disposed inward of a side of the case so as to be contained in the case in top plan view. ### Claim 26 (depends on 1) The semiconductor light-emitting device according to claim 1, wherein the lower surface of the first extension incudes a flat face that is parallel to a top surface of the thin extension. ### Claim 27 (depends on 1) The semiconductor light-emitting device according to claim 1, wherein the case is made of a white resin that reflects light of the semiconductor light-emitting element. ### Claim 28 (depends on 1) The semiconductor light-emitting device according to claim 1, wherein the continuous bottom surface of the die bonding portion is exposed from the case, and the semiconductor light-emitting element as a whole overlaps with the die bonding portion in top plan view. ### Claim 29 (depends on 1) The semiconductor light-emitting device according to claim 1, wherein the case has a rectangular outline with an edge extending in the first direction and another edge extending in the second direction. ### Claim 30 (depends on 1) The semiconductor light-emitting device according to claim 1, wherein the thick portion protrudes outward from an extremity of the case in the first direction. ### Claim 31 (depends on 1) The semiconductor light-emitting device according to claim 1, wherein each of the first lead frame and the second lead frame includes an outer end in the first direction, the outer end being formed with a cutout extending in the first direction. ### Claim 32 A semiconductor light-emitting device, comprising: a first lead frame having a die bonding portion and a first rest portion other than the die bonding portion, the first rest portion being not greater in thickness than the die bonding portion; a second lead frame spaced apart from the first lead frame and including a thick portion and a second rest portion other than the thick portion, the thick portion being equal in thickness to the die bonding portion, the second rest portion being not greater in thickness than the thick portion; a semiconductor light-emitting element bonded to the die bonding portion and electrically connected to the second lead frame; and a case covering a part of each of the first lead frame and the second lead frame, thereby supporting the first lead frame and the second lead frame; wherein the first lead frame includes an extension extending outward from the die bonding portion in top plan view and a side surface facing in an extension direction in which the extension extends, the side surface having a non-linear configuration in top plan view provided at least by the extension, the extension includes a first extension that is extended from the die bonding portion, the case includes a first holding portion that covers a lower surface of the first extension while exposing a continuous bottom surface of the die bonding portion and a bottom surface of the thick portion, and the continuous bottom surface of the die bonding portion is larger than the bottom surface of the thick portion within a peripheral edge of the case in plan view. ### Claim 33 (depends on 32) The semiconductor light-emitting device according to claim 32, wherein the non-linear configuration is provided by the extension and another portion adjacent to the extension. ### Claim 34 (depends on 33) The semiconductor light-emitting device according to claim 33, wherein the non-linear configuration includes at least one protrusion provided by the extension and two other portions flanking the extension. ### Claim 35 (depends on 34) The semiconductor light-emitting device according to claim 34, wherein the non-linear configuration includes a plurality of protrusions. ### Claim 36 (depends on 32) The semiconductor light-emitting device according to claim 32, wherein the case includes a frame portion that surrounds the semiconductor light-emitting element for reflecting light of the semiconductor light-emitting element in a light-emitting direction, wherein the frame portion defines an opening through which the semiconductor light-emitting element, a part of the first lead frame and a part of the second lead frame are exposed from the case, and wherein the first extension extends from the die bonding portion up to a point where the first extension overlaps with the frame portion in top plan view. ### Claim 37 (depends on 32) The semiconductor light-emitting device according to claim 32, wherein the first extension includes a small-width thin extension that is smaller in size than the die bonding portion in a width direction perpendicular to the extension direction. ### Claim 38 (depends on 37) The semiconductor light-emitting device according to claim 37, wherein the small-width thin extension is smaller in size than the semiconductor light-emitting element in the width direction. ### Claim 39 (depends on 37) The semiconductor light-emitting device according to claim 37, wherein the first extension includes an additional small-width thin extension. ### Claim 40 (depends on 32) The semiconductor light-emitting device according to claim 32, wherein the continuous bottom surface of the die bonding portion is flush with a bottom surface of the case. ### Claim 41 (depends on 32) The semiconductor light-emitting device according to claim 32, wherein the first extension includes a top surface that is flush with a top surface of the die bonding portion. ### Claim 42 (depends on 32) The semiconductor light-emitting device according to claim 32, further comprising a wire for connecting the second lead frame and the semiconductor light-emitting element to each other, wherein the second lead frame includes a wire bonding portion for bonding the wire and a second thin extension formed integral with the wire bonding portion, the second thin extension including a lower surface located offset form a bottom surface of the thick portion in a light-emitting direction, the case includes a frame portion that surrounds the semiconductor light-emitting element for reflecting light of the semiconductor light-emitting element in a light-emitting direction, the frame portion defining an opening through which the semiconductor light-emitting element, a part of the first lead frame and a part of the second lead frame are exposed from the case, and the case covers a top surface of the second thin extension with the frame portion and includes a second holding portion covering the lower surface of the second thin portion while exposing the bottom surface of the second lead frame. ### Claim 43 (depends on 42) The semiconductor light-emitting device according to claim 42, wherein the second thin extension extends from the wire bonding portion up to a point where the second thin extension overlaps with the frame portion in top plan view. ### Claim 44 (depends on 42) The semiconductor light-emitting device according to claim 42, wherein the second lead frame includes a third thin extension formed integral with the wire bonding portion and having a lower surface located offset from the bottom surface of the thick portion in the light-emitting direction, the third thin extension extending at an end of the second lead frame that is close to the first lead frame, and wherein the case exposes a top surface of the third thin portion and includes a third holding portion covering a lower surface of the third thin extension while exposing the bottom surface of the second lead frame. ### Claim 45 (depends on 44) The semiconductor light-emitting device according to claim 44, wherein the third thin portion includes a top surface that is flush with the wire bonding portion. ### Claim 46 (depends on 44) The semiconductor light-emitting device according to claim 44, wherein the third thin extension is continuous with the second thin extension, and the third holding portion is continuous with the second holding portion. ### Claim 47 (depends on 32) The semiconductor light-emitting device according to claim 32, wherein the first extension includes an end disposed inward of a side of the case so as to be contained in the case in top plan view. ### Claim 48 (depends on 32) The semiconductor light-emitting device according to claim 32, wherein the lower surface of the first extension includes a flat face that is parallel to a top surface of the thin extension. ### Claim 49 (depends on 32) The semiconductor light-emitting device according to claim 32, wherein the continuous bottom surface of the die bonding portion is exposed from the case, and the semiconductor light-emitting element as a whole overlaps with the die bonding portion in top plan view. ### Claim 50 A semiconductor light-emitting device, comprising: a first lead frame having a die bonding portion and a first rest portion other than the die bonding portion, the first rest portion being not greater in thickness than the die bonding portion; a second lead frame spaced apart from the first lead frame in a first direction and including a thick portion and a second rest portion other than the thick portion, the thick portion being equal in thickness to the die bonding portion, the second rest portion being not greater in thickness than the thick portion; a semiconductor light-emitting element bonded to the die bonding portion and electrically connected to the second lead frame; and a case covering a part of each of the first lead frame and the second lead frame, thereby supporting the first lead frame and the second lead frame, the case including a peripheral edge in top plan view along the first direction and a second direction perpendicular to the first direction; wherein the first lead frame includes an extension extending in the second direction and a side surface facing in the second direction, the side surface having a non-linear configuration in top plan view provided at least by the extension, the extension includes a small-width thin extension smaller in size in the first direction than both the die bonding portion and the semiconductor light-emitting element and smaller in thickness than the die bonding portion, the case includes a first holding portion that covers a lower surface of the small-width thin extension while exposing a continuous bottom surface of the die bonding portion and a bottom surface of the thick portion, and the continuous bottom surface of the die bonding portion is larger than the bottom surface of the thick portion within the peripheral edge of the case in plan view. ### Claim 51 (depends on 50) The semiconductor light-emitting device according to claim 50, wherein the continuous bottom surface of the die bonding portion is flush with a bottom surface of the case. ### Claim 52 (depends on 51) The semiconductor light-emitting device according to claim 51, wherein a top surface of the small-width thin extension is flush with a top surface of the die bonding portion. ### Claim 53 A semiconductor light-emitting device, comprising: a first lead frame having a die bonding portion and a first rest portion other than the die bonding portion, the first rest portion being not greater in thickness than the die bonding portion; a second lead frame spaced apart from the first lead frame and including a thick portion and a second rest portion other than the thick portion, the thick portion being equal in thickness to the die bonding portion, the second rest portion being not greater in thickness than the thick portion; a semiconductor light-emitting element bonded to the die bonding portion and electrically connected to the second lead frame; and a case covering a part of each of the first lead frame and the second lead frame, thereby supporting the first lead frame and the second lead frame; wherein the first lead frame includes an extension extending outward from the die bonding portion in top plan view and a side surface facing in an extension direction in which the extension extends, the side surface having a non-linear configuration in top plan view provided at least by the extension, the extension includes a small-width thin extension smaller in size in a width direction perpendicular to the extension direction than both the die bonding portion and the semiconductor light-emitting element and smaller in thickness than the die bonding portion, the case includes a first holding portion that covers a lower surface of the small-width thin extension while exposing a continuous bottom surface of the die bonding portion and a bottom surface of the thick portion, and the continuous bottom surface of the die bonding portion is larger than the bottom surface of the thick portion within a peripheral edge of the case in plan view. ### Claim 54 (depends on 53) The semiconductor light-emitting device according to claim 53, wherein the continuous bottom surface of the die bonding portion is flush with a bottom surface of the case. ### Claim 55 (depends on 54) The semiconductor light-emitting device according to claim 54, wherein a top surface of the small-width thin extension is flush with a top surface of the die bonding portion.