# US 10,312,420 B2 · Light-emitting device having surface-modified luminophores

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- Number: US 10,312,420 B2
- Document ID: US10312420B2
- Status: Granted
- Kind: B2
- Application number: 15/940,926
- Filed: 2018-03-29
- Published: 2018-08-02
- Granted: 2019-06-04
- Earliest claimed: 2010-08-14
- Assignees: Seoul Semiconducter Co., Ltd.; LITEC-LP GmbH
- Applicants: Seoul Semiconductor Co., Ltd.; LITEC-LP GmbH
- Inventors: Chung Hoon Lee; Walter Tews; Gundula Roth; Detlef Starick
- Web page: https://patentgrep.com/patent/US10312420B2

## CPC

- H10H 20/8513: {having two or more wavelength conversion materials}
- C09K 11/025: {non-luminescent particle coatings or suspension media}
- C09K 11/77342: {Silicates}
- H10H 20/8512: {Wavelength conversion materials}
- H10H 20/8515: {not being in contact with the bodies}
- H10H 20/852: Encapsulations
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 20/8511: {characterised by their material, e.g. binder}
- H10W 72/01515: {Forming coatings}
- H10W 72/07352: {changes in structures or sizes}
- H10W 72/075: {of bond wires}
- H10W 72/321: {Structures or relative sizes of die-attach connectors}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A light emitting device including a housing, a plurality of heat-sinks adjoined to the housing and insulated from each other, a bottom surface of the heat-sinks being exposed to the outside, a light emitting diode mounted on at least one of the heat-sinks via a conductive adhesive, and a molding member encapsulating the light emitting diode and including thermosetting resin, in which a fluoride luminophore including I and IV group elements with fluorine and other luminophore are dispersed in the molding member, and the luminophores are configured to absorb at least a portion of light emitted from the light emitting diode and emit light having a wavelength different from that of the absorbed light.

## Claims

### Claim 1

A light emitting device, comprising;
a housing;
a plurality of heat-sinks adjoined to the housing and insulated from each other, a bottom surface of the heat-sinks being exposed to the outside;
a light emitting diode mounted on at least one of the heat-sinks via a conductive adhesive; and
a molding member encapsulating the light emitting diode and comprising thermosetting resin,
wherein:
a fluoride luminophore comprising I and IV group elements with fluorine and other luminophore are dispersed in the molding member;
the luminophores are configured to absorb at least a portion of light emitted from the light emitting diode and emit light having a wavelength different from that of the absorbed light; and
a fluorinated coating is formed in the luminophores, and a moisture barrier layer is formed between the luminophores and the fluorinated coating.

### Claim 2 (depends on 1)

The light emitting device of claim 1, wherein the light emitting diode comprises a plurality of light emitting cells separated from each other and disposed on the same substrate.

### Claim 3 (depends on 2)

The light emitting device of claim 2, wherein the light emitting cells are electrically connected to one another in series.

### Claim 4 (depends on 3)

The light emitting device of claim 3, wherein the light emitting cells are electrically connected to one another in parallel.

### Claim 5 (depends on 3)

The light emitting device of claim 3, wherein the light emitting device is configured to be directly driven by an AC power supply.

### Claim 6 (depends on 4)

The light emitting device of claim 4, wherein the light emitting device is configured to be directly driven by an AC power supply.

### Claim 7 (depends on 1)

The light emitting device of claim 1, wherein the luminophores are disposed on at least one of lateral, upper, and lower sides of the light emitting diode.

### Claim 8 (depends on 2)

The light emitting device of claim 2, wherein the luminophores are dotted on the light emitting diode.

### Claim 9 (depends on 2)

The light emitting device of claim 2, wherein the luminophores are uniformly distributed within the thermosetting resin of the molding member.