# US 10,312,416 B2 · Radiation-emitting semiconductor device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,312,416 B2 - Document ID: US10312416B2 - Status: Granted - Kind: B2 - Application number: 15/090,028 - Filed: 2016-04-04 - Published: 2016-07-28 - Granted: 2019-06-04 - Earliest claimed: 2010-03-24 - Assignees: OSRAM Opto Semiconductors GmbH - Applicants: OSRAM Opto Semiconductors GmbH - Inventors: Michael Wittmann - Web page: https://patentgrep.com/patent/US10312416B2 ## CPC - H10H 20/8512: {Wavelength conversion materials} - H10H 20/8506: {Containers} - H10H 20/851: Wavelength conversion means - H10W 90/00: Package configurations - H10H 20/0361: {of wavelength conversion means} - H10H 20/0362: {of encapsulations} - H10H 20/0364: {of interconnections} - H10H 20/853: characterised by their shape - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10W 72/5366: {the bond wires having kinks} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A radiation-emitting semiconductor device includes a housing body having a chip mounting area, a chip connection region, a radiation-emitting semiconductor chip, and a light-absorbing material, wherein the radiation-emitting semiconductor chip is fixed to the chip connection region, the chip connection region is covered with the light-absorbing material at selected locations at which the chip connection region is not covered by the radiation-emitting semiconductor chip, the radiation-emitting semiconductor chip is free of the light-absorbing material in selected locations, the housing body has a cavity in which the at least one radiation-emitting semiconductor chip is arranged, the chip mounting area is a surface of the housing body which abuts the cavity, and the chip mounting area is free of the light-absorbing material in selected locations remote from the chip connection region. ## Claims ### Claim 1 A radiation-emitting semiconductor device comprising: a housing body having a chip mounting area; a chip connection region; a radiation-emitting semiconductor chip; and a light-absorbing material, wherein the radiation-emitting semiconductor chip is fixed to the chip connection region, the chip connection region is covered with the light-absorbing material at first selected locations at which said chip connection region is not covered by the radiation-emitting semiconductor chip, the radiation-emitting semiconductor chip is free of the light-absorbing material in second selected locations, the housing body has a cavity in which the at least one radiation-emitting semiconductor chip is arranged, the chip mounting area is a surface of the housing body which abuts the cavity, and the chip mounting area is free of the light-absorbing material at third selected locations remote from the chip connection region. ### Claim 2 (depends on 1) The device according to claim 1, wherein a wire connection region is arranged at the chip mounting area. ### Claim 3 (depends on 1) The device according to claim 1, wherein the chip mounting area is formed with the same color as, or in a similar color to, the light absorbing material. ### Claim 4 (depends on 1) The device according to claim 1, further comprising a light-transmissive potting material, wherein the potting material is substantially free of the light-absorbing material, and the potting material adjoins the radiation-emitting semiconductor chip and the light-absorbing material in the second selected locations. ### Claim 5 (depends on 4) The device according to claim 4, wherein the potting material abuts the chip mounting area in the second selected locations. ### Claim 6 (depends on 4) The device according to claim 4, wherein the potting material is transparent. ### Claim 7 (depends on 4) The device according to claim 4, wherein the potting material is filled with a phosphor and/or a diffuser. ### Claim 8 (depends on 1) The device according to claim 1, wherein the housing body and the light-absorbing material are the same color. ### Claim 9 (depends on 2) The device according to claim 2, wherein the chip connection region and the wire connection region are formed with a metal. ### Claim 10 (depends on 9) The device according to claim 9, wherein the light-absorbing material inhibits migration and/or oxidation and/or corrosion of the metal. ### Claim 11 (depends on 1) The device according to claim 1, wherein the light-absorbing material comprises a silicone into which light-absorbing particles are introduced. ### Claim 12 (depends on 1) A display apparatus comprising at least one pixel formed at least partly by the device according to claim 1. ### Claim 13 (depends on 1) A method of producing the device according to claim 1 comprising applying the light-absorbing material by a jet process. ### Claim 14 A radiation-emitting semiconductor device comprising: a housing body having a chip mounting area; a wire connection region arranged at the chip mounting area; a wire electrically conductively connecting the wire connection region to the radiation-emitting semiconductor chip; a chip connection region; a radiation-emitting semiconductor chip; and a light-absorbing material, wherein the radiation-emitting semiconductor chip is fixed to the chip connection region, the wire connection region is covered with the light-absorbing material at the first selected locations at which it is not covered by the wire, the chip connection region is covered with the light-absorbing material at first selected locations at which said chip connection region is not covered by the radiation-emitting semiconductor chip, the radiation-emitting semiconductor chip is free of the light-absorbing material in second selected locations, the housing body has a cavity in which the at least one radiation-emitting semiconductor chip is arranged, the chip mounting area is a surface of the housing body which abuts the cavity, and the chip mounting area is free of the light-absorbing material at third selected locations remote from the chip connection region. ### Claim 15 (depends on 1) The device according to claim 1, wherein at least 50% of the chip mounting area is free of the light-absorbing material. ### Claim 16 (depends on 1) The device according to claim 1, wherein the light-absorbing material reflects or reemits at most 25% of light that impinges on an outer area of the light-absorbing material.