# US 10,312,415 B2 · Flexible electronic assembly with semiconductor die

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- Number: US 10,312,415 B2
- Document ID: US10312415B2
- Status: Granted
- Kind: B2
- Application number: 15/627,215
- Filed: 2017-06-19
- Published: 2018-12-20
- Granted: 2019-06-04
- Earliest claimed: 2017-06-19
- Assignees: Microsoft Technology Licensing, LLC
- Applicants: Microsoft Technology Licensing, LLC
- Inventors: James David Holbery; Siyuan Ma; Benjamin Sullivan
- Web page: https://patentgrep.com/patent/US10312415B2

## CPC

- H10H 20/8506: {Containers}
- H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)}
- H10H 20/01: Manufacture or treatment
- H10H 20/8514: {characterised by their shape, e.g. plate or foil}
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10W 90/00: Package configurations
- H05K 1/0366: {reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence)}
- H05K 2201/10106: Light emitting diode [LED]
- H05K 2203/1311: Foil encapsulation, e.g. of mounted components
- H10H 20/0362: {of encapsulations}
- H10H 20/0364: {of interconnections}
- H10H 20/819: characterised by their shape, e.g. curved or truncated substrates
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An electronic assembly comprises a flexible polymer membrane having a surface with one or more electrically conductive traces arranged on the surface, a light-emissive semiconductor die having first and second electrical contacts bonded to the one or more electrically conductive traces via a cured electrically conductive adhesive, and a flexible cover layer arranged over the surface of the polymer membrane and the semiconductor die.

## Claims

### Claim 1

An electronic assembly comprising:
a flexible polymer membrane having a surface with one or more electrically conductive traces arranged on the surface;
a semiconductor die having first and second electrical contacts bonded to the one or more electrically conductive traces via a cured electrically conductive adhesive;
an adhesive encapsulant layer arranged on the surface and configured to encapsulate the semiconductor die; and
a flexible cover textile bonded to the surface and to the semiconductor die via the adhesive encapsulant layer.

### Claim 2 (depends on 1)

The electronic assembly of claim 1 wherein the cover textile is at least partly transmissive to light emitted by the semiconductor die.

### Claim 3 (depends on 1)

The electronic assembly of claim 1 wherein the semiconductor die includes a light-emitting diode.

### Claim 4 (depends on 1)

The electronic assembly of claim 1 wherein the polymer membrane comprises a fabric material.

### Claim 5 (depends on 1)

The electronic assembly of claim 1 wherein the flexible cover textile includes a woven fabric.

### Claim 6 (depends on 1)

The electronic assembly of claim 1 wherein the cured electrically conductive adhesive is formed from an adhesive curable to a partially cured state.

### Claim 7 (depends on 1)

The electronic assembly of claim 1 wherein the semiconductor die is a light-emissive semiconductor die.

### Claim 8 (depends on 1)

The electronic assembly of claim 1 wherein the one or more electrically conductive traces are formed at least partially from a different material than the cured electrically conductive adhesive.

### Claim 9 (depends on 1)

The electronic assembly of claim 1 wherein the adhesive encapsulant layer comprises a color conversion material.

### Claim 10 (depends on 1)

The electronic assembly of claim 1 wherein the flexible cover textile includes an optically diffusive cover layer.

### Claim 11

A fabric-based electronic assembly comprising:
a polymer membrane having a surface with one or more electrically conductive traces arranged on the surface;
a light-emissive semiconductor die having first and second electrical contacts bonded to the one or more electrically conductive traces via a cured electrically conductive adhesive;
an adhesive encapsulant layer arranged on the surface and configured to encapsulate the semiconductor die; and
a cover textile bonded to the surface and to the light-emissive semiconductor die via the encapsulant layer.

### Claim 12 (depends on 11)

The fabric-based electronic assembly of claim 11 wherein the encapsulant layer includes a color-conversion material.

### Claim 13 (depends on 11)

The fabric-based electronic assembly of claim 11 wherein the cover textile is a woven cover textile configured to transmit light emitted by the semiconductor die.

### Claim 14 (depends on 11)

The fabric-based electronic assembly of claim 11 wherein the polymer membrane is one or more of a polyimide membrane and a polyethylene tetraphthalate membrane, and wherein the cured electrically conductive adhesive is one or more of a urethane adhesive and a polysiloxane adhesive.