# US 10,312,316 B2 · Display apparatus and method of manufacturing the same, package cover plate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,312,316 B2 - Document ID: US10312316B2 - Status: Granted - Kind: B2 - Application number: 15/713,465 - Filed: 2017-09-22 - Published: 2018-03-22 - Granted: 2019-06-04 - Earliest claimed: 2016-09-22 - Assignees: Boe Technology Group Co., Ltd.; Hefei Xinsheng Optoelectronics Technology Co., Ltd. - Applicants: Boe Technology Group Co., Ltd.; Hefei Xinsheng Optoelectronics Technology Co., Ltd. - Inventors: Yulin Wang; Li Sun - Web page: https://patentgrep.com/patent/US10312316B2 ## CPC - G02F 1/1345: Conductors connecting electrodes to cell terminals - G02F 1/13452: {Conductors connecting driver circuitry and terminals of panels} - G02F 1/13454: {Drivers integrated on the active matrix substrate (G02F1/136277 takes precedence)} - H10K 59/131: Interconnections, e.g. wiring lines or terminals - H10K 59/871: {Self-supporting sealing arrangements} - G02F 1/133603: {with LEDs} - G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES ## Abstract A display apparatus includes a display substrate, a package cover plate on the display substrate, and a plurality of FPCs; at one end of the FPC is a driver IC, and the other end of the FPC is connected to the display substrate; a groove is at the edge of the surface away from the display substrate, and the opening direction of the groove deviates from the display substrate; the groove includes a first groove wall, and a second and third groove walls, wherein the first groove wall is located within the package cover plate and the two sides of which are connected to one side of each of the second and third groove walls, respectively, while the other side of each of the second and third groove walls extends to the edge of the package cover plate. ## Claims ### Claim 1 A display apparatus, comprising a display substrate, a package cover plate arranged on the display substrate, and a plurality of FPCs (Flexible Printed Circuits), at one end of one of the plurality of FPCs there being arranged a driver IC, and the other end of the one of the plurality of FPCs being connected to the display substrate, wherein a groove is arranged at the edge of the surface that is far away from the display substrate of the package cover plate, and the opening direction of the groove deviates from the display substrate; the groove comprises a first groove wall, and second and third groove walls which are arranged oppositely, the first groove wall is located within the package cover plate and the two sides of which are connected to one side of each of the second and third groove walls, respectively, and the other side of each of the second and third groove walls extends to the edge of the package cover plate, respectively; the end of the one of the plurality of FPCs on which the driver IC is arranged is located within the groove. ### Claim 2 (depends on 1) The display apparatus according to claim 1, wherein, the distance from the groove bottom of the groove to the surface that is close to the display substrate of the package cover plate is about 0.1 mm to about 0.3 mm. ### Claim 3 (depends on 1) The display apparatus according to claim 1, wherein, the connection part connecting the groove bottom and the groove wall of the groove is shaped in an arch shape. ### Claim 4 (depends on 1) The display apparatus according to claim 1, wherein, the vertical projection of the groove projected on the display substrate is located within a frame region of the display substrate. ### Claim 5 (depends on 1) The display apparatus according to claim 1, wherein, the display substrate comprises an array substrate and an organic light emitting layer arranged between the array substrate and the package cover plate. ### Claim 6 (depends on 1) The display apparatus according to claim 1, wherein, an encapsulant layer is arranged between the display substrate and the package cover plate. ### Claim 7 (depends on 1) A package cover plate, which is applicable for the display apparatus according to claim 1 and comprises a first surface and a second surface arranged oppositely; a groove is formed in the first surface at an edge of the first surface, and the opening direction of the groove deviates from the second surface; the groove comprises a first groove wall, and a second and third groove wall which are arranged oppositely, wherein the first groove wall is located within the package cover plate and the two sides of which are connected to one side of each of the second and third groove walls, respectively, while the other side of each of the second and third groove walls extends to the edge of the package cover plate, respectively; the package cover plate comprises a plurality of grooves, the plurality of grooves are arranged around the edge of the first surface. ### Claim 8 (depends on 7) The package cover plate according to claim 7, wherein, the distance from the groove bottom of the groove to the second surface is about 0.1 mm to about 0.3 mm. ### Claim 9 (depends on 7) The package cover plate according to claim 7, wherein, the connection part connecting the groove bottom and the groove wall of the groove is shaped in an arch shape. ### Claim 10 (depends on 1) A method for manufacturing the display apparatus of claim 1, comprising: providing with a package cover plate which comprises a first surface and second surface arranged oppositely; locating a cutting line on the first surface of the package cover plate; forming a groove on and across the cutting line, wherein the opening direction of the groove deviates from the second surface, and the groove comprises four groove walls connected in sequence; the groove wall that is close to the edge of the package cover plate and the groove wall that is far away from the edge of the package cover plate are located at each side of the cutting line, respectively; cutting the package cover plate along the cutting line. ### Claim 11 (depends on 10) The method for manufacturing the display apparatus according to claim 10, wherein, the step of forming a groove on and across the cutting line comprises: forming a plurality of grooves on and across the cutting line by adopting a half-etching process. ### Claim 12 (depends on 10) The method for manufacturing the display apparatus according to claim 10, wherein, before the step of locating a cutting line on the first surface of the package cover plate, the method further comprises: forming an organic light emitting layer on an array substrate so as to form a display substrate; forming an encapsulant layer on the organic light emitting layer; placing the package cover plate on the encapsulant layer, and letting the second surface of the package cover plate being attached on the display substrate. ### Claim 13 (depends on 10) The method for manufacturing the display apparatus according to claim 10, wherein, the step of cutting the package cover plate along the cutting line comprises: cutting the package cover plate by adopting a laser cutting process. ### Claim 14 (depends on 10) The method for manufacturing the display apparatus according to claim 10, wherein, after the step of cutting the package cover plate along the cutting line, the method further comprises: letting the end of the FPC on which the driver IC is arranged go down into the groove, while the other end of the FPC being connected with the display substrate. ### Claim 15 A display apparatus, comprising a display substrate, a package cover plate arranged on the display substrate, and a plurality of FPCs (Flexible Printed Circuits), at one end of one of the plurality of FPCs there being arranged a driver IC, and an opposite end of the one of the plurality of FPCs being connected to the display substrate, wherein the package cover plate comprises a plurality of grooves, each groove is arranged at an edge of a surface of the package cover plate far away from the display substrate, and an opening direction of the groove deviates from the display substrate; the groove comprises a first groove wall, and second and third groove walls which are arranged oppositely, the first groove wall is located within the package cover plate and two sides of which are connected to one side of each of the second and third groove walls, respectively, and another side of each of the second and third groove walls extends to an edge of the package cover plate, respectively; the end of the one of the plurality of FPCs on which the driver IC is arranged is located within the groove, wherein the plurality of grooves are arranged around the edge of the surface of the package cover plate far away from the display substrate. ### Claim 16 (depends on 15) The display apparatus according to claim 15, wherein, a distance from a groove bottom of the groove to a surface of the package cover plate close to the display substrate is about 0.1 mm to about 0.3 mm. ### Claim 17 (depends on 15) The display apparatus according to claim 15, wherein, a connection part connecting a groove bottom and a groove wall of the groove is shaped in an arch shape. ### Claim 18 (depends on 15) The display apparatus according to claim 15, wherein, a vertical projection of the groove projected on the display substrate is located within a frame region of the display substrate. ### Claim 19 (depends on 15) The display apparatus according to claim 15, wherein, the display substrate comprises an array substrate and an organic light emitting layer arranged between the array substrate and the package cover plate. ### Claim 20 (depends on 15) The display apparatus according to claim 15, wherein, an encapsulant layer is arranged between the display substrate and the package cover plate.