# US 10,312,285 B2 · LED illuminator and method of making the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,312,285 B2 - Document ID: US10312285B2 - Status: Granted - Kind: B2 - Application number: 15/276,478 - Filed: 2016-09-26 - Published: 2017-03-30 - Granted: 2019-06-04 - Earliest claimed: 2015-09-30 - Assignees: Rohm Co., Ltd. - Applicants: Rohm Co., Ltd. - Inventors: Shinsei Mizuta - Web page: https://patentgrep.com/patent/US10312285B2 ## CPC - H10H 29/14: comprising multiple light-emitting semiconductor components - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H10H 20/856: Reflecting means - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 20/036: {of packages} - H10H 20/0362: {of encapsulations} - H10H 20/0363: {of optical field-shaping means} - H10W 72/01515: {Forming coatings} - H10W 72/075: {of bond wires} - H10W 72/884: {Die-attach connectors and bond wires} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An LED illuminator includes an LED chip and an opaque resin member. The LED chip includes a support substrate, a semiconductor layer disposed on the obverse surface of the support substrate, an electrode formed on the reverse surface of the support substrate. The obverse surface of the support substrate has a peripheral edge portion exposed from the semiconductor layer. The opaque resin member covers at least apart of the side surface of the support substrate while exposing the peripheral edge portion of the obverse surface of the support substrate. ## Claims ### Claim 1 An LED illuminator, comprising: at least one LED chip including a first LED chip; and an opaque resin member that does not transmit light from the LED chip, wherein the LED chip includes: a support substrate having an obverse surface, a reverse surface and a side surface located between the obverse surface and the reverse surface; a semiconductor layer disposed on the obverse surface of the support substrate; and a first electrode formed on the reverse surface of the support substrate, the obverse surface of the support substrate has a peripheral edge portion exposed from the semiconductor layer, the opaque resin member covers at least a part of the side surface of the support substrate and exposing the peripheral edge portion of the obverse surface, the semiconductor layer has a curved surface located at an end of the semiconductor layer in plan view, the curved surface being curved in a recessed shape in a cross-sectional view taken along a plane that is parallel to a thickness direction of the semiconductor layer, the semiconductor layer has a first surface and a second surface that faces a side opposite the first surface, the second surface of the semiconductor layer being disposed between the first surface of the semiconductor layer and the obverse surface of the support substrate, the first surface of the semiconductor layer is smaller in dimension in a lateral direction perpendicular to the thickness direction than the second surface of the semiconductor layer, the LED chip includes a second electrode that is disposed on the first surface of the semiconductor layer, the first surface of the semiconductor layer includes an exposed portion that is exposed from the second electrode, the curved surface of the semiconductor layer includes a first end and a second end, the first end of the curved surface being connected to the first surface of the semiconductor layer, the second end of the curved surface being connected to the obverse surface of the support substrate, and a dimension of the exposed portion of the first surface of the semiconductor layer in the lateral direction is larger than a distance between the first end of the curved surface and the second end of the curved surface in the lateral direction. ### Claim 2 (depends on 1) The LED illuminator according to claim 1, wherein an entirety of the support substrate is electroconductive. ### Claim 3 (depends on 1) The LED illuminator according to claim 1, wherein the opaque resin member is white. ### Claim 4 (depends on 1) The LED illuminator according to claim 1, wherein the opaque resin member is made of a silicone resin containing titanium oxide. ### Claim 5 (depends on 4) The LED illuminator according to claim 4, wherein the opaque resin member comprises 5 to 50% of the titanium oxide. ### Claim 6 (depends on 4) The LED illuminator according to claim 4, wherein the opaque resin member comprises 20% of the titanium oxide. ### Claim 7 (depends on 1) The LED illuminator according to claim 1, wherein the opaque resin member covers an entirety of the side surface of the support substrate. ### Claim 8 (depends on 1) The LED illuminator according to claim 1, wherein the semiconductor layer emits red light. ### Claim 9 (depends on 1) The LED illuminator according to claim 1, further comprising a base substrate including a base material and a wiring pattern, wherein the first LED chip is mounted on the base substrate. ### Claim 10 (depends on 9) The LED illuminator according to claim 9, wherein the first electrode is electrically connected to the wiring pattern. ### Claim 11 (depends on 10) The LED illuminator according to claim 10, further comprising a plurality of terminals arranged in the lateral direction, each of the terminals being electrically connected to the wiring pattern, wherein each of the terminals is circular in plan view. ### Claim 12 (depends on 10) The LED illuminator according to claim 10, wherein the curved surface of the semiconductor layer is connected to the first and second surfaces of the semiconductor layer, the curved surface of the semiconductor layer is disposed between the first and second surfaces of the semiconductor layer in the thickness direction, and the wire is bonded on the first surface of the semiconductor layer via the second electrode. ### Claim 13 (depends on 9) The LED illuminator according to claim 9, further comprising a terminal electrically connected to the wiring pattern. ### Claim 14 (depends on 9) The LED illuminator according to claim 9, further comprising a wire, wherein the second electrode and the wiring pattern are electrically connected to each other by the wire. ### Claim 15 (depends on 1) The LED illuminator according to claim 1, further comprising a second LED chip, a first wire connected to the first LED chip, and a second wire connected to the second LED chip, wherein a direction in which the first wire extends from the first LED chip in plan view is different from a direction in which the second wire extends from the second LED chip in plan view. ### Claim 16 (depends on 1) The LED illuminator according to claim 1, further comprising a reflector and a light-transmitting sealing resin member, wherein the reflector has a reflecting surface surrounding the first LED chip, and the light-transmitting sealing resin member covers the semiconductor layer. ### Claim 17 (depends on 16) The LED illuminator according to claim 16, wherein the light-transmitting sealing resin member covers the peripheral edge portion of the obverse surface. ### Claim 18 (depends on 16) The LED illuminator according to claim 16, wherein the opaque resin member has a top surface, the whole top surface of the opaque resin member being held in contact with the light-transmitting sealing resin member, the top surface of the opaque resin member includes an edge held in contact with the side surface of the support substrate, the side surface of the support substrate includes a part exposed from the top surface of the opaque resin, and the edge of the top surface is located at a lower position in the thickness direction than both the peripheral edge portion of the obverse surface and the curved surface of the semiconductor layer. ### Claim 19 (depends on 18) The LED illuminator according to claim 18, wherein the top surface of the opaque resin member includes a first portion, and the first portion of the top surface is located at a higher position in the thickness direction than both the peripheral edge portion of the obverse surface and the second surface of the semiconductor substrate, and overlaps the curved surface of the semiconductor layer in the thickness direction. ### Claim 20 (depends on 16) The LED illuminator according to claim 16, further comprising two diodes, and wherein, in plan view, each of the reflector and one of the at least one LED chip is disposed between the two diodes. ### Claim 21 (depends on 20) The LED illuminator according to claim 20, wherein each of the two diodes include a first edge and a second edge that is larger in dimension in plan view than the first edge, and in plan view, the first edge of one of the two diodes is perpendicular to the first edge of the other one of the two diodes. ### Claim 22 (depends on 16) The LED illuminator according to claim 16, wherein the curved surface of the semiconductor layer is exposed from the opaque resin, and held in contact with the light-transmitting sealing resin member. ### Claim 23 (depends on 1) The LED illuminator according to claim 1, wherein the at least one LED chip includes five LED chips, and in plan view, one of the five LED chips is disposed between two others of the five LED chips and between the other two others of the five LED chips. ### Claim 24 (depends on 1) The LED illuminator according to claim 1, wherein a center of the second electrode in the lateral direction is offset in the lateral direction from a center of the first surface of the semiconductor layer in the lateral direction.