# US 10,312,282 B2 · Solid-state imaging device and imaging system > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,312,282 B2 - Document ID: US10312282B2 - Status: Granted - Kind: B2 - Application number: 15/788,026 - Filed: 2017-10-19 - Published: 2018-02-08 - Granted: 2019-06-04 - Earliest claimed: 2015-04-30 - Assignees: Olympus Corporation - Applicants: Olympus Corporation - Inventors: Toru Kondo - Web page: https://patentgrep.com/patent/US10312282B2 ## CPC - H10F 39/811: {Interconnections} - H10D 89/931: {characterised by the dispositions of the protective arrangements} - H10F 39/12: Image sensors - H10F 39/809: {of hybrid image sensors} - H10W 42/60: protecting against electrostatic charges or discharges, e.g. Faraday shields (integrated devices comprising arrangements for electrical protection H10D89/60) - H10W 72/50: Bond wires - H10W 72/932: {Plan-view shape, i.e. in top view} - H10W 72/9445: {Top-view layouts, e.g. mirror arrays} - H10W 90/792: {between multiple chips} - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A solid-state imaging device includes a first substrate, a second substrate, an electrode portion, a first substrate connecting portion, an electrostatic protection circuit, and a second substrate connecting portion. A photoelectric conversion element is disposed on the first substrate. A part of the peripheral circuit is arranged on the second substrate. The electrode portion has a connection surface. The first substrate connecting portion electrically connects the electrode portion and the second substrate. The electrostatic protection circuit is connected to a circuit between the first substrate connecting portion and the peripheral circuit. The second substrate connecting portion electrically connects the peripheral circuit and the photoelectric conversion element. The electrostatic protection circuit is disposed at a position such that the electrostatic protection circuit does not overlap any of the first substrate connecting portion and the second substrate connecting portion. ## Claims ### Claim 1 A solid-state imaging device comprising: a first substrate on which a photoelectric conversion element is arranged; a second substrate laminated and disposed on the first substrate, at least a part of a peripheral circuit being arranged in the second substrate, the peripheral circuit including a control circuit and a readout circuit configured to read a signal based on an electric charge of the photoelectric conversion element; an electrode portion provided on the first substrate and having a connection surface exposed to outside of the first substrate, the connection surface being provided so as to be electrically connectable toward outside of the first substrate; a first substrate connecting portion disposed between the first substrate and the second substrate, the first substrate connecting portion electrically connecting the electrode portion and the second substrate; an electrostatic protection circuit provided in the second substrate, the electrostatic protection circuit being electrically connected to the first substrate connecting portion and the peripheral circuit; and a second substrate connecting portion disposed between the first substrate and the second substrate, the second substrate connecting portion electrically connecting the peripheral circuit disposed on the second substrate and the photoelectric conversion element disposed on the first substrate, wherein, when viewed in a lamination direction in which the first substrate and the second substrate are laminated on each other, an area of the electrode portion is greater than an area of the first substrate connecting portion connected to the electrode portion, and the electrostatic protection circuit is disposed at a position such that the electrostatic protection circuit overlaps the connection surface and does not overlap any of the first substrate connecting portion and the second substrate connecting portion. ### Claim 2 (depends on 1) The solid-state imaging device according to claim 1, wherein, when viewed in the lamination direction, the electrode portion is disposed on the first substrate outside the peripheral circuit, and the first substrate connecting portion connected to the electrode portion is arranged at a position outside a region sandwiched between the electrode portion and the peripheral circuit. ### Claim 3 (depends on 2) The solid-state imaging device according to claim 2, wherein, when viewed in the lamination direction, the electrode portion and the first substrate connecting portion connected to the electrode portion are disposed at positions such that the electrode portion and the substrate connecting portion do not overlap each other. ### Claim 4 (depends on 1) An imaging system comprising: the solid-state imaging device according to claim 1. ### Claim 5 (depends on 2) An imaging system comprising: the solid-state imaging device according to claim 2. ### Claim 6 (depends on 3) An imaging system comprising: the solid-state imaging device according to claim 3. ### Claim 7 (depends on 1) The solid-state imaging device according to claim 1, wherein, when viewed in the lamination direction, the first substrate connecting portion overlaps the connection surface, and the electrostatic protection circuit overlaps the connection surface at a position nearer to the peripheral circuit than a position at which the first substrate connecting portion overlaps the connection surface. ### Claim 8 (depends on 7) An imaging system comprising: the solid-state imaging device according to claim 7.