# US 10,312,257 B2 · Semiconductor device and method for manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,312,257 B2 - Document ID: US10312257B2 - Status: Granted - Kind: B2 - Application number: 15/908,921 - Filed: 2018-03-01 - Published: 2018-07-05 - Granted: 2019-06-04 - Earliest claimed: 2016-09-09 - Assignees: Toshiba Memory Corporation - Applicants: Toshiba Memory Corporation - Inventors: Akio Kaneko - Web page: https://patentgrep.com/patent/US10312257B2 ## CPC - H10B 43/27: the channels comprising vertical portions, e.g. U-shaped channels - H10B 41/27: the channels comprising vertical portions, e.g. U-shaped channels - H10D 64/035: {comprising conductor-insulator-conductor-insulator-semiconductor structures} - H10P 14/3802: {Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth} - H10P 14/412: {Deposition of metallic or metal-silicide materials} - H10P 32/14: within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase - H10P 50/264: {by chemical means} - H10P 50/283: {by chemical means} - H10P 95/90: Thermal treatments, e.g. annealing or sintering - H10D 64/037: {comprising charge-trapping insulators} - H10B: ELECTRONIC MEMORY DEVICES - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A method for manufacturing a semiconductor device includes forming a first semiconductor layer, forming a stacked body including alternately formed first and second layers on the first semiconductor layer, forming a hole from an upper surface of the stacked body to the first semiconductor layer to expose the first semiconductor layer therein. A first insulating layer is formed on the inner wall of the hole, and a second semiconductor layer is formed on the first insulating layer within the hole, wherein the second semiconductor layer is electrically connected to the first semiconductor layer. A metal layer is provided in contact with at least one of the first and second semiconductor layers. The stacked body, semiconductor layers, insulating layer and metal layer are exposed to an annealing temperature sufficient to cause migration of metal in the metal layer into one of the first and second semiconductor layers. ## Claims ### Claim 1 A semiconductor device, comprising: a first layer; a first semiconductor layer on the first layer; a stacked body on the first semiconductor layer, the stacked body including a plurality of electrode layers spaced apart in a first direction; a first insulating layer extending inwardly of the stacked body in the first direction and extending past at least a portion of the electrode layers; and a second semiconductor layer electrically connected to the first semiconductor layer and extending inwardly of the stacked body in the first direction, wherein the first insulating layer extends between the second semiconductor layer and adjacent electrode layers in the stacked body, wherein a plurality of memory cells are located at the interface of the individual electrode layers with the adjacent portions of the first insulating layer and the second semiconductor layer, the plurality of memory cells including a first memory cell and a second memory cell farther from the first layer than the second memory cell; a first portion of the second semiconductor layer that is adjacent the first memory cell includes a single crystal and a second portion of the second semiconductor layer that is adjacent the second memory cell includes a single crystal; and an average crystal grain size in the first portion of the second semiconductor layer is larger than in the second portion of the second semiconductor layer. ### Claim 2 (depends on 1) The semiconductor device according to claim 1, wherein the first insulating layer comprises a plurality of layers. ### Claim 3 (depends on 1) The semiconductor device according to claim 1, wherein the first insulating layer is configured to store a charge in a plurality of sections positioned between the plurality of electrode layers and the first semiconductor layer. ### Claim 4 (depends on 1) The semiconductor device according to claim 1, wherein the first layer and the stacked body are organized parallel in a second direction, wherein the second direction is approximately orthogonal to the first direction. ### Claim 5 (depends on 1) The semiconductor device according to claim 1, wherein the first semiconductor layer is monocrystalline. ### Claim 6 (depends on 1) The semiconductor device according to claim 1, wherein the first semiconductor layer comprises a plurality of layers. ### Claim 7 A semiconductor device comprising: a conductive layer including a first metal layer; a stacked body on the conductive layer, the stacked body including a plurality of electrode layers spaced apart in a first direction; a first insulating layer extending inwardly of the stacked body in the first direction and extending past at least a portion of the electrode layers; and a first semiconductor layer electrically connected to the conductive layer and extending inwardly of the stacked body in the first direction, wherein the first insulating layer extends between the first semiconductor layer and adjacent electrode layers in the stacked body, wherein the conductive layer includes a metal different from the metal of the first metal layer. ### Claim 8 (depends on 7) The semiconductor device according to claim 7, wherein the conductive layer includes a second semiconductor layer provided on the first metal layer. ### Claim 9 (depends on 8) The semiconductor device according to claim 8, wherein at least one surface of the first semiconductor layer and the second semiconductor layer includes a metal different than the metal of the first metal layer. ### Claim 10 (depends on 9) The semiconductor device according to claim 9, wherein a concentration of the metal is greater at a surface of the first or second semiconductor layers closer to the first conductive layer than at a surface of the first or second semiconductor layers farther from the first conductive layer. ### Claim 11 (depends on 7) The semiconductor device according to claim 7, wherein the metal comprises at least one of nickel, cobalt, palladium, gold, and copper. ### Claim 12 (depends on 7) The semiconductor device according to claim 7, further comprising a third semiconductor layer located between the conductive layer and the first semiconductor layer, the third semiconductor layer electrically connected to the conductive layer and the first semiconductor layer. ### Claim 13 (depends on 12) The semiconductor device of claim 12, further comprising a second insulating layer disposed between the third semiconductor layer and an electrode layer of the plurality of electrode layers. ### Claim 14 (depends on 12) The semiconductor device of claim 12, wherein the first insulating layer is disposed between the second semiconductor layer and the third semiconductor layer. ### Claim 15 (depends on 7) The semiconductor device according to claim 7, further comprising a source-side selection transistor, wherein the source-side selection transistor comprises an electrode layer, of the stacked body, nearest to the conductive layer. ### Claim 16 (depends on 7) The semiconductor device according to claim 7, further comprising a drain-side selection transistor, wherein the drain-side selection transistor comprises an electrode layer, of the stacked body, farthest from the conductive layer. ### Claim 17 (depends on 7) The semiconductor device according to claim 7, wherein the first insulating layer comprises a conductive body. ### Claim 18 (depends on 7) The semiconductor device according to claim 7, further comprising a second stacked body over the conductive layer. ### Claim 19 (depends on 18) The semiconductor device according to claim 18, wherein a second insulating layer is disposed between the stacked body and the second stacked body. ### Claim 20 (depends on 19) The semiconductor device according to claim 19, further comprising an electrode disposed between the stacked body and the second stacked body, the electrode electrically coupled to the conductive layer, wherein the second insulating layer is disposed between the electrode and the stacked body, and wherein the second insulating layer is further disposed between the electrode and second stacked body.