# US 10,312,223 B2 · Semiconductor light-emitting device and method for producing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,312,223 B2 - Document ID: US10312223B2 - Status: Granted - Kind: B2 - Application number: 15/710,605 - Filed: 2017-09-20 - Published: 2018-03-29 - Granted: 2019-06-04 - Earliest claimed: 2016-09-23 - Assignees: Stanley Electric Co., Ltd. - Applicants: Stanley Electric Co., Ltd. - Inventors: Akihiko Hanya - Web page: https://patentgrep.com/patent/US10312223B2 ## CPC - H10W 90/00: Package configurations - H10W 72/072: {of bump connectors} - H10H 20/0364: {of interconnections} - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS ## Abstract A light-emitting device having a plurality of light-emitting elements closely adjacently disposed in spite of using only one substrate is provided. One or more light-emitting elements are flip-chip mounted on each of upper surface and lower surface of a substrate. The light-emitting elements are disposed so that the light-emitting elements on the upper surface of the substrate and the light-emitting elements on the lower surface of the substrate are closely adjacent to each other when they are seen from above the substrate. The light-emitting elements mounted on the upper surface of the substrate have light-emitting surfaces as the upper surfaces, and the light-emitting elements mounted on the lower surfaces of the substrate have light-emitting surfaces on the substrate side. The substrate transmits at least lights emitted by the light-emitting elements mounted on the lower surface of the substrate. ## Claims ### Claim 1 A semiconductor light-emitting device comprising: a substrate having a circuit pattern on each of an upper surface and a lower surface thereof, the circuit patterns being porous; one or more light-emitting elements flip-chip mounted on the upper surface of the substrate; and one or more light-emitting elements flip-chip mounted on the lower surface of the substrate, wherein: the light-emitting elements disposed on the upper surface of the substrate and the light-emitting elements disposed on the lower surface of the substrate are disposed so that they are adjacently disposed, when they are seen from above the substrate, the light-emitting elements mounted on the upper surface of the substrate have light-emitting surfaces as upper surfaces thereof, and the light-emitting elements mounted on the lower surface of the substrate have light-emitting surfaces on the substrate side, the substrate transmits at least lights emitted by the light-emitting elements mounted on the lower surface of the substrate, colors of emission lights of the light-emitting elements on the upper surface of the substrate and the light-emitting elements on the lower surface, which are adjacently disposed when they are seen from above the substrate, are different from each other, and the circuit patterns are constituted by different conductive materials depending on colors of emission lights of the light-emitting elements. ### Claim 2 (depends on 1) The semiconductor light-emitting device according to claim 1, wherein the circuit patterns are obtained by sintering conductive particles. ### Claim 3 (depends on 1) The semiconductor light-emitting device according to claim 1, wherein a line width of the circuit patterns is not larger than sizes of the light-emitting elements. ### Claim 4 (depends on 3) The semiconductor light-emitting device according to claim 3, wherein the light-emitting elements have electrodes, and the line width of the circuit patterns is not larger than sizes of the electrodes. ### Claim 5 (depends on 1) The semiconductor light-emitting device according to claim 1, wherein the light-emitting elements on the upper surface of the substrate and the light-emitting elements on the lower surface of the substrate are adjacently disposed without any gaps when they are seen from above the substrate. ### Claim 6 (depends on 1) The semiconductor light-emitting device according to claim 1, wherein the light-emitting elements on the upper surface of the substrate and the light-emitting elements on the lower surface of the substrate partially overlap with each other when they are seen from above the substrate. ### Claim 7 (depends on 1) The semiconductor light-emitting device according to claim 1, wherein the substrate is flexible. ### Claim 8 (depends on 7) The semiconductor light-emitting device according to claim 7, wherein the light-emitting elements on the upper surface of the substrate and the light-emitting elements on the lower surface of the substrate are adjacently disposed without any gaps when they are seen from above the substrate. ### Claim 9 (depends on 7) The semiconductor light-emitting device according to claim 7, wherein the light-emitting elements on the upper surface of the substrate and the light-emitting elements on the lower surface of the substrate partially overlap with each other when they are seen from above the substrate. ### Claim 10 (depends on 7) The semiconductor light-emitting device according to claim 7, wherein a line width of the circuit patterns is not larger than sizes of the light-emitting elements. ### Claim 11 (depends on 10) The semiconductor light-emitting device according to claim 10, wherein the light-emitting elements have electrodes, and the line width of the circuit patterns is not larger than sizes of the electrodes. ### Claim 12 A method for producing a semiconductor light-emitting device, the semiconductor light-emitting device comprising a substrate having a circuit pattern on each of an upper surface and a lower surface thereof, one or more light-emitting elements being flip-chip mounted on the upper surface of the substrate, and one or more light-emitting elements being flip-chip mounted on the lower surface of the substrate, the light-emitting elements disposed on the upper surface of the substrate and the light-emitting elements disposed on the lower surface of the substrate being disposed so that they are adjacently disposed, when they are seen from above the substrate, the light-emitting elements mounted on the upper surface of the substrate having light-emitting surfaces as upper surfaces thereof, and the light-emitting elements mounted on the lower surface of the substrate having light-emitting surfaces on the substrate side, and the substrate transmitting at least lights emitted by the light-emitting elements mounted on the lower surface of the substrate, and the method comprising: a film formation step of applying a dispersion in which conductive particles and an insulating material are dispersed or a dispersion in which conductive particles coated with an insulating material layer are dispersed on a surface of the substrate that transmits light to form a film of conductive particles coated with the insulating material; a circuit pattern formation step of irradiating a light flux on the film to sinter the conductive particles of only a region of a part of the film, and thereby form the circuit pattern adhered to the substrate; a light-emitting element mounting step of mounting the light-emitting elements having electrodes so that the electrodes contact with the film after the film formation step; and a connection region formation step of irradiating a light flux on a region of the film that contacts with the electrode through the substrate from the side of the substrate opposite to the side carrying the film to sinter the conductive particles of the region that contacts with the electrode, and thereby form an electrode connection region adhered to the electrode and the surface of the substrate facing the electrode. ### Claim 13 (depends on 12) The method according to claim 12, wherein a diameter of the irradiation of the light flux on the film is smaller than that of the electrode. ### Claim 14 (depends on 12) The method according to claim 12, wherein the circuit pattern formation step is performed successively to the connection region formation step by irradiating the light flux through the substrate on a region of a part of the film from the side of the substrate opposite to the side carrying the film.