# US 10,312,218 B1 · Method for binding micro device to substrate

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- Number: US 10,312,218 B1
- Document ID: US10312218B1
- Status: Granted
- Kind: B1
- Application number: 16/040,558
- Filed: 2018-07-20
- Granted: 2019-06-04
- Earliest claimed: 2018-07-20
- Assignees: Mikro Mesa Technology Co., Ltd.
- Applicants: Mikro Mesa Technology Co., Ltd.
- Inventors: Li-Yi Chen
- Web page: https://patentgrep.com/patent/US10312218B1

## CPC

- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 20/0364: {of interconnections}
- H10W 72/07152: {Means for cooling}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07304: {the auxiliary member being temporary, e.g. a sacrificial coating}
- H10W 72/07341: {Controlling the bonding environment, e.g. atmosphere composition or temperature}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A method for binding a micro device to a substrate is provided. The method includes: locally showering a gas on a portion of the substrate, wherein the gas has a water vapor pressure higher than an ambient water vapor pressure; and placing the micro device over the portion of the substrate after a part of water in the gas is condensed to form a liquid layer on the portion of the substrate and contacting the micro device with the liquid layer, so that the micro device is gripped by a capillary force produced by the liquid layer and is substantially held in a position within a controllable region on the substrate.

## Claims

### Claim 1

A method for binding a micro device to a substrate, comprising:
locally showering a gas on a portion of the substrate, wherein the gas has a water vapor pressure higher than an ambient water vapor pressure; and
placing the micro device over the portion of the substrate after a part of water in the gas is condensed to form a liquid layer on the portion of the substrate and contacting the micro device with the liquid layer so that the micro device is gripped by a capillary force produced by the liquid layer and is substantially held in a position within a controllable region on the substrate.

### Claim 2 (depends on 1)

The method of claim 1, further comprising adjusting a temperature of the substrate to a selected temperature point.

### Claim 3 (depends on 2)

The method of claim 2, wherein the selected temperature point is a dew point.

### Claim 4 (depends on 2)

The method of claim 2, wherein the adjusting is performed on the portion of the substrate.

### Claim 5 (depends on 2)

The method of claim 2, wherein the adjusting is performed on the entire substrate.

### Claim 6 (depends on 1)

The method of claim 1, wherein the gas consists essentially of nitrogen and water.

### Claim 7 (depends on 1)

The method of claim 1, wherein the contacting is performed within about 10 seconds after the liquid layer is formed on the portion of the substrate.

### Claim 8 (depends on 1)

The method of claim 1, further comprising preparing the substrate with at least one conductive pad thereon.

### Claim 9 (depends on 8)

The method of claim 8, wherein said locally showering is showering the gas on one of the at least one conductive pad on the portion of the substrate.

### Claim 10 (depends on 8)

The method of claim 8, wherein a number of the at least one conductive pad is plural, and said locally showering is showering the gas on at least two of the conductive pads on the portion of the substrate.

### Claim 11 (depends on 8)

The method of claim 8, wherein said controllable region is on the at least one conductive pad.