# US 10,312,215 B2 · Electrode assembly and method for manufacturing same

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- Number: US 10,312,215 B2
- Document ID: US10312215B2
- Status: Granted
- Kind: B2
- Application number: 15/445,549
- Filed: 2017-02-28
- Published: 2017-08-31
- Granted: 2019-06-04
- Earliest claimed: 2016-02-29
- Assignees: Electronics and Telecommunications Research Instit
- Applicants: Electronics and Telecommunications Research Institute
- Inventors: Yong Hee Kim; Sang Don Jung
- Web page: https://patentgrep.com/patent/US10312215B2

## CPC

- H10W 72/072: {of bump connectors}
- A61B 5/0031: {Implanted circuitry}
- A61B 5/686: {Permanently implanted devices, e.g. pacemakers, other stimulators, biochips (A61B5/6861 takes precedence)}
- A61N 1/0472: {Structure-related aspects}
- A61N 1/05: for implantation or insertion into the body, e.g. heart electrode (A61N1/06 takes precedence)
- H10P 95/90: Thermal treatments, e.g. annealing or sintering
- H10W 20/023: {the interconnections being through-semiconductor vias}
- H10W 20/057: {by selectively depositing, e.g. by using selective CVD or plating}
- H10W 20/20: Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- A61B 2562/0209: Special features of electrodes classified in A61B5/24, A61B5/25, A61B5/283, A61B5/291, A61B5/296, A61B5/053
- A61B 2562/125: characterised by the manufacture of electrodes
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- A61B: DIAGNOSIS; SURGERY; IDENTIFICATION (usefulness limited to only animals A61D)
- A61N: ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY (measurement of bioelectric currents A61B; surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body A61B18/00; anaesthetic apparatus in general A61M; incandescent lamps H01K; infrared radiators for heating H05B)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

Provided is an electrode assembly which may be manufactured by providing a first substrate and a second substrate, plasma treating the first substrate, forming an electrode on the first substrate, and thermally compressing the first substrate and the second substrate, with the electrode therebetween, wherein each of the first substrate and the second substrate includes a fluorine-based polymer.

## Claims

### Claim 1

A method for manufacturing an electrode assembly, the method comprising:
providing a first substrate and a second substrate;
plasma treating the first substrate;
forming an electrode on the first substrate;
thermally compressing the first substrate and the second substrate, with the electrode therebetween; and
patterning a portion of the second substrate to thereby form a through-hole that exposes a portion of a top face of the electrode,
wherein each of the first substrate and the second substrate includes a fluorine-based polymer.

### Claim 2 (depends on 1)

The method of claim 1, wherein the patterning of a portion of the second substrate comprises:
forming a protective layer on the top face of the second substrate;
patterning the protective layer to removing a first region;
etching the second substrate corresponding to a patterned and removed portion of the protective layer; and
removing the protective layer.

### Claim 3 (depends on 2)

The method of claim 2, further comprising forming a contact part in the through-hole, wherein the contact part is composed of a porous conductive material.

### Claim 4 (depends on 3)

The method of claim 3, wherein the contact part is formed by using an electro-deposition method.

### Claim 5

An electrode assembly comprising:
a first substrate;
an electrode provided on the first substrate;
a second substrate which is thermally compressed to the first substrate, with the electrode therebetween, wherein each of the first substrate and the second substrate includes a fluorine-based polymer; and
a contact part provided on the electrode, wherein the contact part is porous.

### Claim 6 (depends on 5)

The electrode assembly of claim 5, wherein the fluorine-based polymer comprises at least one among polychlorotrifluoroethylene (PCTFE), perfluoro-2,2-dimethyl-1,3-dioxide (PDD), chlorotrifluoroethylene (CTFE), perfluoro-3-butenyl-vinylether (PBVE), perfluoropropylvinylether (PPVE), polytetrafluoroethylene (PTFE), polyvinylidenefluoride (PVDF), polyvinylfluoride (PVF), vinylidene fluoride (VDF), a PBVE-based homopolymer (Cytop™), and a copolymer including at least two thereof.

### Claim 7 (depends on 6)

The electrode assembly of claim 6, wherein the copolymer is a copolymer of ethylene and CTFE (ECTFE), a copolymer of ethylene and TFE (ETFE), a copolymer of fluorinated ethylene and propylene (FEP), hexafluoropropylene (HFP), a copolymer of TFE and PPVE (PFA), a copolymer of TFE and PDD (Teflon™ AF), tetrafluoroethylene (TFE), or poly(TFE-co-HFP-co-VDF) (THV).

### Claim 8 (depends on 5)

The electrode assembly of claim 5, wherein
the second substrate comprises a through-hole that exposes a portion of a top face of the electrode; and
the contact part is provided in the through-hole.

### Claim 9 (depends on 5)

The electrode assembly of claim 5, wherein the chemical bonding comprises a covalent bonding formed by the first radical and the second radical.